HiSilicon Kirin 960 vs MediaTek Dimensity 810
The HiSilicon Kirin 960 and MediaTek Dimensity 810 are two processors that offer different specifications and features. Let's compare them based on their specifications.
First, let's look at their CPU cores and architecture. The HiSilicon Kirin 960 has an architecture of 4x 2.4 GHz Cortex-A73 and 4x 1.8 GHz Cortex-A53. This means it has a combination of high-performance and power-efficient cores. On the other hand, the MediaTek Dimensity 810 features 2x 2.4 GHz Cortex-A76 and 6x 2.0 GHz Cortex-A55 cores. It also has a combination of high-performance and power-efficient cores, but with a different distribution.
Next, let's consider the number of cores. Both processors have 8 cores, which allows for multitasking and efficient performance.
In terms of instruction set, the HiSilicon Kirin 960 supports ARMv8-A, while the MediaTek Dimensity 810 supports the newer ARMv8.2-A instruction set. This means the Dimensity 810 may offer better compatibility with newer software and technologies.
The lithography of a processor plays a role in its power efficiency and performance. The HiSilicon Kirin 960 is built on a 16 nm process, while the MediaTek Dimensity 810 is built on a more advanced 6 nm process. Generally, a smaller lithography results in better power efficiency and performance.
When it comes to the number of transistors, the MediaTek Dimensity 810 offers a higher count of 12000 million compared to 4000 million in the HiSilicon Kirin 960. More transistors generally indicate improved processing capabilities and efficiency.
In terms of power consumption, the HiSilicon Kirin 960 has a lower TDP (Thermal Design Power) of 5 Watts compared to 8 Watts in the MediaTek Dimensity 810. This suggests that the Kirin 960 may offer better power efficiency.
Additionally, the MediaTek Dimensity 810 boasts a Neural Processing Unit (NPU), which can enhance AI capabilities and improve tasks that involve machine learning.
In conclusion, while both processors offer 8 cores and a combination of high-performance and power-efficient cores, the MediaTek Dimensity 810 demonstrates advancements in terms of lithography, number of transistors, and instruction set support. However, the HiSilicon Kirin 960 has a lower TDP and may still provide efficient performance. The inclusion of an NPU in the Dimensity 810 gives it an advantage in AI-related tasks. Ultimately, the choice between the two processors will depend on the specific needs and priorities of the user.
First, let's look at their CPU cores and architecture. The HiSilicon Kirin 960 has an architecture of 4x 2.4 GHz Cortex-A73 and 4x 1.8 GHz Cortex-A53. This means it has a combination of high-performance and power-efficient cores. On the other hand, the MediaTek Dimensity 810 features 2x 2.4 GHz Cortex-A76 and 6x 2.0 GHz Cortex-A55 cores. It also has a combination of high-performance and power-efficient cores, but with a different distribution.
Next, let's consider the number of cores. Both processors have 8 cores, which allows for multitasking and efficient performance.
In terms of instruction set, the HiSilicon Kirin 960 supports ARMv8-A, while the MediaTek Dimensity 810 supports the newer ARMv8.2-A instruction set. This means the Dimensity 810 may offer better compatibility with newer software and technologies.
The lithography of a processor plays a role in its power efficiency and performance. The HiSilicon Kirin 960 is built on a 16 nm process, while the MediaTek Dimensity 810 is built on a more advanced 6 nm process. Generally, a smaller lithography results in better power efficiency and performance.
When it comes to the number of transistors, the MediaTek Dimensity 810 offers a higher count of 12000 million compared to 4000 million in the HiSilicon Kirin 960. More transistors generally indicate improved processing capabilities and efficiency.
In terms of power consumption, the HiSilicon Kirin 960 has a lower TDP (Thermal Design Power) of 5 Watts compared to 8 Watts in the MediaTek Dimensity 810. This suggests that the Kirin 960 may offer better power efficiency.
Additionally, the MediaTek Dimensity 810 boasts a Neural Processing Unit (NPU), which can enhance AI capabilities and improve tasks that involve machine learning.
In conclusion, while both processors offer 8 cores and a combination of high-performance and power-efficient cores, the MediaTek Dimensity 810 demonstrates advancements in terms of lithography, number of transistors, and instruction set support. However, the HiSilicon Kirin 960 has a lower TDP and may still provide efficient performance. The inclusion of an NPU in the Dimensity 810 gives it an advantage in AI-related tasks. Ultimately, the choice between the two processors will depend on the specific needs and priorities of the user.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 6 nm |
Number of transistors | 4000 million | 12000 million |
TDP | 5 Watt | 8 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G71 MP8 | Mali-G57 MP2 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 900 MHz | 950 MHz |
Execution units | 8 | 2 |
Shaders | 128 | 32 |
DirectX | 11.3 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 20MP, 2x 12MP | 1x 64MP, 2x 16MP |
Max Video Capture | 4K@30fps | 2K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2016 October | 2021 Quarter 3 |
Partnumber | Hi3660 | MT6833V/PNZA, MT6833P |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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