HiSilicon Kirin 955 vs MediaTek Dimensity 820

The HiSilicon Kirin 955 and MediaTek Dimensity 820 are two processors designed for mobile devices, but they differ in terms of their specifications.

Starting with the HiSilicon Kirin 955, it features a CPU architecture consisting of 4x 2.5 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. This octa-core processor operates on the ARMv8-A instruction set and is manufactured using a 16 nm lithography process. With 2000 million transistors, the Kirin 955 offers a balance between power efficiency and performance. It also has a Thermal Design Power (TDP) of 5 watts, meaning it consumes relatively less power during operation.

Moving on to the MediaTek Dimensity 820, it also has an octa-core CPU architecture. However, it differs from the Kirin 955 with its 4x 2.6 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. This configuration provides a slightly higher clock speed and potentially better performance. The Dimensity 820 operates on the ARMv8.2-A instruction set and is manufactured using a more advanced 7 nm lithography process. This smaller process node contributes to improved power efficiency and potentially better heat dissipation. While the Kirin 955 does not have a Neural Processing Unit (NPU), the Dimensity 820 does, which enables it to handle specialized AI tasks more efficiently.

In terms of power consumption, the Kirin 955 has a lower TDP of 5 watts compared to the Dimensity 820's 10-watt TDP. This indicates that the Kirin 955 consumes less power during operation, potentially leading to better battery life.

Overall, both processors offer competitive specifications for mobile devices. The Kirin 955 strikes a balance between power efficiency and performance, while the Dimensity 820 leans towards higher clock speeds and advanced manufacturing technology. Depending on the specific requirements of a device, either processor could be a suitable choice.