HiSilicon Kirin 960 vs Unisoc Tiger T710
The HiSilicon Kirin 960 and the Unisoc Tiger T710 are both processors found in mobile devices, but they differ in specifications and capabilities.
Starting with the HiSilicon Kirin 960, it boasts an architecture of 4x 2.4 GHz Cortex-A73 and 4x 1.8 GHz Cortex-A53 cores, making it a robust and versatile processor. With a total of 8 cores, it allows for smooth multitasking and efficient performance. Furthermore, it utilizes the ARMv8-A instruction set, enabling compatibility with a wide range of software. In terms of manufacturing, the Kirin 960 is built on a 16 nm lithography, resulting in lower power consumption and improved efficiency. With a staggering 4000 million transistors, it excels in handling complex tasks with ease. Additionally, it has a TDP (Thermal Design Power) of 5 Watts, indicating a low power draw.
On the other hand, the Unisoc Tiger T710 also features 8 cores, but with an architecture of 4x 1.8 GHz Cortex-A75 and 4x 1.8 GHz Cortex-A55. While it may seem similar to the Kirin 960, there are some notable differences. The Tiger T710 utilizes the ARMv8.2-A instruction set, offering potential improvements in performance and efficiency. It is manufactured using a 12 nm lithography, which allows for a smaller chip size and potential power savings. One unique feature of the Tiger T710 is its dual NPU (Neural Processing Unit), which enables accelerated AI tasks and enhances overall performance.
In conclusion, both the HiSilicon Kirin 960 and the Unisoc Tiger T710 are powerful processors with their own strengths. The Kirin 960 excels in its higher clock speeds and larger number of transistors, while the Tiger T710 benefits from its newer instruction set and dual NPU. When choosing between these processors, it ultimately depends on the specific requirements and priorities of the device or application.
Starting with the HiSilicon Kirin 960, it boasts an architecture of 4x 2.4 GHz Cortex-A73 and 4x 1.8 GHz Cortex-A53 cores, making it a robust and versatile processor. With a total of 8 cores, it allows for smooth multitasking and efficient performance. Furthermore, it utilizes the ARMv8-A instruction set, enabling compatibility with a wide range of software. In terms of manufacturing, the Kirin 960 is built on a 16 nm lithography, resulting in lower power consumption and improved efficiency. With a staggering 4000 million transistors, it excels in handling complex tasks with ease. Additionally, it has a TDP (Thermal Design Power) of 5 Watts, indicating a low power draw.
On the other hand, the Unisoc Tiger T710 also features 8 cores, but with an architecture of 4x 1.8 GHz Cortex-A75 and 4x 1.8 GHz Cortex-A55. While it may seem similar to the Kirin 960, there are some notable differences. The Tiger T710 utilizes the ARMv8.2-A instruction set, offering potential improvements in performance and efficiency. It is manufactured using a 12 nm lithography, which allows for a smaller chip size and potential power savings. One unique feature of the Tiger T710 is its dual NPU (Neural Processing Unit), which enables accelerated AI tasks and enhances overall performance.
In conclusion, both the HiSilicon Kirin 960 and the Unisoc Tiger T710 are powerful processors with their own strengths. The Kirin 960 excels in its higher clock speeds and larger number of transistors, while the Tiger T710 benefits from its newer instruction set and dual NPU. When choosing between these processors, it ultimately depends on the specific requirements and priorities of the device or application.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
4x 1.8 GHz – Cortex-A75 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 12 nm |
Number of transistors | 4000 million | |
TDP | 5 Watt | |
Neural Processing | Dual NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 8 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 1866 MHz |
Memory-bus | 2x32 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G71 MP8 | Imagination PowerVR GM9446 |
GPU Architecture | Mali Bifrost | PowerVR Rogue |
GPU frequency | 900 MHz | 800 MHz |
Execution units | 8 | |
Shaders | 128 | |
DirectX | 11.3 | |
OpenCL API | 1.2 | 4.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.1 |
Camera, Video, Display
Max camera resolution | 1x 20MP, 2x 12MP | 1x 24MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2016 October | 2019 |
Partnumber | Hi3660 | T710 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
Popular comparisons:
1
MediaTek Dimensity 9300 vs MediaTek Dimensity 7020
2
MediaTek Dimensity 7200 vs Qualcomm Snapdragon 845
3
Qualcomm Snapdragon 6 Gen 3 vs Unisoc Tiger T618
4
HiSilicon Kirin 710 vs Qualcomm Snapdragon 6s Gen 3
5
MediaTek Helio P90 vs Qualcomm Snapdragon 7s Gen 2
6
Samsung Exynos 1480 vs Qualcomm Snapdragon 450
7
Unisoc Tiger T612 vs Qualcomm Snapdragon 730G
8
Qualcomm Snapdragon 765G vs Apple A11 Bionic
9
HiSilicon Kirin 659 vs Samsung Exynos 2500
10
Qualcomm Snapdragon 435 vs Samsung Exynos 850