HiSilicon Kirin 960 vs MediaTek Dimensity 820
The HiSilicon Kirin 960 and the MediaTek Dimensity 820 are both powerful processors, but they have some differences in their specifications.
In terms of CPU cores and architecture, the Kirin 960 features four Cortex-A73 cores clocked at 2.4 GHz and four Cortex-A53 cores clocked at 1.8 GHz. On the other hand, the Dimensity 820 has four Cortex-A76 cores clocked at 2.6 GHz and four Cortex-A55 cores clocked at 2.0 GHz. This means that the Dimensity 820 has a higher clock speed for its high-performance cores, which may provide better processing power.
Both processors have eight cores and support the ARMv8-A instruction set. However, the Dimensity 820 is based on the newer ARMv8.2-A instruction set, which may result in improved performance and efficiency compared to the Kirin 960.
In terms of manufacturing process, the Kirin 960 is built on a 16 nm lithography, while the Dimensity 820 is built on a more advanced 7 nm lithography. This means that the Dimensity 820 is likely to be more power-efficient and may generate less heat compared to the Kirin 960.
When it comes to power consumption, the Kirin 960 has a lower thermal design power (TDP) of 5 Watts, while the Dimensity 820 has a TDP of 10 Watts. This indicates that the Kirin 960 may be more power-efficient and suitable for devices where battery life is a significant consideration.
Additionally, the Dimensity 820 features a Neural Processing Unit (NPU), which is designed to accelerate artificial intelligence (AI) tasks. This can result in improved performance in AI-related applications compared to the Kirin 960.
Overall, the MediaTek Dimensity 820 appears to have a slight edge over the HiSilicon Kirin 960 in terms of performance, efficiency, and AI capabilities. However, the specific requirements and priorities of a device would determine which processor is better suited for a particular use-case.
In terms of CPU cores and architecture, the Kirin 960 features four Cortex-A73 cores clocked at 2.4 GHz and four Cortex-A53 cores clocked at 1.8 GHz. On the other hand, the Dimensity 820 has four Cortex-A76 cores clocked at 2.6 GHz and four Cortex-A55 cores clocked at 2.0 GHz. This means that the Dimensity 820 has a higher clock speed for its high-performance cores, which may provide better processing power.
Both processors have eight cores and support the ARMv8-A instruction set. However, the Dimensity 820 is based on the newer ARMv8.2-A instruction set, which may result in improved performance and efficiency compared to the Kirin 960.
In terms of manufacturing process, the Kirin 960 is built on a 16 nm lithography, while the Dimensity 820 is built on a more advanced 7 nm lithography. This means that the Dimensity 820 is likely to be more power-efficient and may generate less heat compared to the Kirin 960.
When it comes to power consumption, the Kirin 960 has a lower thermal design power (TDP) of 5 Watts, while the Dimensity 820 has a TDP of 10 Watts. This indicates that the Kirin 960 may be more power-efficient and suitable for devices where battery life is a significant consideration.
Additionally, the Dimensity 820 features a Neural Processing Unit (NPU), which is designed to accelerate artificial intelligence (AI) tasks. This can result in improved performance in AI-related applications compared to the Kirin 960.
Overall, the MediaTek Dimensity 820 appears to have a slight edge over the HiSilicon Kirin 960 in terms of performance, efficiency, and AI capabilities. However, the specific requirements and priorities of a device would determine which processor is better suited for a particular use-case.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
4x 2.6 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 7 nm |
Number of transistors | 4000 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G71 MP8 | Mali-G57 MP5 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 900 MHz | 650 MHz |
Execution units | 8 | 5 |
Shaders | 128 | 80 |
DirectX | 11.3 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 20MP, 2x 12MP | 1x 80MP, 1x 32MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2016 October | 2020 May |
Partnumber | Hi3660 | MT6875 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Qualcomm Snapdragon 460 vs Unisoc Tiger T710
2
Apple A10X Fusion vs Unisoc SC7731E
3
Unisoc Tiger T610 vs Qualcomm Snapdragon 6 Gen 1
4
MediaTek Dimensity 6080 vs Samsung Exynos 7880
5
HiSilicon Kirin 710F vs MediaTek Helio P65
6
MediaTek Dimensity 9000 vs Qualcomm Snapdragon 870
7
Qualcomm Snapdragon 8 Gen 2 vs Apple A10 Fusion
8
MediaTek Dimensity 9200 vs MediaTek Helio G70
9
Qualcomm Snapdragon 765G vs Google Tensor G2
10
Samsung Exynos 2100 vs Samsung Exynos 7884B