HiSilicon Kirin 935 vs HiSilicon Kirin 9000E 5G
The HiSilicon Kirin 935 and HiSilicon Kirin 9000E 5G are two processors that differ significantly in terms of their specifications.
Starting with the HiSilicon Kirin 935, it features a total of 8 cores with an architecture of 4x 2.2 GHz Cortex-A53 and 4x 1.5 GHz Cortex-A53. This processor utilizes the ARMv8-A instruction set and has a lithography of 28 nm. It contains approximately 1000 million transistors and operates at a TDP of 7 Watts.
On the other hand, the HiSilicon Kirin 9000E 5G offers a more advanced architecture and specifications. It also consists of 8 cores, but with a different architecture distribution. It includes 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. The instruction set for this processor is ARMv8.2-A. The lithography has significantly improved to 5 nm, resulting in enhanced performance. The number of transistors has also increased to approximately 15300 million, indicating an upgraded level of processing power. The TDP for the HiSilicon Kirin 9000E 5G is 6 Watts.
In addition, the HiSilicon Kirin 9000E 5G boasts advanced neural processing capabilities with its Ascend Lite + Ascend Tiny technology, featuring the HUAWEI Da Vinci Architecture 2.0. This neural processing capability further enhances the performance of the processor, allowing for improved artificial intelligence and machine learning capabilities.
Overall, while the HiSilicon Kirin 935 is a capable processor with a decent performance for its time, the HiSilicon Kirin 9000E 5G is a more advanced and efficient processor with superior specifications. The improved architecture, smaller lithography, increased number of transistors, and enhanced neural processing make it a formidable processor for high-performance tasks and demanding applications.
Starting with the HiSilicon Kirin 935, it features a total of 8 cores with an architecture of 4x 2.2 GHz Cortex-A53 and 4x 1.5 GHz Cortex-A53. This processor utilizes the ARMv8-A instruction set and has a lithography of 28 nm. It contains approximately 1000 million transistors and operates at a TDP of 7 Watts.
On the other hand, the HiSilicon Kirin 9000E 5G offers a more advanced architecture and specifications. It also consists of 8 cores, but with a different architecture distribution. It includes 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. The instruction set for this processor is ARMv8.2-A. The lithography has significantly improved to 5 nm, resulting in enhanced performance. The number of transistors has also increased to approximately 15300 million, indicating an upgraded level of processing power. The TDP for the HiSilicon Kirin 9000E 5G is 6 Watts.
In addition, the HiSilicon Kirin 9000E 5G boasts advanced neural processing capabilities with its Ascend Lite + Ascend Tiny technology, featuring the HUAWEI Da Vinci Architecture 2.0. This neural processing capability further enhances the performance of the processor, allowing for improved artificial intelligence and machine learning capabilities.
Overall, while the HiSilicon Kirin 935 is a capable processor with a decent performance for its time, the HiSilicon Kirin 9000E 5G is a more advanced and efficient processor with superior specifications. The improved architecture, smaller lithography, increased number of transistors, and enhanced neural processing make it a formidable processor for high-performance tasks and demanding applications.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 5 nm |
Number of transistors | 1000 million | 15300 million |
TDP | 7 Watt | 6 Watt |
Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR3 | LPDDR5 |
Memory frequency | 800 MHz | 2750 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 3.1 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G78 MP22 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 680 MHz | 760 MHz |
Execution units | 4 | 22 |
Shaders | 64 | 352 |
DirectX | 11 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 3840x2160 |
Max camera resolution | 1x 20MP | |
Max Video Capture | 4K@30fps | 4K@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 4.6 Gbps |
Peak Upload Speed | 0.05 Gbps | 2.5 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2020 October |
Partnumber | Hi3635 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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