HiSilicon Kirin 955 vs MediaTek Dimensity 800U
The HiSilicon Kirin 955 and MediaTek Dimensity 800U processors are two distinct offerings in the market, each with its own set of specifications and features.
Starting with the HiSilicon Kirin 955, this processor boasts eight cores with a specific architecture. It consists of four Cortex-A72 cores, clocked at 2.5 GHz, and four Cortex-A53 cores, clocked at 1.8 GHz. This combination allows for optimal performance and power efficiency. The processor utilizes the ARMv8-A instruction set and has a lithography of 16 nm, which is a reliable and efficient manufacturing process. With 2000 million transistors, it provides a solid foundation for processing tasks. Moreover, the TDP (thermal design power) of this processor is 5 Watts, signifying a moderate power consumption.
On the other hand, the MediaTek Dimensity 800U processor follows a slightly different architecture. It comprises eight cores, including two high-performance Cortex-A76 cores clocked at 2.4 GHz and six power-efficient Cortex-A55 cores clocked at 2.0 GHz. This arrangement balances power and performance requirements. The processor supports the latest ARMv8.2-A instruction set and employs a 7 nm lithography, which is a more advanced and power-efficient manufacturing process. Additionally, the Dimensity 800U features a Neural Processing Unit (NPU) that enhances AI-related tasks.
In summary, while both processors offer octa-core configurations, they differ in terms of their specific architectures, clock speeds, and lithography. The HiSilicon Kirin 955 utilizes Cortex-A72 and Cortex-A53 cores, has a 16 nm lithography, and features a TDP of 5 Watts. In contrast, the MediaTek Dimensity 800U integrates Cortex-A76 and Cortex-A55 cores, utilizes a superior 7 nm lithography, and incorporates an NPU for AI processing. These specifications highlight the distinct characteristics and capabilities of each processor, enabling consumers to make informed choices based on their requirements and preferences.
Starting with the HiSilicon Kirin 955, this processor boasts eight cores with a specific architecture. It consists of four Cortex-A72 cores, clocked at 2.5 GHz, and four Cortex-A53 cores, clocked at 1.8 GHz. This combination allows for optimal performance and power efficiency. The processor utilizes the ARMv8-A instruction set and has a lithography of 16 nm, which is a reliable and efficient manufacturing process. With 2000 million transistors, it provides a solid foundation for processing tasks. Moreover, the TDP (thermal design power) of this processor is 5 Watts, signifying a moderate power consumption.
On the other hand, the MediaTek Dimensity 800U processor follows a slightly different architecture. It comprises eight cores, including two high-performance Cortex-A76 cores clocked at 2.4 GHz and six power-efficient Cortex-A55 cores clocked at 2.0 GHz. This arrangement balances power and performance requirements. The processor supports the latest ARMv8.2-A instruction set and employs a 7 nm lithography, which is a more advanced and power-efficient manufacturing process. Additionally, the Dimensity 800U features a Neural Processing Unit (NPU) that enhances AI-related tasks.
In summary, while both processors offer octa-core configurations, they differ in terms of their specific architectures, clock speeds, and lithography. The HiSilicon Kirin 955 utilizes Cortex-A72 and Cortex-A53 cores, has a 16 nm lithography, and features a TDP of 5 Watts. In contrast, the MediaTek Dimensity 800U integrates Cortex-A76 and Cortex-A55 cores, utilizes a superior 7 nm lithography, and incorporates an NPU for AI processing. These specifications highlight the distinct characteristics and capabilities of each processor, enabling consumers to make informed choices based on their requirements and preferences.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.5 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 7 nm |
Number of transistors | 2000 million | |
TDP | 5 Watt | |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 4 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1333 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.2 |
Graphics
GPU name | Mali-T880 MP4 | Mali-G57 MP3 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 900 MHz | 850 MHz |
Execution units | 4 | 3 |
Shaders | 64 | 48 |
DirectX | 11.2 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 31MP, 2x 13MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | FullHD@60fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2016 April | 2020 Quarter 3 |
Partnumber | Hi3655 | MT6853V, MT6853V/TNZA, MT6853/TNZA, MT6853T |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
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