HiSilicon Kirin 935 vs MediaTek Dimensity 930

The HiSilicon Kirin 935 and MediaTek Dimensity 930 are two processors with different specifications. Let's compare them based on their CPU cores and architecture, instruction sets, lithography, TDP, and additional features.

Starting with the CPU cores and architecture, the Kirin 935 features 4x 2.2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores, totaling 8 cores. On the other hand, the Dimensity 930 has 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores, again totaling 8 cores. Both processors support ARMv8-A instruction set, which ensures compatibility with modern software and applications.

Moving on to lithography, the Kirin 935 is manufactured using a 28 nm process, which is slightly outdated compared to the Dimensity 930's more advanced 6 nm process. A smaller lithography generally results in better performance and power efficiency.

In terms of thermal design power (TDP), the Kirin 935 has a lower TDP of 7 Watts, whereas the Dimensity 930 has a slightly higher TDP of 10 Watts. A lower TDP usually means lower heat generation and better power efficiency.

While both processors excel in their specifications so far, the Dimensity 930 distinguishes itself with the inclusion of a Neural Processing Unit (NPU). This additional feature enables the processor to carry out specialized machine learning and artificial intelligence tasks with greater efficiency, making it an attractive option for applications that heavily rely on AI algorithms.

To summarize, the HiSilicon Kirin 935 and MediaTek Dimensity 930 are both capable processors with their unique specifications. The Kirin 935 offers a combination of Cortex-A53 cores and a lower TDP, while the Dimensity 930 boasts a more advanced lithography process, faster Cortex-A78 cores, and the inclusion of an NPU. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the user or device manufacturer.