HiSilicon Kirin 955 vs MediaTek Dimensity 930
The HiSilicon Kirin 955 and MediaTek Dimensity 930 are two processors, each with their unique specifications. Let's compare them based on their specifications.
In terms of CPU cores and architecture, the HiSilicon Kirin 955 features 4x 2.5 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores, while the MediaTek Dimensity 930 has 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Both processors have 8 cores and support the ARMv8-A instruction set.
Moving on to the lithography, the HiSilicon Kirin 955 has a 16 nm lithography, while the MediaTek Dimensity 930 takes advantage of the more advanced 6 nm lithography. A smaller lithography generally translates to better power efficiency and potentially improved performance.
The number of transistors in the Kirin 955 amounts to 2000 million, while the Dimensity 930's transistor count is not specified. However, a higher transistor count typically indicates a more capable and powerful processor.
When it comes to power consumption, the HiSilicon Kirin 955 boasts a TDP (thermal design power) of 5 Watts, whereas the MediaTek Dimensity 930 has a TDP of 10 Watts. This suggests that the Kirin 955 may be more power-efficient than the Dimensity 930.
Lastly, the MediaTek Dimensity 930 stands out with its Neural Processing Unit (NPU) capability. This feature allows for enhanced AI and machine learning capabilities, which can significantly benefit certain tasks and applications.
In summary, while the HiSilicon Kirin 955 and MediaTek Dimensity 930 have some similarities such as the number of cores and the ARMv8 architecture, they differ in other areas. The Dimensity 930 excels with its smaller lithography and NPU capability, potentially offering better power efficiency and enhanced AI performance. On the other hand, the Kirin 955's higher transistor count may indicate more overall processing power. Ultimately, the choice between these two processors depends on specific requirements and needs.
In terms of CPU cores and architecture, the HiSilicon Kirin 955 features 4x 2.5 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores, while the MediaTek Dimensity 930 has 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Both processors have 8 cores and support the ARMv8-A instruction set.
Moving on to the lithography, the HiSilicon Kirin 955 has a 16 nm lithography, while the MediaTek Dimensity 930 takes advantage of the more advanced 6 nm lithography. A smaller lithography generally translates to better power efficiency and potentially improved performance.
The number of transistors in the Kirin 955 amounts to 2000 million, while the Dimensity 930's transistor count is not specified. However, a higher transistor count typically indicates a more capable and powerful processor.
When it comes to power consumption, the HiSilicon Kirin 955 boasts a TDP (thermal design power) of 5 Watts, whereas the MediaTek Dimensity 930 has a TDP of 10 Watts. This suggests that the Kirin 955 may be more power-efficient than the Dimensity 930.
Lastly, the MediaTek Dimensity 930 stands out with its Neural Processing Unit (NPU) capability. This feature allows for enhanced AI and machine learning capabilities, which can significantly benefit certain tasks and applications.
In summary, while the HiSilicon Kirin 955 and MediaTek Dimensity 930 have some similarities such as the number of cores and the ARMv8 architecture, they differ in other areas. The Dimensity 930 excels with its smaller lithography and NPU capability, potentially offering better power efficiency and enhanced AI performance. On the other hand, the Kirin 955's higher transistor count may indicate more overall processing power. Ultimately, the choice between these two processors depends on specific requirements and needs.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.5 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 6 nm |
Number of transistors | 2000 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 4 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1333 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 3.1 |
Graphics
GPU name | Mali-T880 MP4 | Imagination PowerVR BXM-8-256 |
GPU Architecture | Mali Midgard | PowerVR Rogue |
GPU frequency | 900 MHz | 800 MHz |
Execution units | 4 | |
Shaders | 64 | |
DirectX | 11.2 | 12 |
OpenCL API | 1.2 | 3.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 31MP, 2x 13MP | 1x 108MP, 1x 64MP |
Max Video Capture | FullHD@60fps | 2K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2016 April | 2022 Quarter 3 |
Partnumber | Hi3655 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
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