HiSilicon Kirin 935 vs Unisoc SC7731E
The HiSilicon Kirin 935 and the Unisoc SC7731E are two processors with different specifications.
Starting with the HiSilicon Kirin 935, it features an architecture of 4x 2.2 GHz Cortex-A53 and 4x 1.5 GHz Cortex-A53 cores. With a total of 8 cores, this processor offers a powerful performance for multitasking and running demanding applications. The instruction set used is ARMv8-A, which ensures compatibility with the latest software and technologies. The lithography of 28 nm indicates its manufacturing process, which may not be as efficient as newer processors with smaller lithography sizes. However, it still delivers decent performance. The number of transistors is 1000 million, suggesting a good level of hardware integration. The TDP (Thermal Design Power) is 7 Watts, indicating moderate power consumption.
On the other hand, the Unisoc SC7731E has an architecture of 4x 1.3 GHz Cortex-A7 cores. With only 4 cores, this processor may not provide as much processing power as the Kirin 935. The instruction set used is ARMv7-A, which is slightly older than the Kirin 935's ARMv8-A. The lithography size is 28 nm, similar to the Kirin 935, suggesting a comparable manufacturing process. The TDP is also 7 Watts, indicating similar power consumption.
In conclusion, the HiSilicon Kirin 935 offers a more advanced architecture and twice as many cores compared to the Unisoc SC7731E. It also utilizes the newer ARMv8-A instruction set for better software compatibility. However, both processors share the same lithography size and TDP, suggesting they may have similar power consumption levels. Ultimately, the Kirin 935 is likely to deliver better performance and multitasking capabilities compared to the SC7731E.
Starting with the HiSilicon Kirin 935, it features an architecture of 4x 2.2 GHz Cortex-A53 and 4x 1.5 GHz Cortex-A53 cores. With a total of 8 cores, this processor offers a powerful performance for multitasking and running demanding applications. The instruction set used is ARMv8-A, which ensures compatibility with the latest software and technologies. The lithography of 28 nm indicates its manufacturing process, which may not be as efficient as newer processors with smaller lithography sizes. However, it still delivers decent performance. The number of transistors is 1000 million, suggesting a good level of hardware integration. The TDP (Thermal Design Power) is 7 Watts, indicating moderate power consumption.
On the other hand, the Unisoc SC7731E has an architecture of 4x 1.3 GHz Cortex-A7 cores. With only 4 cores, this processor may not provide as much processing power as the Kirin 935. The instruction set used is ARMv7-A, which is slightly older than the Kirin 935's ARMv8-A. The lithography size is 28 nm, similar to the Kirin 935, suggesting a comparable manufacturing process. The TDP is also 7 Watts, indicating similar power consumption.
In conclusion, the HiSilicon Kirin 935 offers a more advanced architecture and twice as many cores compared to the Unisoc SC7731E. It also utilizes the newer ARMv8-A instruction set for better software compatibility. However, both processors share the same lithography size and TDP, suggesting they may have similar power consumption levels. Ultimately, the Kirin 935 is likely to deliver better performance and multitasking capabilities compared to the SC7731E.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
4x 1.3 GHz – Cortex-A7 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8-A | ARMv7-A |
Lithography | 28 nm | 28 nm |
Number of transistors | 1000 million | |
TDP | 7 Watt | 7 Watt |
Memory (RAM)
Max amount | up to 8 GB | up to 1 GB |
Memory type | LPDDR3 | LPDDR3 |
Memory frequency | 800 MHz | 533 MHz |
Memory-bus | 2x32 bit |
Storage
Storage specification | UFS 2.0 | eMMC 5.1 |
Graphics
GPU name | Mali-T628 MP4 | Mali-T820 MP1 |
GPU Architecture | Midgard | Midgard |
GPU frequency | 680 MHz | 600 MHz |
Execution units | 4 | 1 |
Shaders | 64 | 4 |
DirectX | 11 | 11 |
OpenCL API | 1.2 | 1.2 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 1440x720 |
Max camera resolution | 1x 20MP | 1x 8MP |
Max Video Capture | 4K@30fps | HD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | |
Peak Upload Speed | 0.05 Gbps | |
Wi-Fi | 5 (802.11ac) | 4 (802.11n) |
Bluetooth | 4.2 | 4.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2018 Quarter 2 |
Partnumber | Hi3635 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
HiSilicon Kirin 9000 5G vs MediaTek Dimensity 6100 Plus
2
MediaTek Helio P95 vs Unisoc SC9863A
3
Qualcomm Snapdragon 778G vs Qualcomm Snapdragon 675
4
HiSilicon Kirin 710F vs Unisoc Tanggula T760 5G
5
Qualcomm Snapdragon 690 vs Qualcomm Snapdragon 8 Plus Gen 1
6
Unisoc Tiger T700 vs Qualcomm Snapdragon 888 Plus
7
Qualcomm Snapdragon 730G vs Qualcomm Snapdragon 765G
8
Qualcomm Snapdragon 662 vs MediaTek Dimensity 9200 Plus
9
Apple A17 Pro vs MediaTek Dimensity 6020
10
Qualcomm Snapdragon 665 vs Qualcomm Snapdragon 680