HiSilicon Kirin 935 vs MediaTek Dimensity 820
The HiSilicon Kirin 935 and the MediaTek Dimensity 820 are two processors that come with their own set of specifications and features. Let's dive into the details and compare them.
Starting with the HiSilicon Kirin 935, it is built on a 28 nm lithography process and consists of eight CPU cores. Its CPU architecture includes four Cortex-A53 cores running at a clock speed of 2.2 GHz and another four Cortex-A53 cores running at 1.5 GHz. The instruction set for this processor is ARMv8-A, which ensures compatibility with the majority of modern apps and software. It has a total of 1000 million transistors and a thermal design power (TDP) of 7 watts.
On the other hand, the MediaTek Dimensity 820 is fabricated using a smaller 7 nm lithography process. Like the Kirin 935, it also features eight CPU cores. However, the CPU architecture is slightly different. It includes four Cortex-A76 cores clocked at 2.6 GHz for high-performance tasks and another four Cortex-A55 cores running at 2.0 GHz for power efficiency. The instruction set supported by this processor is ARMv8.2-A, which offers improved performance over its predecessor. In terms of TDP, the Dimensity 820 consumes 10 watts. Additionally, it boasts a Neural Processing Unit (NPU), which enhances performance in artificial intelligence and machine learning tasks.
Considering the specifications, both processors have their own strengths and weaknesses. The Kirin 935 operates on an older lithography process and offers a lower clock speed, which might result in slightly lower performance compared to the Dimensity 820. However, its lower TDP could make it a more power-efficient option. On the other hand, the Dimensity 820's advanced 7 nm lithography and higher clock speeds provide better performance potential, especially for demanding tasks. Furthermore, the inclusion of an NPU gives the Dimensity 820 an edge in AI-related workloads.
It's worth noting that performance and power efficiency also depend on other factors, such as software optimization and overall system design. Therefore, it is advised to consider these processors in conjunction with other device specifications to make an informed decision based on specific requirements.
Starting with the HiSilicon Kirin 935, it is built on a 28 nm lithography process and consists of eight CPU cores. Its CPU architecture includes four Cortex-A53 cores running at a clock speed of 2.2 GHz and another four Cortex-A53 cores running at 1.5 GHz. The instruction set for this processor is ARMv8-A, which ensures compatibility with the majority of modern apps and software. It has a total of 1000 million transistors and a thermal design power (TDP) of 7 watts.
On the other hand, the MediaTek Dimensity 820 is fabricated using a smaller 7 nm lithography process. Like the Kirin 935, it also features eight CPU cores. However, the CPU architecture is slightly different. It includes four Cortex-A76 cores clocked at 2.6 GHz for high-performance tasks and another four Cortex-A55 cores running at 2.0 GHz for power efficiency. The instruction set supported by this processor is ARMv8.2-A, which offers improved performance over its predecessor. In terms of TDP, the Dimensity 820 consumes 10 watts. Additionally, it boasts a Neural Processing Unit (NPU), which enhances performance in artificial intelligence and machine learning tasks.
Considering the specifications, both processors have their own strengths and weaknesses. The Kirin 935 operates on an older lithography process and offers a lower clock speed, which might result in slightly lower performance compared to the Dimensity 820. However, its lower TDP could make it a more power-efficient option. On the other hand, the Dimensity 820's advanced 7 nm lithography and higher clock speeds provide better performance potential, especially for demanding tasks. Furthermore, the inclusion of an NPU gives the Dimensity 820 an edge in AI-related workloads.
It's worth noting that performance and power efficiency also depend on other factors, such as software optimization and overall system design. Therefore, it is advised to consider these processors in conjunction with other device specifications to make an informed decision based on specific requirements.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
4x 2.6 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 7 nm |
Number of transistors | 1000 million | |
TDP | 7 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 800 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.2 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G57 MP5 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 680 MHz | 650 MHz |
Execution units | 4 | 5 |
Shaders | 64 | 80 |
DirectX | 11 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 2520x1080@120Hz |
Max camera resolution | 1x 20MP | 1x 80MP, 1x 32MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2020 May |
Partnumber | Hi3635 | MT6875 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Qualcomm Snapdragon 632 vs Qualcomm Snapdragon 665
2
Qualcomm Snapdragon 695 vs Samsung Exynos 7870
3
Samsung Exynos 8895 vs MediaTek Helio A25
4
MediaTek Dimensity 6020 vs HiSilicon Kirin 710A
5
HiSilicon Kirin 970 vs MediaTek Dimensity 800U
6
Google Tensor G1 vs HiSilicon Kirin 930
7
Qualcomm Snapdragon 662 vs Qualcomm Snapdragon 888
8
MediaTek Helio G80 vs MediaTek Dimensity 1100
9
MediaTek Dimensity 8100 vs HiSilicon Kirin 990 5G
10
HiSilicon Kirin 9000 5G vs Unisoc Tiger T606