HiSilicon Kirin 960 vs Unisoc Tanggula T770 5G
The HiSilicon Kirin 960 and Unisoc Tanggula T770 5G are two processors with different specifications.
Starting with the HiSilicon Kirin 960, it features a 16nm lithography and offers 8 CPU cores. The architecture is divided into four Cortex-A73 cores clocked at 2.4 GHz and four Cortex-A53 cores clocked at 1.8 GHz. With an ARMv8-A instruction set, this processor boasts a total of 4000 million transistors. Its TDP is set at 5 Watts, providing efficient power consumption.
On the other hand, the Unisoc Tanggula T770 5G offers an advanced architecture with an even smaller 6nm lithography. It also sports 8 CPU cores, consisting of one Cortex-A76 core clocked at 2.5 GHz, three Cortex-A76 cores clocked at 2.2 GHz, and four Cortex-A55 cores clocked at 2.0 GHz. With an ARMv8.2-A instruction set, this processor demonstrates an enhanced level of performance. In addition, it includes Neural Processing Unit (NPU) functionality for improved AI capabilities. Like the Kirin 960, the Tanggula T770 5G operates at a TDP of 5 Watts.
In terms of comparisons, both processors have 8 CPU cores, allowing for efficient multitasking and smooth performance. However, the architectures differ, with the Tanggula T770 5G offering a more powerful setup. Its Cortex-A76 cores are clocked higher, providing increased processing speed. Furthermore, the inclusion of Cortex-A55 cores ensures optimal performance in lower-power tasks. Additionally, the Tanggula T770 5G's utilization of a 6nm lithography indicates a more advanced manufacturing process, potentially resulting in improved power efficiency and thermal management.
The Kirin 960, while not as advanced as the Tanggula T770 5G, still offers competitive specifications. Its 16nm lithography and ARMv8-A instruction set maintain efficiency and reliability. However, it may not achieve the same level of performance as the Tanggula T770 5G due to its older architecture and lower clock speeds.
In conclusion, while the HiSilicon Kirin 960 and Unisoc Tanggula T770 5G share some similarities in terms of core count and TDP, the Tanggula T770 5G outshines the Kirin 960 with its more advanced architecture, higher clock speeds, and NPU capabilities.
Starting with the HiSilicon Kirin 960, it features a 16nm lithography and offers 8 CPU cores. The architecture is divided into four Cortex-A73 cores clocked at 2.4 GHz and four Cortex-A53 cores clocked at 1.8 GHz. With an ARMv8-A instruction set, this processor boasts a total of 4000 million transistors. Its TDP is set at 5 Watts, providing efficient power consumption.
On the other hand, the Unisoc Tanggula T770 5G offers an advanced architecture with an even smaller 6nm lithography. It also sports 8 CPU cores, consisting of one Cortex-A76 core clocked at 2.5 GHz, three Cortex-A76 cores clocked at 2.2 GHz, and four Cortex-A55 cores clocked at 2.0 GHz. With an ARMv8.2-A instruction set, this processor demonstrates an enhanced level of performance. In addition, it includes Neural Processing Unit (NPU) functionality for improved AI capabilities. Like the Kirin 960, the Tanggula T770 5G operates at a TDP of 5 Watts.
In terms of comparisons, both processors have 8 CPU cores, allowing for efficient multitasking and smooth performance. However, the architectures differ, with the Tanggula T770 5G offering a more powerful setup. Its Cortex-A76 cores are clocked higher, providing increased processing speed. Furthermore, the inclusion of Cortex-A55 cores ensures optimal performance in lower-power tasks. Additionally, the Tanggula T770 5G's utilization of a 6nm lithography indicates a more advanced manufacturing process, potentially resulting in improved power efficiency and thermal management.
The Kirin 960, while not as advanced as the Tanggula T770 5G, still offers competitive specifications. Its 16nm lithography and ARMv8-A instruction set maintain efficiency and reliability. However, it may not achieve the same level of performance as the Tanggula T770 5G due to its older architecture and lower clock speeds.
In conclusion, while the HiSilicon Kirin 960 and Unisoc Tanggula T770 5G share some similarities in terms of core count and TDP, the Tanggula T770 5G outshines the Kirin 960 with its more advanced architecture, higher clock speeds, and NPU capabilities.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 6 nm |
Number of transistors | 4000 million | |
TDP | 5 Watt | 5 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 32 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G71 MP8 | Mali-G57 MP6 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 900 MHz | 850 MHz |
Execution units | 8 | 6 |
Shaders | 128 | 96 |
DirectX | 11.3 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2160x1080@120Hz | |
Max camera resolution | 1x 20MP, 2x 12MP | 1x 108MP, 2x 24MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.7 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.5 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2016 October | 2021 February |
Partnumber | Hi3660 | T770, Tiger T7520 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Qualcomm Snapdragon 678 vs MediaTek Helio G37
2
MediaTek Helio G90T vs Samsung Exynos 2200
3
MediaTek Helio G70 vs MediaTek Helio G35
4
MediaTek Dimensity 8000 vs Qualcomm Snapdragon 636
5
MediaTek Dimensity 6100 Plus vs Qualcomm Snapdragon 855
6
Samsung Exynos 9609 vs Qualcomm Snapdragon 690
7
Samsung Exynos 8890 vs HiSilicon Kirin 985 5G
8
Qualcomm Snapdragon 480 vs MediaTek Helio P90
9
MediaTek Dimensity 810 vs Samsung Exynos 9825
10
Samsung Exynos 7884B vs Qualcomm Snapdragon 820