HiSilicon Kirin 935 vs Unisoc Tanggula T770 5G

The HiSilicon Kirin 935 and the Unisoc Tanggula T770 5G are both powerful processors with different specifications.

Starting with the HiSilicon Kirin 935, it features an architecture consisting of 4x 2.2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. This means it is an octa-core processor with a total of eight cores. The instruction set it uses is ARMv8-A and it has a lithography of 28 nm. The number of transistors in this processor is 1000 million, which contributes to its high performance. Additionally, the TDP of the Kirin 935 is 7 Watts, which indicates its power consumption.

On the other hand, the Unisoc Tanggula T770 5G offers a different architecture. It consists of 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. Similar to the Kirin 935, this processor is also an octa-core with eight cores in total. The instruction set used by the Tanggula T770 5G is ARMv8.2-A, which indicates its advanced capabilities. One notable feature of this processor is its lithography of 6 nm, which is more advanced than the Kirin 935 and generally results in improved performance. The Tanggula T770 5G also has a TDP of 5 Watts, indicating its lower power consumption. Additionally, it includes a Neural Processing Unit (NPU), which enhances its capabilities in tasks related to artificial intelligence and machine learning.

In summary, while both processors have eight cores and utilize ARMv8 instruction sets, they differ in terms of their CPU architecture, lithography, TDP, and additional features. The HiSilicon Kirin 935 operates on a 28 nm lithography, consumes 7 Watts, and does not feature an NPU. On the other hand, the Unisoc Tanggula T770 5G utilizes a more advanced 6 nm lithography, consumes 5 Watts, and includes an NPU. These differences in specifications can impact the overall performance and efficiency of the processors in various applications.