HiSilicon Kirin 935 vs Unisoc Tanggula T770 5G

The HiSilicon Kirin 935 and the Unisoc Tanggula T770 5G are both powerful processors with different specifications.

Starting with the HiSilicon Kirin 935, it features an architecture consisting of 4x 2.2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. This means it is an octa-core processor with a total of eight cores. The instruction set it uses is ARMv8-A and it has a lithography of 28 nm. The number of transistors in this processor is 1000 million, which contributes to its high performance. Additionally, the TDP of the Kirin 935 is 7 Watts, which indicates its power consumption.

On the other hand, the Unisoc Tanggula T770 5G offers a different architecture. It consists of 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. Similar to the Kirin 935, this processor is also an octa-core with eight cores in total. The instruction set used by the Tanggula T770 5G is ARMv8.2-A, which indicates its advanced capabilities. One notable feature of this processor is its lithography of 6 nm, which is more advanced than the Kirin 935 and generally results in improved performance. The Tanggula T770 5G also has a TDP of 5 Watts, indicating its lower power consumption. Additionally, it includes a Neural Processing Unit (NPU), which enhances its capabilities in tasks related to artificial intelligence and machine learning.

In summary, while both processors have eight cores and utilize ARMv8 instruction sets, they differ in terms of their CPU architecture, lithography, TDP, and additional features. The HiSilicon Kirin 935 operates on a 28 nm lithography, consumes 7 Watts, and does not feature an NPU. On the other hand, the Unisoc Tanggula T770 5G utilizes a more advanced 6 nm lithography, consumes 5 Watts, and includes an NPU. These differences in specifications can impact the overall performance and efficiency of the processors in various applications.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A53
4x 1.5 GHz – Cortex-A53
1x 2.5 GHz – Cortex-A76
3x 2.2 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 28 nm 6 nm
Number of transistors 1000 million
TDP 7 Watt 5 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 8 GB up to 32 GB
Memory type LPDDR3 LPDDR4X
Memory frequency 800 MHz 2133 MHz
Memory-bus 2x32 bit 4x16 bit


Storage specification UFS 2.0 UFS 3.1


GPU name Mali-T628 MP4 Mali-G57 MP6
GPU Architecture Midgard Valhall
GPU frequency 680 MHz 850 MHz
Execution units 4 6
Shaders 64 96
DirectX 11 12
OpenCL API 1.2 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2560x1600 2160x1080@120Hz
Max camera resolution 1x 20MP 1x 108MP, 2x 24MP
Max Video Capture 4K@30fps FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.3 Gbps 2.7 Gbps
Peak Upload Speed 0.05 Gbps 1.5 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.0
Satellite navigation BeiDou

Supplemental Information

Launch Date 2015 Quarter 2 2021 February
Partnumber Hi3635 T770, Tiger T7520
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 935
Tanggula T770 5G

GeekBench 6 Single-Core

Kirin 935
Tanggula T770 5G

GeekBench 6 Multi-Core

Kirin 935
Tanggula T770 5G