HiSilicon Kirin 960 vs MediaTek Dimensity 800U
The HiSilicon Kirin 960 and the MediaTek Dimensity 800U are two processors with distinct specifications.
Starting with the HiSilicon Kirin 960, it features a CPU architecture consisting of 4 Cortex-A73 cores clocked at 2.4 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. This octa-core processor operates on the ARMv8-A instruction set and has a lithography size of 16 nm. With around 4000 million transistors, it offers high performance with a relatively low thermal design power (TDP) of 5 Watts.
On the other hand, the MediaTek Dimensity 800U utilizes a different CPU architecture. It combines 2 Cortex-A76 cores with a clock speed of 2.4 GHz and 6 Cortex-A55 cores with a frequency of 2.0 GHz. Similar to the Kirin 960, it also has 8 cores and operates on the ARMv8.2-A instruction set. However, the Dimensity 800U surpasses the Kirin 960 in terms of nanometer lithography, as it is built on a more advanced 7 nm process. Additionally, the Dimensity 800U boasts a Neural Processing Unit (NPU) which enhances the device's AI capabilities.
Comparing these two processors, it is evident that they have differences in their CPU architecture, clock speeds, lithography size, and additional features. The Kirin 960 offers a balanced combination of high-performance cores and power-efficient cores. It is built on a 16 nm process, making it suitable for devices where thermal management is crucial. On the other hand, the Dimensity 800U focuses on higher clock speeds with its Cortex-A76 cores and utilizes the benefits of a smaller 7 nm lithography, resulting in improved power efficiency.
In summary, both processors have their own strengths and target different market segments. The Kirin 960 prioritizes efficient performance, while the Dimensity 800U emphasizes advanced AI capabilities and power efficiency. The choice between the two would ultimately depend on the specific requirements and priorities of the device and its intended usage.
Starting with the HiSilicon Kirin 960, it features a CPU architecture consisting of 4 Cortex-A73 cores clocked at 2.4 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. This octa-core processor operates on the ARMv8-A instruction set and has a lithography size of 16 nm. With around 4000 million transistors, it offers high performance with a relatively low thermal design power (TDP) of 5 Watts.
On the other hand, the MediaTek Dimensity 800U utilizes a different CPU architecture. It combines 2 Cortex-A76 cores with a clock speed of 2.4 GHz and 6 Cortex-A55 cores with a frequency of 2.0 GHz. Similar to the Kirin 960, it also has 8 cores and operates on the ARMv8.2-A instruction set. However, the Dimensity 800U surpasses the Kirin 960 in terms of nanometer lithography, as it is built on a more advanced 7 nm process. Additionally, the Dimensity 800U boasts a Neural Processing Unit (NPU) which enhances the device's AI capabilities.
Comparing these two processors, it is evident that they have differences in their CPU architecture, clock speeds, lithography size, and additional features. The Kirin 960 offers a balanced combination of high-performance cores and power-efficient cores. It is built on a 16 nm process, making it suitable for devices where thermal management is crucial. On the other hand, the Dimensity 800U focuses on higher clock speeds with its Cortex-A76 cores and utilizes the benefits of a smaller 7 nm lithography, resulting in improved power efficiency.
In summary, both processors have their own strengths and target different market segments. The Kirin 960 prioritizes efficient performance, while the Dimensity 800U emphasizes advanced AI capabilities and power efficiency. The choice between the two would ultimately depend on the specific requirements and priorities of the device and its intended usage.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 7 nm |
Number of transistors | 4000 million | |
TDP | 5 Watt | |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G71 MP8 | Mali-G57 MP3 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 900 MHz | 850 MHz |
Execution units | 8 | 3 |
Shaders | 128 | 48 |
DirectX | 11.3 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 20MP, 2x 12MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2016 October | 2020 Quarter 3 |
Partnumber | Hi3660 | MT6853V, MT6853V/TNZA, MT6853/TNZA, MT6853T |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Qualcomm Snapdragon 888 vs HiSilicon Kirin 710F
2
MediaTek Helio G88 vs Apple A12 Bionic
3
MediaTek Helio P35 vs Qualcomm Snapdragon 750G
4
Unisoc SC9832E vs Samsung Exynos 990
5
MediaTek Dimensity 8020 vs Samsung Exynos 7420
6
Qualcomm Snapdragon 460 vs Apple A15 Bionic
7
MediaTek Helio P60 vs Samsung Exynos 1330
8
Apple A16 Bionic vs Apple A14 Bionic
9
MediaTek Dimensity 1300 vs MediaTek Dimensity 1050
10
MediaTek Dimensity 1000L vs Qualcomm Snapdragon 730