HiSilicon Kirin 960 vs Unisoc Tanggula T770 5G

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The HiSilicon Kirin 960 and Unisoc Tanggula T770 5G are two processors with different specifications.

Starting with the HiSilicon Kirin 960, it features a 16nm lithography and offers 8 CPU cores. The architecture is divided into four Cortex-A73 cores clocked at 2.4 GHz and four Cortex-A53 cores clocked at 1.8 GHz. With an ARMv8-A instruction set, this processor boasts a total of 4000 million transistors. Its TDP is set at 5 Watts, providing efficient power consumption.

On the other hand, the Unisoc Tanggula T770 5G offers an advanced architecture with an even smaller 6nm lithography. It also sports 8 CPU cores, consisting of one Cortex-A76 core clocked at 2.5 GHz, three Cortex-A76 cores clocked at 2.2 GHz, and four Cortex-A55 cores clocked at 2.0 GHz. With an ARMv8.2-A instruction set, this processor demonstrates an enhanced level of performance. In addition, it includes Neural Processing Unit (NPU) functionality for improved AI capabilities. Like the Kirin 960, the Tanggula T770 5G operates at a TDP of 5 Watts.

In terms of comparisons, both processors have 8 CPU cores, allowing for efficient multitasking and smooth performance. However, the architectures differ, with the Tanggula T770 5G offering a more powerful setup. Its Cortex-A76 cores are clocked higher, providing increased processing speed. Furthermore, the inclusion of Cortex-A55 cores ensures optimal performance in lower-power tasks. Additionally, the Tanggula T770 5G's utilization of a 6nm lithography indicates a more advanced manufacturing process, potentially resulting in improved power efficiency and thermal management.

The Kirin 960, while not as advanced as the Tanggula T770 5G, still offers competitive specifications. Its 16nm lithography and ARMv8-A instruction set maintain efficiency and reliability. However, it may not achieve the same level of performance as the Tanggula T770 5G due to its older architecture and lower clock speeds.

In conclusion, while the HiSilicon Kirin 960 and Unisoc Tanggula T770 5G share some similarities in terms of core count and TDP, the Tanggula T770 5G outshines the Kirin 960 with its more advanced architecture, higher clock speeds, and NPU capabilities.

CPU cores and architecture

Architecture 4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
1x 2.5 GHz – Cortex-A76
3x 2.2 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 16 nm 6 nm
Number of transistors 4000 million
TDP 5 Watt 5 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 32 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G71 MP8 Mali-G57 MP6
GPU Architecture Bifrost Valhall
GPU frequency 900 MHz 850 MHz
Execution units 8 6
Shaders 128 96
DirectX 11.3 12
OpenCL API 1.2 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2160x1080@120Hz
Max camera resolution 1x 20MP, 2x 12MP 1x 108MP, 2x 24MP
Max Video Capture 4K@30fps FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.7 Gbps
Peak Upload Speed 0.15 Gbps 1.5 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.0
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2016 October 2021 February
Partnumber Hi3660 T770, Tiger T7520
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 960
253892
Tanggula T770 5G
342190

GeekBench 6 Single-Core

Score
Kirin 960
382
Tanggula T770 5G
659

GeekBench 6 Multi-Core

Score
Kirin 960
1544
Tanggula T770 5G
2635