HiSilicon Kirin 960 vs Unisoc Tiger T610
The HiSilicon Kirin 960 and the Unisoc Tiger T610 are both processors with their own unique specifications. Let's compare them based on their specifications.
In terms of CPU cores and architecture, the Kirin 960 features a quad-core Cortex-A73 clocked at 2.4 GHz and a quad-core Cortex-A53 clocked at 1.8 GHz. On the other hand, the Tiger T610 has a dual-core Cortex-A75 clocked at 1.8 GHz and a hexa-core Cortex-A55 also clocked at 1.8 GHz. While the Kirin 960 has a higher clock speed on its quad-core Cortex-A73, the Tiger T610 features the newer Cortex-A75 architecture for its dual-core.
Both processors have eight cores, allowing for multitasking and efficient performance. However, it is important to note that the Kirin 960 uses ARMv8-A instruction set, while the Tiger T610 uses the newer ARMv8.2-A instruction set. This indicates that the Tiger T610 may have better compatibility with newer software and potentially optimized performance.
Regarding lithography, the Kirin 960 is manufactured using a 16 nm process, while the Tiger T610 utilizes a more advanced 12 nm process. A smaller lithography generally results in better power efficiency and improved performance.
In terms of transistor count, the Kirin 960 has 4000 million transistors, whereas the Tiger T610 does not provide specific information on transistor count. While the transistor count may not be the sole determining factor for performance, a higher transistor count can indicate more advanced technology and potentially better performance.
Finally, the Kirin 960 has a TDP (Thermal Design Power) of 5 Watts, while the Tiger T610 has a TDP of 10 Watts. A lower TDP generally implies better power efficiency, which can lead to longer battery life and reduced heat generation.
In conclusion, both processors have their own strengths and weaknesses. The Kirin 960 boasts a higher clock speed on its quad-core Cortex-A73 and a lower TDP, while the Tiger T610 features a newer Cortex-A75 architecture, a more advanced manufacturing process, and potentially better software compatibility. Ultimately, the choice between these processors will depend on the specific needs and preferences of the user.
In terms of CPU cores and architecture, the Kirin 960 features a quad-core Cortex-A73 clocked at 2.4 GHz and a quad-core Cortex-A53 clocked at 1.8 GHz. On the other hand, the Tiger T610 has a dual-core Cortex-A75 clocked at 1.8 GHz and a hexa-core Cortex-A55 also clocked at 1.8 GHz. While the Kirin 960 has a higher clock speed on its quad-core Cortex-A73, the Tiger T610 features the newer Cortex-A75 architecture for its dual-core.
Both processors have eight cores, allowing for multitasking and efficient performance. However, it is important to note that the Kirin 960 uses ARMv8-A instruction set, while the Tiger T610 uses the newer ARMv8.2-A instruction set. This indicates that the Tiger T610 may have better compatibility with newer software and potentially optimized performance.
Regarding lithography, the Kirin 960 is manufactured using a 16 nm process, while the Tiger T610 utilizes a more advanced 12 nm process. A smaller lithography generally results in better power efficiency and improved performance.
In terms of transistor count, the Kirin 960 has 4000 million transistors, whereas the Tiger T610 does not provide specific information on transistor count. While the transistor count may not be the sole determining factor for performance, a higher transistor count can indicate more advanced technology and potentially better performance.
Finally, the Kirin 960 has a TDP (Thermal Design Power) of 5 Watts, while the Tiger T610 has a TDP of 10 Watts. A lower TDP generally implies better power efficiency, which can lead to longer battery life and reduced heat generation.
In conclusion, both processors have their own strengths and weaknesses. The Kirin 960 boasts a higher clock speed on its quad-core Cortex-A73 and a lower TDP, while the Tiger T610 features a newer Cortex-A75 architecture, a more advanced manufacturing process, and potentially better software compatibility. Ultimately, the choice between these processors will depend on the specific needs and preferences of the user.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 12 nm |
Number of transistors | 4000 million | |
TDP | 5 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 6 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 1600 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G71 MP8 | Mali-G52 MP2 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 900 MHz | 614.4 MHz |
Execution units | 8 | 2 |
Shaders | 128 | 32 |
DirectX | 11.3 | 11 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2400x1080 | |
Max camera resolution | 1x 20MP, 2x 12MP | 1x 32MP |
Max Video Capture | 4K@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2016 October | 2019 June |
Partnumber | Hi3660 | T610 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Qualcomm Snapdragon 695 vs MediaTek Helio G36
2
Qualcomm Snapdragon 820 vs Qualcomm Snapdragon 675
3
Qualcomm Snapdragon 460 vs Unisoc SC9863A
4
MediaTek Dimensity 810 vs Qualcomm Snapdragon 480
5
HiSilicon Kirin 930 vs Apple A12 Bionic
6
Qualcomm Snapdragon 8 Gen 2 vs MediaTek Dimensity 8200
7
Apple A10X Fusion vs Unisoc SC7731E
8
Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 1000
9
MediaTek Dimensity 1000L vs MediaTek Dimensity 900
10
HiSilicon Kirin 955 vs MediaTek Dimensity 1300