HiSilicon Kirin 960 vs MediaTek Dimensity 810

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The HiSilicon Kirin 960 and MediaTek Dimensity 810 are two processors that offer different specifications and features. Let's compare them based on their specifications.

First, let's look at their CPU cores and architecture. The HiSilicon Kirin 960 has an architecture of 4x 2.4 GHz Cortex-A73 and 4x 1.8 GHz Cortex-A53. This means it has a combination of high-performance and power-efficient cores. On the other hand, the MediaTek Dimensity 810 features 2x 2.4 GHz Cortex-A76 and 6x 2.0 GHz Cortex-A55 cores. It also has a combination of high-performance and power-efficient cores, but with a different distribution.

Next, let's consider the number of cores. Both processors have 8 cores, which allows for multitasking and efficient performance.

In terms of instruction set, the HiSilicon Kirin 960 supports ARMv8-A, while the MediaTek Dimensity 810 supports the newer ARMv8.2-A instruction set. This means the Dimensity 810 may offer better compatibility with newer software and technologies.

The lithography of a processor plays a role in its power efficiency and performance. The HiSilicon Kirin 960 is built on a 16 nm process, while the MediaTek Dimensity 810 is built on a more advanced 6 nm process. Generally, a smaller lithography results in better power efficiency and performance.

When it comes to the number of transistors, the MediaTek Dimensity 810 offers a higher count of 12000 million compared to 4000 million in the HiSilicon Kirin 960. More transistors generally indicate improved processing capabilities and efficiency.

In terms of power consumption, the HiSilicon Kirin 960 has a lower TDP (Thermal Design Power) of 5 Watts compared to 8 Watts in the MediaTek Dimensity 810. This suggests that the Kirin 960 may offer better power efficiency.

Additionally, the MediaTek Dimensity 810 boasts a Neural Processing Unit (NPU), which can enhance AI capabilities and improve tasks that involve machine learning.

In conclusion, while both processors offer 8 cores and a combination of high-performance and power-efficient cores, the MediaTek Dimensity 810 demonstrates advancements in terms of lithography, number of transistors, and instruction set support. However, the HiSilicon Kirin 960 has a lower TDP and may still provide efficient performance. The inclusion of an NPU in the Dimensity 810 gives it an advantage in AI-related tasks. Ultimately, the choice between the two processors will depend on the specific needs and priorities of the user.

CPU cores and architecture

Architecture 4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
2x 2.4 GHz – Cortex-A76
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 16 nm 6 nm
Number of transistors 4000 million 12000 million
TDP 5 Watt 8 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 12 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G71 MP8 Mali-G57 MP2
GPU Architecture Bifrost Valhall
GPU frequency 900 MHz 950 MHz
Execution units 8 2
Shaders 128 32
DirectX 11.3 12
OpenCL API 1.2 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2520x1080@120Hz
Max camera resolution 1x 20MP, 2x 12MP 1x 64MP, 2x 16MP
Max Video Capture 4K@30fps 2K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2016 October 2021 Quarter 3
Partnumber Hi3660 MT6833V/PNZA, MT6833P
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 960
253892
Dimensity 810
356915

GeekBench 6 Single-Core

Score
Kirin 960
382
Dimensity 810
584

GeekBench 6 Multi-Core

Score
Kirin 960
1544
Dimensity 810
1662