HiSilicon Kirin 980 vs MediaTek Dimensity 800
The HiSilicon Kirin 980 and MediaTek Dimensity 800 are both powerful processors with impressive specifications. Let's compare their key features to determine their differences and strengths.
In terms of CPU cores and architecture, the HiSilicon Kirin 980 boasts a more diverse setup. It includes 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. This combination of high-performance and power-efficient cores allows for a balanced and efficient performance. On the other hand, the MediaTek Dimensity 800 features a simpler setup with 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. While it has a higher clock speed, it lacks the variation in core designs seen in the Kirin 980.
Looking at the instruction set, the HiSilicon Kirin 980 supports ARMv8-A, while the Dimensity 800 supports ARMv8.2-A. This suggests that the Dimensity 800 may have some newer instruction set extensions that could potentially enhance its performance and efficiency.
Both processors are built on a 7 nm lithography, which indicates a similar level of power efficiency and thermal performance. However, the Kirin 980 boasts a higher number of transistors at 6900 million, compared to the Dimensity 800, which does not specify this metric. More transistors generally result in a more capable and powerful processor.
In terms of thermal design power (TDP), the Kirin 980 has a lower TDP of 6 Watts compared to the Dimensity 800's 10 Watts. This suggests that the Kirin 980 may have superior power management and heat dissipation capabilities, potentially resulting in better overall performance and battery efficiency.
Lastly, both processors offer neural processing units (NPU) for enhanced AI and machine learning capabilities. The Kirin 980 comes equipped with the HiSilicon Dual NPU, while the Dimensity 800 features a general NPU.
Overall, the HiSilicon Kirin 980 appears to have a more diverse and advanced architecture, with a higher number of transistors, lower TDP, and the presence of a Dual NPU. However, the MediaTek Dimensity 800 boasts a higher clock speed and potentially newer instruction set extensions. The specific needs and preferences of the user will determine which processor best suits their requirements.
In terms of CPU cores and architecture, the HiSilicon Kirin 980 boasts a more diverse setup. It includes 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. This combination of high-performance and power-efficient cores allows for a balanced and efficient performance. On the other hand, the MediaTek Dimensity 800 features a simpler setup with 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. While it has a higher clock speed, it lacks the variation in core designs seen in the Kirin 980.
Looking at the instruction set, the HiSilicon Kirin 980 supports ARMv8-A, while the Dimensity 800 supports ARMv8.2-A. This suggests that the Dimensity 800 may have some newer instruction set extensions that could potentially enhance its performance and efficiency.
Both processors are built on a 7 nm lithography, which indicates a similar level of power efficiency and thermal performance. However, the Kirin 980 boasts a higher number of transistors at 6900 million, compared to the Dimensity 800, which does not specify this metric. More transistors generally result in a more capable and powerful processor.
In terms of thermal design power (TDP), the Kirin 980 has a lower TDP of 6 Watts compared to the Dimensity 800's 10 Watts. This suggests that the Kirin 980 may have superior power management and heat dissipation capabilities, potentially resulting in better overall performance and battery efficiency.
Lastly, both processors offer neural processing units (NPU) for enhanced AI and machine learning capabilities. The Kirin 980 comes equipped with the HiSilicon Dual NPU, while the Dimensity 800 features a general NPU.
Overall, the HiSilicon Kirin 980 appears to have a more diverse and advanced architecture, with a higher number of transistors, lower TDP, and the presence of a Dual NPU. However, the MediaTek Dimensity 800 boasts a higher clock speed and potentially newer instruction set extensions. The specific needs and preferences of the user will determine which processor best suits their requirements.
CPU cores and architecture
Architecture | 2x 2.6 GHz – Cortex-A76 2x 1.92 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
4x 2.0 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 7 nm | 7 nm |
Number of transistors | 6900 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | HiSilicon Dual NPU | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G76 MP10 | Mali-G57 MP4 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 720 MHz | 650 MHz |
Execution units | 10 | 4 |
Shaders | 160 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3120x1440 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 32MP | 1x 80MP, 1x 32MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30FPS |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.4 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.0 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2018 Quarter 4 | 2020 Quarter 2 |
Partnumber | MT6873, MT6873V | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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