HiSilicon Kirin 950 vs MediaTek Dimensity 930
The HiSilicon Kirin 950 and MediaTek Dimensity 930 are both powerful processors, but they differ in several important specifications.
Starting with the CPU cores and architecture, the Kirin 950 utilizes a combination of four Cortex-A72 cores and four Cortex-A53 cores. It has a balanced mix of high-performance and efficient cores for various tasks. On the other hand, the Dimensity 930 uses two Cortex-A78 cores and six Cortex-A55 cores. This arrangement is geared towards improved efficiency and performance, with a focus on delivering smooth multitasking experiences.
In terms of lithography, the Kirin 950 is manufactured using a 16 nm process, providing a good balance between power consumption and performance. In comparison, the Dimensity 930 benefits from a more advanced 6 nm process, which typically leads to improved efficiency and reduced power consumption. This enables the Dimensity 930 to offer better performance while maintaining longer battery life.
Both processors are equipped with eight cores, offering ample processing power for demanding tasks. The instruction sets for both are based on the ARMv8 architecture, ensuring compatibility with a wide range of software and applications.
When it comes to power consumption, the Kirin 950 has a TDP (Thermal Design Power) of 5 Watts, indicating its energy efficiency. In contrast, the Dimensity 930 has a higher TDP of 10 Watts. However, it is worth noting that the Dimensity 930 includes a Neural Processing Unit (NPU), which is designed specifically for AI-related tasks. This addition enhances the processor's capabilities in tasks such as image recognition and voice commands, among others.
In summary, the HiSilicon Kirin 950 and MediaTek Dimensity 930 have different configurations and specifications that cater to different user requirements. The Kirin 950 offers a balanced mix of high performance and energy efficiency, while the Dimensity 930 focuses on improved multitasking and AI capabilities, albeit with slightly higher power consumption.
Starting with the CPU cores and architecture, the Kirin 950 utilizes a combination of four Cortex-A72 cores and four Cortex-A53 cores. It has a balanced mix of high-performance and efficient cores for various tasks. On the other hand, the Dimensity 930 uses two Cortex-A78 cores and six Cortex-A55 cores. This arrangement is geared towards improved efficiency and performance, with a focus on delivering smooth multitasking experiences.
In terms of lithography, the Kirin 950 is manufactured using a 16 nm process, providing a good balance between power consumption and performance. In comparison, the Dimensity 930 benefits from a more advanced 6 nm process, which typically leads to improved efficiency and reduced power consumption. This enables the Dimensity 930 to offer better performance while maintaining longer battery life.
Both processors are equipped with eight cores, offering ample processing power for demanding tasks. The instruction sets for both are based on the ARMv8 architecture, ensuring compatibility with a wide range of software and applications.
When it comes to power consumption, the Kirin 950 has a TDP (Thermal Design Power) of 5 Watts, indicating its energy efficiency. In contrast, the Dimensity 930 has a higher TDP of 10 Watts. However, it is worth noting that the Dimensity 930 includes a Neural Processing Unit (NPU), which is designed specifically for AI-related tasks. This addition enhances the processor's capabilities in tasks such as image recognition and voice commands, among others.
In summary, the HiSilicon Kirin 950 and MediaTek Dimensity 930 have different configurations and specifications that cater to different user requirements. The Kirin 950 offers a balanced mix of high performance and energy efficiency, while the Dimensity 930 focuses on improved multitasking and AI capabilities, albeit with slightly higher power consumption.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 6 nm |
Number of transistors | 2000 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 4 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1333 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 3.1 |
Graphics
GPU name | Mali-T880 MP4 | Imagination PowerVR BXM-8-256 |
GPU Architecture | Midgard | Rogue |
GPU frequency | 900 MHz | 800 MHz |
Execution units | 4 | |
Shaders | 64 | |
DirectX | 11.2 | 12 |
OpenCL API | 1.2 | 3.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 31MP, 2x 13MP | 1x 108MP, 1x 64MP |
Max Video Capture | FullHD@60fps | 2K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2015 November | 2022 Quarter 3 |
Partnumber | Hi3650 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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