HiSilicon Kirin 980 vs MediaTek Dimensity 720
The HiSilicon Kirin 980 and MediaTek Dimensity 720 are two processors with different specifications and features. Let's take a closer look at each of them.
Starting with the HiSilicon Kirin 980, it is built on a 7nm lithography process and consists of 8 cores. The CPU architecture is divided into three types of cores: 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. This combination allows for efficient multitasking and power distribution. With a total of 6900 million transistors, the Kirin 980 is a capable processor. Moreover, it has a TDP (Thermal Design Power) of 6 Watts, which implies low power consumption. A notable feature of the Kirin 980 is the HiSilicon Dual NPU (Neural Processing Unit), enhancing machine learning capabilities.
On the other hand, the MediaTek Dimensity 720 is also built on a 7nm lithography process and has 8 cores. The CPU architecture consists of 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. The Dimensity 720 offers a suitable performance for most everyday tasks. It has an instruction set of ARMv8.2-A and a TDP of 10 Watts. The processor incorporates an NPU (Neural Processing Unit), enabling AI-related tasks.
Comparing these two processors, there are a few notable differences. In terms of CPU cores, both processors have 8 cores, but the Kirin 980 has a more advanced architecture with a combination of Cortex-A76 and Cortex-A55 cores, providing a more balanced performance. The Dimensity 720, on the other hand, has more Cortex-A76 cores but lacks the same level of diversity in core types.
Additionally, the Kirin 980 has a higher number of transistors, indicating a more complex and capable processor design. It also has a lower TDP, signifying better power efficiency. However, the Dimensity 720 holds its own with an NPU, allowing for AI-powered features.
Overall, the HiSilicon Kirin 980 and MediaTek Dimensity 720 are both competent processors offering powerful performance in their respective categories. The Kirin 980's advanced architecture and HiSilicon Dual NPU make it a strong contender for flagship devices, while the Dimensity 720 offers a balanced performance with the added benefit of an NPU for AI-related tasks.
Starting with the HiSilicon Kirin 980, it is built on a 7nm lithography process and consists of 8 cores. The CPU architecture is divided into three types of cores: 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. This combination allows for efficient multitasking and power distribution. With a total of 6900 million transistors, the Kirin 980 is a capable processor. Moreover, it has a TDP (Thermal Design Power) of 6 Watts, which implies low power consumption. A notable feature of the Kirin 980 is the HiSilicon Dual NPU (Neural Processing Unit), enhancing machine learning capabilities.
On the other hand, the MediaTek Dimensity 720 is also built on a 7nm lithography process and has 8 cores. The CPU architecture consists of 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. The Dimensity 720 offers a suitable performance for most everyday tasks. It has an instruction set of ARMv8.2-A and a TDP of 10 Watts. The processor incorporates an NPU (Neural Processing Unit), enabling AI-related tasks.
Comparing these two processors, there are a few notable differences. In terms of CPU cores, both processors have 8 cores, but the Kirin 980 has a more advanced architecture with a combination of Cortex-A76 and Cortex-A55 cores, providing a more balanced performance. The Dimensity 720, on the other hand, has more Cortex-A76 cores but lacks the same level of diversity in core types.
Additionally, the Kirin 980 has a higher number of transistors, indicating a more complex and capable processor design. It also has a lower TDP, signifying better power efficiency. However, the Dimensity 720 holds its own with an NPU, allowing for AI-powered features.
Overall, the HiSilicon Kirin 980 and MediaTek Dimensity 720 are both competent processors offering powerful performance in their respective categories. The Kirin 980's advanced architecture and HiSilicon Dual NPU make it a strong contender for flagship devices, while the Dimensity 720 offers a balanced performance with the added benefit of an NPU for AI-related tasks.
CPU cores and architecture
Architecture | 2x 2.6 GHz – Cortex-A76 2x 1.92 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 7 nm | 7 nm |
Number of transistors | 6900 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | HiSilicon Dual NPU | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 12 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G76 MP10 | Mali-G57 MP3 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 720 MHz | 850 MHz |
Execution units | 10 | 3 |
Shaders | 160 | |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3120x1440 | 2520x1080@90Hz |
Max camera resolution | 1x 48MP, 2x 32MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30FPS |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.4 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.0 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2018 Quarter 4 | 2020 Quarter 3 |
Partnumber | MT6853V/ZA, MT6853V/NZA | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
HiSilicon Kirin 9000 5G vs MediaTek Helio G95
2
Qualcomm Snapdragon 8 Gen 1 vs MediaTek Helio A25
3
MediaTek Dimensity 6100 Plus vs MediaTek Helio G37
4
Samsung Exynos 9610 vs HiSilicon Kirin 710F
5
Unisoc SC9832E vs Qualcomm Snapdragon 730
6
MediaTek Dimensity 1100 vs Samsung Exynos 850
7
HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 720
8
Qualcomm Snapdragon 835 vs Qualcomm Snapdragon 695
9
Apple A13 Bionic vs MediaTek Helio G35
10
Qualcomm Snapdragon 750G vs Qualcomm Snapdragon 4 Gen 1