HiSilicon Kirin 960 vs MediaTek Dimensity 930
The HiSilicon Kirin 960 and MediaTek Dimensity 930 are two processors that offer impressive specifications. Let's compare these processors based on their specifications.
In terms of CPU cores and architecture, the Kirin 960 features 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the Dimensity 930 incorporates 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Both processors have 8 cores, but the Dimensity 930 has a slightly higher clock speed, which may lead to better performance.
When it comes to the instruction set, the Kirin 960 uses ARMv8-A, while the Dimensity 930 utilizes ARMv8.2-A. The difference in the instruction set suggests that the Dimensity 930 may have more advanced features and capabilities compared to the Kirin 960.
In terms of lithography, the Kirin 960 is manufactured on a 16 nm process, while the Dimensity 930 is built using a more advanced 6 nm process. A smaller lithography generally indicates better power efficiency and performance.
The Kirin 960 has a TDP (Thermal Design Power) of 5 Watts, while the Dimensity 930 has a slightly higher TDP of 10 Watts. This suggests that the Dimensity 930 may consume more power, but it could also potentially deliver better performance.
One additional feature of the Dimensity 930 is its Neural Processing Unit (NPU). This specialized component is designed to handle artificial intelligence tasks efficiently, which can result in improved AI capabilities and features on devices using this processor.
Overall, both the HiSilicon Kirin 960 and MediaTek Dimensity 930 offer powerful specifications. The Dimensity 930 stands out with its newer lithography, higher clock speed, and the addition of an NPU. However, the Kirin 960 still provides a solid performance with its quad-core high-performance and energy-efficient cores. Ultimately, the choice between these processors would depend on the specific requirements and preferences of the user.
In terms of CPU cores and architecture, the Kirin 960 features 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the Dimensity 930 incorporates 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Both processors have 8 cores, but the Dimensity 930 has a slightly higher clock speed, which may lead to better performance.
When it comes to the instruction set, the Kirin 960 uses ARMv8-A, while the Dimensity 930 utilizes ARMv8.2-A. The difference in the instruction set suggests that the Dimensity 930 may have more advanced features and capabilities compared to the Kirin 960.
In terms of lithography, the Kirin 960 is manufactured on a 16 nm process, while the Dimensity 930 is built using a more advanced 6 nm process. A smaller lithography generally indicates better power efficiency and performance.
The Kirin 960 has a TDP (Thermal Design Power) of 5 Watts, while the Dimensity 930 has a slightly higher TDP of 10 Watts. This suggests that the Dimensity 930 may consume more power, but it could also potentially deliver better performance.
One additional feature of the Dimensity 930 is its Neural Processing Unit (NPU). This specialized component is designed to handle artificial intelligence tasks efficiently, which can result in improved AI capabilities and features on devices using this processor.
Overall, both the HiSilicon Kirin 960 and MediaTek Dimensity 930 offer powerful specifications. The Dimensity 930 stands out with its newer lithography, higher clock speed, and the addition of an NPU. However, the Kirin 960 still provides a solid performance with its quad-core high-performance and energy-efficient cores. Ultimately, the choice between these processors would depend on the specific requirements and preferences of the user.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 6 nm |
Number of transistors | 4000 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G71 MP8 | Imagination PowerVR BXM-8-256 |
GPU Architecture | Bifrost | Rogue |
GPU frequency | 900 MHz | 800 MHz |
Execution units | 8 | |
Shaders | 128 | |
DirectX | 11.3 | 12 |
OpenCL API | 1.2 | 3.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 20MP, 2x 12MP | 1x 108MP, 1x 64MP |
Max Video Capture | 4K@30fps | 2K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2016 October | 2022 Quarter 3 |
Partnumber | Hi3660 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
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