HiSilicon Kirin 935 vs Unisoc Tiger T310
The HiSilicon Kirin 935 and Unisoc Tiger T310 are two processors with different specifications and capabilities. Let's compare these processors based on their specifications.
Starting with the HiSilicon Kirin 935, it features eight CPU cores combined with a dual-cluster architecture. This architecture consists of four Cortex-A53 cores clocked at 2.2 GHz and another four Cortex-A53 cores running at 1.5 GHz. With a total of eight cores, this processor can efficiently handle multitasking and demanding applications. The Kirin 935 follows the ARMv8-A instruction set and has a lithography of 28 nm, which indicates its manufacturing technology. Additionally, it contains around 1000 million transistors, ensuring high performance and efficiency. The TDP (Thermal Design Power) of this processor is 7 Watts, indicating its power consumption.
On the other hand, the Unisoc Tiger T310 is equipped with four CPU cores. It follows a different architecture, which includes one Cortex-A75 core clocked at 2 GHz and three Cortex-A55 cores running at 1.8 GHz. This configuration ensures a good balance between performance and power efficiency. Similar to the Kirin 935, the Tiger T310 adopts the ARMv8.2-A instruction set. However, it stands out from its counterpart with its smaller lithography of 12 nm. This smaller size allows for better power efficiency and thermal management.
In summary, the HiSilicon Kirin 935 and Unisoc Tiger T310 processors have different specifications. The Kirin 935 features eight cores built on a 28 nm architecture, while the Tiger T310 has four cores on a 12 nm architecture. Both processors support the ARMv8 instruction set, offering modern features and compatibility. The Kirin 935 is known for its multitasking capabilities and energy efficiency, with a TDP of 7 Watts. On the other hand, the Tiger T310 strikes a balance between performance and power efficiency due to its more advanced lithography. Ultimately, the choice between these processors would depend on the specific needs and requirements of the device or system they will be used in.
Starting with the HiSilicon Kirin 935, it features eight CPU cores combined with a dual-cluster architecture. This architecture consists of four Cortex-A53 cores clocked at 2.2 GHz and another four Cortex-A53 cores running at 1.5 GHz. With a total of eight cores, this processor can efficiently handle multitasking and demanding applications. The Kirin 935 follows the ARMv8-A instruction set and has a lithography of 28 nm, which indicates its manufacturing technology. Additionally, it contains around 1000 million transistors, ensuring high performance and efficiency. The TDP (Thermal Design Power) of this processor is 7 Watts, indicating its power consumption.
On the other hand, the Unisoc Tiger T310 is equipped with four CPU cores. It follows a different architecture, which includes one Cortex-A75 core clocked at 2 GHz and three Cortex-A55 cores running at 1.8 GHz. This configuration ensures a good balance between performance and power efficiency. Similar to the Kirin 935, the Tiger T310 adopts the ARMv8.2-A instruction set. However, it stands out from its counterpart with its smaller lithography of 12 nm. This smaller size allows for better power efficiency and thermal management.
In summary, the HiSilicon Kirin 935 and Unisoc Tiger T310 processors have different specifications. The Kirin 935 features eight cores built on a 28 nm architecture, while the Tiger T310 has four cores on a 12 nm architecture. Both processors support the ARMv8 instruction set, offering modern features and compatibility. The Kirin 935 is known for its multitasking capabilities and energy efficiency, with a TDP of 7 Watts. On the other hand, the Tiger T310 strikes a balance between performance and power efficiency due to its more advanced lithography. Ultimately, the choice between these processors would depend on the specific needs and requirements of the device or system they will be used in.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
1x 2 GHz – Cortex-A75 3x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 12 nm |
Number of transistors | 1000 million | |
TDP | 7 Watt |
Memory (RAM)
Max amount | up to 8 GB | up to 4 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 800 MHz | 1333 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | eMMC 5.1 |
Graphics
GPU name | Mali-T628 MP4 | Imagination PowerVR GE8300 |
GPU Architecture | Midgard | Rogue |
GPU frequency | 680 MHz | 660 MHz |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 11 | 10 |
OpenCL API | 1.2 | 3.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 1600x720 |
Max camera resolution | 1x 20MP | 1x 16MP + 1x 8MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.05 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2019 April |
Partnumber | Hi3635 | T310 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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