HiSilicon Kirin 935 vs MediaTek Dimensity 820

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The HiSilicon Kirin 935 and the MediaTek Dimensity 820 are two processors that come with their own set of specifications and features. Let's dive into the details and compare them.

Starting with the HiSilicon Kirin 935, it is built on a 28 nm lithography process and consists of eight CPU cores. Its CPU architecture includes four Cortex-A53 cores running at a clock speed of 2.2 GHz and another four Cortex-A53 cores running at 1.5 GHz. The instruction set for this processor is ARMv8-A, which ensures compatibility with the majority of modern apps and software. It has a total of 1000 million transistors and a thermal design power (TDP) of 7 watts.

On the other hand, the MediaTek Dimensity 820 is fabricated using a smaller 7 nm lithography process. Like the Kirin 935, it also features eight CPU cores. However, the CPU architecture is slightly different. It includes four Cortex-A76 cores clocked at 2.6 GHz for high-performance tasks and another four Cortex-A55 cores running at 2.0 GHz for power efficiency. The instruction set supported by this processor is ARMv8.2-A, which offers improved performance over its predecessor. In terms of TDP, the Dimensity 820 consumes 10 watts. Additionally, it boasts a Neural Processing Unit (NPU), which enhances performance in artificial intelligence and machine learning tasks.

Considering the specifications, both processors have their own strengths and weaknesses. The Kirin 935 operates on an older lithography process and offers a lower clock speed, which might result in slightly lower performance compared to the Dimensity 820. However, its lower TDP could make it a more power-efficient option. On the other hand, the Dimensity 820's advanced 7 nm lithography and higher clock speeds provide better performance potential, especially for demanding tasks. Furthermore, the inclusion of an NPU gives the Dimensity 820 an edge in AI-related workloads.

It's worth noting that performance and power efficiency also depend on other factors, such as software optimization and overall system design. Therefore, it is advised to consider these processors in conjunction with other device specifications to make an informed decision based on specific requirements.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A53
4x 1.5 GHz – Cortex-A53
4x 2.6 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 28 nm 7 nm
Number of transistors 1000 million
TDP 7 Watt 10 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR3 LPDDR4X
Memory frequency 800 MHz 2133 MHz
Memory-bus 2x32 bit 2x16 bit

Storage

Storage specification UFS 2.0 UFS 2.2

Graphics

GPU name Mali-T628 MP4 Mali-G57 MP5
GPU Architecture Midgard Valhall
GPU frequency 680 MHz 650 MHz
Execution units 4 5
Shaders 64 80
DirectX 11 12
OpenCL API 1.2 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2560x1600 2520x1080@120Hz
Max camera resolution 1x 20MP 1x 80MP, 1x 32MP + 1x 16MP
Max Video Capture 4K@30fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.3 Gbps 2.77 Gbps
Peak Upload Speed 0.05 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2015 Quarter 2 2020 May
Partnumber Hi3635 MT6875
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 935
Dimensity 820
403227

GeekBench 6 Single-Core

Score
Kirin 935
Dimensity 820
615

GeekBench 6 Multi-Core

Score
Kirin 935
Dimensity 820
1924