HiSilicon Kirin 935 vs MediaTek Dimensity 900
The HiSilicon Kirin 935 and the MediaTek Dimensity 900 are two processors with different specifications.
Starting with the HiSilicon Kirin 935, it features an architecture comprised of 4 Cortex-A53 cores clocked at 2.2 GHz and 4 Cortex-A53 cores clocked at 1.5 GHz. With a total of 8 cores, it is capable of handling multiple tasks efficiently. This processor utilizes the ARMv8-A instruction set and has a lithography of 28 nm, indicating its fabrication process. With 1000 million transistors, it offers a significant level of computational power. Additionally, the TDP (Thermal Design Power) of this processor is 7 Watt, providing a balance between performance and power consumption.
On the other hand, the MediaTek Dimensity 900 processor boasts an architecture consisting of 2 Cortex-A78 cores clocked at 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. Similar to the Kirin 935, it also features 8 cores, enhancing multitasking capabilities. The instruction set used by this processor is ARMv8.2-A, offering improved performance over its predecessor. With a lithography of 6 nm, it showcases a more advanced fabrication technology. The MediaTek Dimensity 900 exceeds the Kirin 935 in terms of transistor count with 10000 million transistors, indicating a higher level of processing power. Furthermore, it has a TDP of 10 Watt, suggesting slightly higher power consumption.
One notable difference between these two processors is the inclusion of a Neural Processing Unit (NPU) in the MediaTek Dimensity 900. This specialized component enables accelerated AI tasks, enhancing the overall performance for artificial intelligence-related applications.
Overall, the MediaTek Dimensity 900 stands out with its more advanced architecture, smaller lithography, increased transistor count, and the inclusion of an NPU. However, the HiSilicon Kirin 935 still demonstrates respectable specifications with its balanced performance, lower power consumption, and capable core configuration. The choice between these processors would depend on specific requirements and usage scenarios.
Starting with the HiSilicon Kirin 935, it features an architecture comprised of 4 Cortex-A53 cores clocked at 2.2 GHz and 4 Cortex-A53 cores clocked at 1.5 GHz. With a total of 8 cores, it is capable of handling multiple tasks efficiently. This processor utilizes the ARMv8-A instruction set and has a lithography of 28 nm, indicating its fabrication process. With 1000 million transistors, it offers a significant level of computational power. Additionally, the TDP (Thermal Design Power) of this processor is 7 Watt, providing a balance between performance and power consumption.
On the other hand, the MediaTek Dimensity 900 processor boasts an architecture consisting of 2 Cortex-A78 cores clocked at 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. Similar to the Kirin 935, it also features 8 cores, enhancing multitasking capabilities. The instruction set used by this processor is ARMv8.2-A, offering improved performance over its predecessor. With a lithography of 6 nm, it showcases a more advanced fabrication technology. The MediaTek Dimensity 900 exceeds the Kirin 935 in terms of transistor count with 10000 million transistors, indicating a higher level of processing power. Furthermore, it has a TDP of 10 Watt, suggesting slightly higher power consumption.
One notable difference between these two processors is the inclusion of a Neural Processing Unit (NPU) in the MediaTek Dimensity 900. This specialized component enables accelerated AI tasks, enhancing the overall performance for artificial intelligence-related applications.
Overall, the MediaTek Dimensity 900 stands out with its more advanced architecture, smaller lithography, increased transistor count, and the inclusion of an NPU. However, the HiSilicon Kirin 935 still demonstrates respectable specifications with its balanced performance, lower power consumption, and capable core configuration. The choice between these processors would depend on specific requirements and usage scenarios.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 6 nm |
Number of transistors | 1000 million | 10000 million |
TDP | 7 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR3 | LPDDR5 |
Memory frequency | 800 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 3.1 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G68 MP4 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 680 MHz | 900 MHz |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 11 | 12 |
OpenCL API | 1.2 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 2520x1080@120Hz |
Max camera resolution | 1x 20MP | 1x 108MP, 2x 20MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2021 Quarter 1 |
Partnumber | Hi3635 | MT6877 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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