HiSilicon Kirin 950 vs MediaTek Dimensity 900
The HiSilicon Kirin 950 and MediaTek Dimensity 900 are both powerful processors utilized in various electronic devices. Let's compare their specifications to analyze their differences.
In terms of CPU cores and architecture, the HiSilicon Kirin 950 features 4x 2.4 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the MediaTek Dimensity 900 incorporates 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Although the Kirin 950 consists of faster Cortex-A72 cores, the Dimensity 900 incorporates newer Cortex-A78 cores, ensuring enhanced performance and efficiency.
Regarding the number of cores, both processors possess 8 cores, providing ample processing power capable of handling demanding tasks efficiently.
The instruction set of the Kirin 950 is ARMv8-A, while the Dimensity 900 adopts the newer ARMv8.2-A instruction set. This indicates that the Dimensity 900 is equipped with more advanced features and compatibility with modern software.
When it comes to lithography, the Kirin 950 is manufactured using a 16 nm process, whereas the Dimensity 900 utilizes a more advanced 6 nm process. The smaller lithography of the Dimensity 900 implies increased power efficiency and potentially better thermal management.
In terms of transistor count, the Kirin 950 has 2000 million transistors, while the Dimensity 900 features a significantly higher count with 10000 million transistors. The higher transistor count of the Dimensity 900 suggests enhanced performance, smoother multitasking, and improved overall efficiency.
Furthermore, the Dimensity 900 boasts a Neural Processing Unit (NPU), which the Kirin 950 lacks. The NPU enhances the Dimensity 900's ability to handle artificial intelligence tasks, making it more capable in tasks requiring machine learning or AI algorithms.
Power consumption, as represented by the thermal design power (TDP), is another factor to consider. The Kirin 950 has a relatively lower TDP of 5 Watts, while the Dimensity 900 has a TDP of 10 Watts. A lower TDP indicates better power efficiency, potentially resulting in longer battery life for devices utilizing the Kirin 950.
To summarize, the MediaTek Dimensity 900 surpasses the HiSilicon Kirin 950 in various aspects. It offers a newer and more efficient architecture, a significantly higher transistor count, an advanced instruction set, and the inclusion of an NPU for AI tasks. However, the Kirin 950 still has its merits with faster Cortex-A72 cores and a lower TDP. Ultimately, the choice between these processors depends on the specific requirements and priorities of the intended devices.
In terms of CPU cores and architecture, the HiSilicon Kirin 950 features 4x 2.4 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the MediaTek Dimensity 900 incorporates 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Although the Kirin 950 consists of faster Cortex-A72 cores, the Dimensity 900 incorporates newer Cortex-A78 cores, ensuring enhanced performance and efficiency.
Regarding the number of cores, both processors possess 8 cores, providing ample processing power capable of handling demanding tasks efficiently.
The instruction set of the Kirin 950 is ARMv8-A, while the Dimensity 900 adopts the newer ARMv8.2-A instruction set. This indicates that the Dimensity 900 is equipped with more advanced features and compatibility with modern software.
When it comes to lithography, the Kirin 950 is manufactured using a 16 nm process, whereas the Dimensity 900 utilizes a more advanced 6 nm process. The smaller lithography of the Dimensity 900 implies increased power efficiency and potentially better thermal management.
In terms of transistor count, the Kirin 950 has 2000 million transistors, while the Dimensity 900 features a significantly higher count with 10000 million transistors. The higher transistor count of the Dimensity 900 suggests enhanced performance, smoother multitasking, and improved overall efficiency.
Furthermore, the Dimensity 900 boasts a Neural Processing Unit (NPU), which the Kirin 950 lacks. The NPU enhances the Dimensity 900's ability to handle artificial intelligence tasks, making it more capable in tasks requiring machine learning or AI algorithms.
Power consumption, as represented by the thermal design power (TDP), is another factor to consider. The Kirin 950 has a relatively lower TDP of 5 Watts, while the Dimensity 900 has a TDP of 10 Watts. A lower TDP indicates better power efficiency, potentially resulting in longer battery life for devices utilizing the Kirin 950.
To summarize, the MediaTek Dimensity 900 surpasses the HiSilicon Kirin 950 in various aspects. It offers a newer and more efficient architecture, a significantly higher transistor count, an advanced instruction set, and the inclusion of an NPU for AI tasks. However, the Kirin 950 still has its merits with faster Cortex-A72 cores and a lower TDP. Ultimately, the choice between these processors depends on the specific requirements and priorities of the intended devices.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 6 nm |
Number of transistors | 2000 million | 10000 million |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 4 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1333 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 3.1 |
Graphics
GPU name | Mali-T880 MP4 | Mali-G68 MP4 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 900 MHz | 900 MHz |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 11.2 | 12 |
OpenCL API | 1.2 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 31MP, 2x 13MP | 1x 108MP, 2x 20MP |
Max Video Capture | FullHD@60fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2015 November | 2021 Quarter 1 |
Partnumber | Hi3650 | MT6877 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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