HiSilicon Kirin 950 vs MediaTek Dimensity 820
The HiSilicon Kirin 950 and the MediaTek Dimensity 820 are both powerful processors used in smartphones and other mobile devices. They have their own unique set of specifications that differentiate them from each other.
In terms of CPU cores and architecture, the Kirin 950 features 4x 2.4 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the Dimensity 820 is equipped with 4x 2.6 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. The Dimensity 820 has a slightly higher clock speed, which indicates better performance potential.
Both processors have 8 cores and use the ARMv8 instruction set. However, the Dimensity 820 utilizes the newer ARMv8.2-A instruction set, which may offer additional features and optimizations compared to the older ARMv8-A instruction set used by the Kirin 950.
In terms of manufacturing process, the Kirin 950 is based on a 16 nm lithography, while the Dimensity 820 uses a more advanced 7 nm lithography. The smaller lithography allows for more transistors to be packed into the same space, resulting in improved power efficiency and performance.
Speaking of power efficiency, the Kirin 950 has a TDP (Thermal Design Power) of 5 Watts, whereas the Dimensity 820 has a TDP of 10 Watts. This suggests that the Kirin 950 may be more power-efficient, leading to longer battery life.
One notable difference between the two processors is the inclusion of a Neural Processing Unit (NPU) in the Dimensity 820. The NPU is specifically designed for tasks related to artificial intelligence and machine learning, providing enhanced performance in these areas.
In conclusion, both the HiSilicon Kirin 950 and the MediaTek Dimensity 820 offer powerful performance as mobile processors. The Dimensity 820 has slight advantages in terms of clock speed and manufacturing process, while the Kirin 950 may be more power-efficient. The inclusion of a dedicated Neural Processing Unit in the Dimensity 820 gives it an edge in AI-related tasks. Ultimately, the choice between the two processors depends on the specific requirements and priorities of the device manufacturer and end-users.
In terms of CPU cores and architecture, the Kirin 950 features 4x 2.4 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the Dimensity 820 is equipped with 4x 2.6 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. The Dimensity 820 has a slightly higher clock speed, which indicates better performance potential.
Both processors have 8 cores and use the ARMv8 instruction set. However, the Dimensity 820 utilizes the newer ARMv8.2-A instruction set, which may offer additional features and optimizations compared to the older ARMv8-A instruction set used by the Kirin 950.
In terms of manufacturing process, the Kirin 950 is based on a 16 nm lithography, while the Dimensity 820 uses a more advanced 7 nm lithography. The smaller lithography allows for more transistors to be packed into the same space, resulting in improved power efficiency and performance.
Speaking of power efficiency, the Kirin 950 has a TDP (Thermal Design Power) of 5 Watts, whereas the Dimensity 820 has a TDP of 10 Watts. This suggests that the Kirin 950 may be more power-efficient, leading to longer battery life.
One notable difference between the two processors is the inclusion of a Neural Processing Unit (NPU) in the Dimensity 820. The NPU is specifically designed for tasks related to artificial intelligence and machine learning, providing enhanced performance in these areas.
In conclusion, both the HiSilicon Kirin 950 and the MediaTek Dimensity 820 offer powerful performance as mobile processors. The Dimensity 820 has slight advantages in terms of clock speed and manufacturing process, while the Kirin 950 may be more power-efficient. The inclusion of a dedicated Neural Processing Unit in the Dimensity 820 gives it an edge in AI-related tasks. Ultimately, the choice between the two processors depends on the specific requirements and priorities of the device manufacturer and end-users.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
4x 2.6 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 7 nm |
Number of transistors | 2000 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 4 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1333 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.2 |
Graphics
GPU name | Mali-T880 MP4 | Mali-G57 MP5 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 900 MHz | 650 MHz |
Execution units | 4 | 5 |
Shaders | 64 | 80 |
DirectX | 11.2 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 31MP, 2x 13MP | 1x 80MP, 1x 32MP + 1x 16MP |
Max Video Capture | FullHD@60fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2015 November | 2020 May |
Partnumber | Hi3650 | MT6875 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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