HiSilicon Kirin 960 vs HiSilicon Kirin 9000 5G
The HiSilicon Kirin 960 and Kirin 9000 5G are both powerful processors, but they have several differences in their specifications.
Starting with the HiSilicon Kirin 960, it is equipped with 8 CPU cores divided into two clusters. The first cluster consists of 4 Cortex-A73 cores clocked at 2.4 GHz, which offer high performance, while the second cluster comprises 4 Cortex-A53 cores clocked at 1.8 GHz, designed for power efficiency. The processor is based on the ARMv8-A instruction set and has a lithography of 16 nm. With a transistor count of 4000 million, it strikes a balance between performance and power consumption, with a TDP of 5 Watts.
On the other hand, the HiSilicon Kirin 9000 5G comes with a more advanced architecture. It features 8 CPU cores, with three different clusters. The first cluster contains a single Cortex-A77 core clocked at an impressive 3.13 GHz, providing exceptional single-core performance. The second cluster houses three Cortex-A77 cores clocked at 2.54 GHz, contributing to both power efficiency and high performance. The third cluster consists of four Cortex-A55 cores clocked at 2.05 GHz, dedicated to power efficiency. The Kirin 9000 5G is based on the ARMv8.2-A instruction set and has a smaller lithography of 5 nm. With a significantly larger transistor count of 15300 million, it delivers higher performance capabilities. The processor consumes slightly more power, with a TDP of 6 Watts, but offers enhanced neural processing capabilities with the help of Ascend Lite and Ascend Tiny neural processing units, along with HUAWEI Da Vinci Architecture 2.0.
In summary, the HiSilicon Kirin 9000 5G outperforms the Kirin 960 in various aspects. It showcases a more advanced architecture with higher clock speeds and upgraded CPUs. Additionally, the Kirin 9000 5G offers improved neural processing capabilities and a smaller lithography, which contribute to higher overall performance. However, it should be noted that these specifications alone do not provide a complete picture of the processors' performance, and real-world performance may vary based on other factors such as software optimization and system integration.
Starting with the HiSilicon Kirin 960, it is equipped with 8 CPU cores divided into two clusters. The first cluster consists of 4 Cortex-A73 cores clocked at 2.4 GHz, which offer high performance, while the second cluster comprises 4 Cortex-A53 cores clocked at 1.8 GHz, designed for power efficiency. The processor is based on the ARMv8-A instruction set and has a lithography of 16 nm. With a transistor count of 4000 million, it strikes a balance between performance and power consumption, with a TDP of 5 Watts.
On the other hand, the HiSilicon Kirin 9000 5G comes with a more advanced architecture. It features 8 CPU cores, with three different clusters. The first cluster contains a single Cortex-A77 core clocked at an impressive 3.13 GHz, providing exceptional single-core performance. The second cluster houses three Cortex-A77 cores clocked at 2.54 GHz, contributing to both power efficiency and high performance. The third cluster consists of four Cortex-A55 cores clocked at 2.05 GHz, dedicated to power efficiency. The Kirin 9000 5G is based on the ARMv8.2-A instruction set and has a smaller lithography of 5 nm. With a significantly larger transistor count of 15300 million, it delivers higher performance capabilities. The processor consumes slightly more power, with a TDP of 6 Watts, but offers enhanced neural processing capabilities with the help of Ascend Lite and Ascend Tiny neural processing units, along with HUAWEI Da Vinci Architecture 2.0.
In summary, the HiSilicon Kirin 9000 5G outperforms the Kirin 960 in various aspects. It showcases a more advanced architecture with higher clock speeds and upgraded CPUs. Additionally, the Kirin 9000 5G offers improved neural processing capabilities and a smaller lithography, which contribute to higher overall performance. However, it should be noted that these specifications alone do not provide a complete picture of the processors' performance, and real-world performance may vary based on other factors such as software optimization and system integration.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 5 nm |
Number of transistors | 4000 million | 15300 million |
TDP | 5 Watt | 6 Watt |
Neural Processing | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 2750 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G71 MP8 | Mali-G78 MP24 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 900 MHz | 760 MHz |
Execution units | 8 | 24 |
Shaders | 128 | 384 |
DirectX | 11.3 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | |
Max camera resolution | 1x 20MP, 2x 12MP | |
Max Video Capture | 4K@30fps | 4K@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 4.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 2.5 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC |
Supplemental Information
Launch Date | 2016 October | 2020 October |
Partnumber | Hi3660 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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