HiSilicon Kirin 960 vs Unisoc Tiger T700
When comparing the specifications of the HiSilicon Kirin 960 and Unisoc Tiger T700 processors, several key differences arise.
In terms of CPU cores and architecture, the HiSilicon Kirin 960 features 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores, while the Unisoc Tiger T700 includes 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A5 cores. The Kirin 960 offers a more balanced distribution of high-performance and power-efficient cores, while the Tiger T700 focuses on a higher number of lower-performance cores.
Regarding instruction set, the Kirin 960 supports ARMv8-A, which is the 8th generation of the ARM architecture, while the Tiger T700 supports ARMv8.2-A, a slightly newer version. Both processors have the advantage of utilizing the ARM instruction set, which ensures compatibility with a wide range of software.
In terms of lithography, the Kirin 960 is built on a 16 nm process, whereas the Tiger T700 utilizes a more advanced 12 nm lithography. A smaller lithography often results in improved power efficiency and better performance, as it allows for more transistors to be packed into a smaller area.
Speaking of transistors, the Kirin 960 boasts 4000 million transistors, while no specific information is provided regarding the Tiger T700. This suggests that the Kirin 960 has a more complex and potentially more powerful architecture, although the precise performance implications are difficult to determine without further details.
Finally, power consumption, as represented by the thermal design power (TDP), is another differentiating factor. The Kirin 960 has a TDP of 5 Watts, indicating its focus on power efficiency. In contrast, the Tiger T700 has a higher TDP of 10 Watts, suggesting that it may consume more power.
Overall, the HiSilicon Kirin 960 and Unisoc Tiger T700 processors demonstrate distinct characteristics. While the Kirin 960 offers a more balanced combination of high-performance and power-efficiency cores, boasting a higher transistor count, the Tiger T700 focuses on a larger number of lower-performance cores and utilizes a more advanced lithography. The choice between these processors depends on the specific requirements of the intended applications.
In terms of CPU cores and architecture, the HiSilicon Kirin 960 features 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores, while the Unisoc Tiger T700 includes 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A5 cores. The Kirin 960 offers a more balanced distribution of high-performance and power-efficient cores, while the Tiger T700 focuses on a higher number of lower-performance cores.
Regarding instruction set, the Kirin 960 supports ARMv8-A, which is the 8th generation of the ARM architecture, while the Tiger T700 supports ARMv8.2-A, a slightly newer version. Both processors have the advantage of utilizing the ARM instruction set, which ensures compatibility with a wide range of software.
In terms of lithography, the Kirin 960 is built on a 16 nm process, whereas the Tiger T700 utilizes a more advanced 12 nm lithography. A smaller lithography often results in improved power efficiency and better performance, as it allows for more transistors to be packed into a smaller area.
Speaking of transistors, the Kirin 960 boasts 4000 million transistors, while no specific information is provided regarding the Tiger T700. This suggests that the Kirin 960 has a more complex and potentially more powerful architecture, although the precise performance implications are difficult to determine without further details.
Finally, power consumption, as represented by the thermal design power (TDP), is another differentiating factor. The Kirin 960 has a TDP of 5 Watts, indicating its focus on power efficiency. In contrast, the Tiger T700 has a higher TDP of 10 Watts, suggesting that it may consume more power.
Overall, the HiSilicon Kirin 960 and Unisoc Tiger T700 processors demonstrate distinct characteristics. While the Kirin 960 offers a more balanced combination of high-performance and power-efficiency cores, boasting a higher transistor count, the Tiger T700 focuses on a larger number of lower-performance cores and utilizes a more advanced lithography. The choice between these processors depends on the specific requirements of the intended applications.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A5 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 12 nm |
Number of transistors | 4000 million | |
TDP | 5 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 4 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 1866 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G71 MP8 | Mali-G52 MP2 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 900 MHz | 850 MHz |
Execution units | 8 | 2 |
Shaders | 128 | 32 |
DirectX | 11.3 | 11 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2400x1080 | |
Max camera resolution | 1x 20MP, 2x 12MP | 1x 48MP |
Max Video Capture | 4K@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2016 October | 2021 March |
Partnumber | Hi3660 | T700 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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