HiSilicon Kirin 955 vs Unisoc Tanggula T770 5G

The HiSilicon Kirin 955 and the Unisoc Tanggula T770 5G are two processors with distinct specifications. Let's compare them in terms of their key features.

Firstly, the HiSilicon Kirin 955 features an architecture consisting of 4 Cortex-A72 cores clocked at 2.5 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. On the other hand, the Unisoc Tanggula T770 5G boasts a more diverse architecture with 1 Cortex-A76 core clocked at 2.5 GHz, 3 Cortex-A76 cores clocked at 2.2 GHz, and 4 Cortex-A55 cores clocked at 2.0 GHz. This suggests that the Tanggula T770 5G has a more powerful and specialized configuration.

Moving on to lithography, the HiSilicon Kirin 955 has a 16 nm lithography process, while the Unisoc Tanggula T770 5G utilizes a more advanced 6 nm lithography process. A smaller lithography allows for improved efficiency, power consumption, and overall performance.

In terms of instruction set, both processors are equipped with ARMv8-based architectures. However, the Tanggula T770 5G stands out as it supports the ARMv8.2-A instruction set, which implies enhancements in performance and capabilities over the ARMv8-A supported by the Kirin 955.

Furthermore, the HiSilicon Kirin 955 has a transistor count of 2000 million, while the Unisoc Tanggula T770 5G does not mention its transistor count. This factor indicates that the Kirin 955 may have a higher transistor density, potentially enabling improved performance.

Both processors have a TDP (Thermal Design Power) of 5 watts, suggesting similar power efficiency. However, it is worth noting that the Tanggula T770 5G comes equipped with a Neural Processing Unit (NPU). This NPU provides dedicated AI processing capabilities, which can greatly enhance tasks involving machine learning and artificial intelligence.

In conclusion, while the HiSilicon Kirin 955 boasts a strong performance with its architecture and transistor count, the Unisoc Tanggula T770 5G offers a more diverse architecture, a smaller lithography process, and the added benefit of an NPU. These specifications indicate that the Tanggula T770 5G could potentially deliver higher performance and improved AI capabilities compared to the Kirin 955.