HiSilicon Kirin 935 vs MediaTek Dimensity 800U
When comparing the specifications of the HiSilicon Kirin 935 and the MediaTek Dimensity 800U processors, several differences can be observed.
Starting with the CPU cores and architecture, the HiSilicon Kirin 935 features an architecture of 4x 2.2 GHz Cortex-A53 and 4x 1.5 GHz Cortex-A53 cores. On the other hand, the MediaTek Dimensity 800U boasts an architecture of 2x 2.4 GHz Cortex-A76 and 6x 2.0 GHz Cortex-A55 cores. This indicates that the Dimensity 800U has a higher clock speed with its Cortex-A76 cores, potentially providing better performance in tasks that demand higher processing power.
Both processors have 8 cores, providing a good balance between power and efficiency. The instruction set for the Kirin 935 is ARMv8-A, while the Dimensity 800U utilizes the ARMv8.2-A instruction set. This suggests that the Dimensity 800U may offer more advanced features and optimizations, resulting in improved performance and efficiency.
In terms of lithography, the Kirin 935 uses a 28 nm process, while the Dimensity 800U employs a more advanced 7 nm process. A smaller lithography generally implies better power efficiency and potentially higher performance, as it allows for more transistors to be packed onto the chip.
Speaking of transistors, the Kirin 935 consists of 1000 million transistors, although no information is provided for the Dimensity 800U in this regard. This could mean that the Dimensity 800U either has a similar number of transistors or possibly even more, which would indicate a more advanced and sophisticated chip design.
Another notable difference is that the Dimensity 800U features a Neural Processing Unit (NPU), which the Kirin 935 does not have. This NPU can greatly enhance AI-related tasks by accelerating machine learning algorithms.
To summarize, the MediaTek Dimensity 800U showcases several advantages over the HiSilicon Kirin 935, including a higher clock speed, a more advanced lithography process, a potentially higher number of transistors, and the inclusion of an NPU. These specifications suggest that the Dimensity 800U might deliver better performance, power efficiency, and AI capabilities compared to the Kirin 935.
Starting with the CPU cores and architecture, the HiSilicon Kirin 935 features an architecture of 4x 2.2 GHz Cortex-A53 and 4x 1.5 GHz Cortex-A53 cores. On the other hand, the MediaTek Dimensity 800U boasts an architecture of 2x 2.4 GHz Cortex-A76 and 6x 2.0 GHz Cortex-A55 cores. This indicates that the Dimensity 800U has a higher clock speed with its Cortex-A76 cores, potentially providing better performance in tasks that demand higher processing power.
Both processors have 8 cores, providing a good balance between power and efficiency. The instruction set for the Kirin 935 is ARMv8-A, while the Dimensity 800U utilizes the ARMv8.2-A instruction set. This suggests that the Dimensity 800U may offer more advanced features and optimizations, resulting in improved performance and efficiency.
In terms of lithography, the Kirin 935 uses a 28 nm process, while the Dimensity 800U employs a more advanced 7 nm process. A smaller lithography generally implies better power efficiency and potentially higher performance, as it allows for more transistors to be packed onto the chip.
Speaking of transistors, the Kirin 935 consists of 1000 million transistors, although no information is provided for the Dimensity 800U in this regard. This could mean that the Dimensity 800U either has a similar number of transistors or possibly even more, which would indicate a more advanced and sophisticated chip design.
Another notable difference is that the Dimensity 800U features a Neural Processing Unit (NPU), which the Kirin 935 does not have. This NPU can greatly enhance AI-related tasks by accelerating machine learning algorithms.
To summarize, the MediaTek Dimensity 800U showcases several advantages over the HiSilicon Kirin 935, including a higher clock speed, a more advanced lithography process, a potentially higher number of transistors, and the inclusion of an NPU. These specifications suggest that the Dimensity 800U might deliver better performance, power efficiency, and AI capabilities compared to the Kirin 935.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 7 nm |
Number of transistors | 1000 million | |
TDP | 7 Watt | |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 12 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 800 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.2 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G57 MP3 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 680 MHz | 850 MHz |
Execution units | 4 | 3 |
Shaders | 64 | 48 |
DirectX | 11 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 2520x1080@120Hz |
Max camera resolution | 1x 20MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2020 Quarter 3 |
Partnumber | Hi3635 | MT6853V, MT6853V/TNZA, MT6853/TNZA, MT6853T |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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