HiSilicon Kirin 960 vs MediaTek Dimensity 720
The HiSilicon Kirin 960 and MediaTek Dimensity 720 processors are two popular choices in the smartphone market. Despite similarities in core count and architecture, there are several key differences between them.
Starting with the HiSilicon Kirin 960, this processor boasts an architecture composed of four Cortex-A73 cores clocked at 2.4 GHz and four Cortex-A53 cores clocked at 1.8 GHz. It utilizes the ARMv8-A instruction set and has a lithography of 16 nm. With 4000 million transistors, the Kirin 960 offers a low TDP of 5 Watts.
On the other hand, the MediaTek Dimensity 720 features an architecture consisting of two Cortex-A76 cores clocked at 2.2 GHz and six Cortex-A55 cores clocked at 2 GHz. It supports the ARMv8.2-A instruction set and is fabricated using a smaller 7 nm lithography. With a slightly higher TDP of 10 Watts, the Dimensity 720 also includes a Neural Processing Unit (NPU) for enhanced AI capabilities.
One notable distinction between the two processors is their lithography. The Kirin 960 utilizes a 16 nm process, while the Dimensity 720 is manufactured using a more advanced 7 nm process. This allows the Dimensity 720 to offer better power efficiency and potentially improved performance.
Additionally, the Dimensity 720 stands out with its inclusion of an NPU, which enables advanced AI features such as enhanced camera capabilities, better voice recognition, and improved power management.
In summary, while both processors offer eight cores and ARMv8 instruction sets, the HiSilicon Kirin 960 utilizes a 16 nm lithography and has a lower TDP, while the MediaTek Dimensity 720 boasts a more advanced 7 nm lithography, higher TDP, and an NPU for AI-related tasks. The choice between these processors ultimately comes down to the specific needs and preferences of the end-user.
Starting with the HiSilicon Kirin 960, this processor boasts an architecture composed of four Cortex-A73 cores clocked at 2.4 GHz and four Cortex-A53 cores clocked at 1.8 GHz. It utilizes the ARMv8-A instruction set and has a lithography of 16 nm. With 4000 million transistors, the Kirin 960 offers a low TDP of 5 Watts.
On the other hand, the MediaTek Dimensity 720 features an architecture consisting of two Cortex-A76 cores clocked at 2.2 GHz and six Cortex-A55 cores clocked at 2 GHz. It supports the ARMv8.2-A instruction set and is fabricated using a smaller 7 nm lithography. With a slightly higher TDP of 10 Watts, the Dimensity 720 also includes a Neural Processing Unit (NPU) for enhanced AI capabilities.
One notable distinction between the two processors is their lithography. The Kirin 960 utilizes a 16 nm process, while the Dimensity 720 is manufactured using a more advanced 7 nm process. This allows the Dimensity 720 to offer better power efficiency and potentially improved performance.
Additionally, the Dimensity 720 stands out with its inclusion of an NPU, which enables advanced AI features such as enhanced camera capabilities, better voice recognition, and improved power management.
In summary, while both processors offer eight cores and ARMv8 instruction sets, the HiSilicon Kirin 960 utilizes a 16 nm lithography and has a lower TDP, while the MediaTek Dimensity 720 boasts a more advanced 7 nm lithography, higher TDP, and an NPU for AI-related tasks. The choice between these processors ultimately comes down to the specific needs and preferences of the end-user.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 7 nm |
Number of transistors | 4000 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G71 MP8 | Mali-G57 MP3 |
GPU Architecture | Mali Bifrost | Mali Valhall |
GPU frequency | 900 MHz | 850 MHz |
Execution units | 8 | 3 |
Shaders | 128 | |
DirectX | 11.3 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@90Hz | |
Max camera resolution | 1x 20MP, 2x 12MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2016 October | 2020 Quarter 3 |
Partnumber | Hi3660 | MT6853V/ZA, MT6853V/NZA |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
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