HiSilicon Kirin 955 vs MediaTek Dimensity 720

The HiSilicon Kirin 955 and MediaTek Dimensity 720 are two processors with distinct specifications.

In terms of CPU cores and architecture, the HiSilicon Kirin 955 features 4x 2.5 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the MediaTek Dimensity 720 boasts 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. Both processors have a total of 8 cores, but their specific architectures vary.

Regarding instruction sets, the HiSilicon Kirin 955 employs the ARMv8-A instruction set, while the MediaTek Dimensity 720 uses the ARMv8.2-A instruction set. These instruction sets determine how the processors execute commands and handle data.

The HiSilicon Kirin 955 operates on a 16 nm lithography process, while the MediaTek Dimensity 720 is manufactured using a more advanced 7 nm lithography process. A smaller lithography process typically translates to improved power efficiency and performance.

In terms of power consumption, the HiSilicon Kirin 955 has a thermal design power (TDP) of 5 Watts, while the MediaTek Dimensity 720 has a TDP of 10 Watts. This indicates that the HiSilicon Kirin 955 is designed to consume less power compared to the MediaTek Dimensity 720.

Additionally, the MediaTek Dimensity 720 boasts Neural Processing Unit (NPU) capabilities, which can enhance tasks related to artificial intelligence and machine learning. This NPU can potentially improve performance in applications that heavily rely on AI algorithms.

In summary, the HiSilicon Kirin 955 excels in terms of power efficiency with its 16 nm lithography and lower TDP. Meanwhile, the MediaTek Dimensity 720 takes advantage of a more advanced 7 nm lithography process and introduces NPU capabilities for improved AI-related tasks. The choice between these processors depends on the specific requirements of the device or application for which they will be used.