HiSilicon Kirin 930 vs Unisoc Tiger T310
When comparing the specifications of the HiSilicon Kirin 930 and the Unisoc Tiger T310 processors, several differences become apparent.
In terms of architecture, the HiSilicon Kirin 930 features a combination of 4x 2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. On the other hand, the Unisoc Tiger T310 is built with 1x 2 GHz Cortex-A75 core and 3x 1.8 GHz Cortex-A55 cores. This indicates that the HiSilicon processor has a higher number of lower-speed cores, while the Unisoc processor has fewer but higher-speed cores.
While the HiSilicon Kirin 930 boasts 8 cores, the Unisoc Tiger T310 only has 4 cores. Additionally, the Kirin 930 supports the ARMv8-A instruction set, whereas the Tiger T310 supports the newer ARMv8.2-A.
The manufacturing process, also known as lithography, is another point of distinction between the processors. The HiSilicon Kirin 930 is fabricated using a 28 nm process, while the Unisoc Tiger T310 utilizes a more advanced 12 nm process. This means that the Unisoc processor offers a smaller transistor size and potentially lower power consumption.
When it comes to the number of transistors, the HiSilicon Kirin 930 has around 1000 million, whereas this information is not provided for the Unisoc Tiger T310.
Finally, the thermal design power (TDP) of the HiSilicon Kirin 930 is stated as 5 Watt, while no TDP information is given for the Unisoc Tiger T310.
Overall, the HiSilicon Kirin 930 and the Unisoc Tiger T310 processors differ in terms of their core configuration, instruction set support, lithography, and provided specifications. These differences may lead to variations in performance, power efficiency, and capabilities between the two processors.
In terms of architecture, the HiSilicon Kirin 930 features a combination of 4x 2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. On the other hand, the Unisoc Tiger T310 is built with 1x 2 GHz Cortex-A75 core and 3x 1.8 GHz Cortex-A55 cores. This indicates that the HiSilicon processor has a higher number of lower-speed cores, while the Unisoc processor has fewer but higher-speed cores.
While the HiSilicon Kirin 930 boasts 8 cores, the Unisoc Tiger T310 only has 4 cores. Additionally, the Kirin 930 supports the ARMv8-A instruction set, whereas the Tiger T310 supports the newer ARMv8.2-A.
The manufacturing process, also known as lithography, is another point of distinction between the processors. The HiSilicon Kirin 930 is fabricated using a 28 nm process, while the Unisoc Tiger T310 utilizes a more advanced 12 nm process. This means that the Unisoc processor offers a smaller transistor size and potentially lower power consumption.
When it comes to the number of transistors, the HiSilicon Kirin 930 has around 1000 million, whereas this information is not provided for the Unisoc Tiger T310.
Finally, the thermal design power (TDP) of the HiSilicon Kirin 930 is stated as 5 Watt, while no TDP information is given for the Unisoc Tiger T310.
Overall, the HiSilicon Kirin 930 and the Unisoc Tiger T310 processors differ in terms of their core configuration, instruction set support, lithography, and provided specifications. These differences may lead to variations in performance, power efficiency, and capabilities between the two processors.
CPU cores and architecture
Architecture | 4x 2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
1x 2 GHz – Cortex-A75 3x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 12 nm |
Number of transistors | 1000 million | |
TDP | 5 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 4 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 800 MHz | 1333 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | eMMC 5.1 |
Graphics
GPU name | Mali-T628 MP4 | Imagination PowerVR GE8300 |
GPU Architecture | Midgard | Rogue |
GPU frequency | 600 MHz | 660 MHz |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 11 | 10 |
OpenCL API | 1.2 | 3.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 1600x720 |
Max camera resolution | 1x 20MP | 1x 16MP + 1x 8MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.05 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2019 April |
Partnumber | Hi3630 | T310 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
HiSilicon Kirin 970 vs Unisoc Tiger T310
2
Qualcomm Snapdragon 695 vs Qualcomm Snapdragon 632
3
Samsung Exynos 1380 vs MediaTek Helio P60
4
MediaTek Dimensity 800U vs MediaTek Dimensity 9000
5
MediaTek Helio G96 vs MediaTek Helio P35
6
Qualcomm Snapdragon 730G vs Samsung Exynos 9609
7
MediaTek Dimensity 1000L vs Samsung Exynos 9810
8
Unisoc SC9832E vs MediaTek Dimensity 920
9
MediaTek Dimensity 9200 Plus vs Qualcomm Snapdragon 7 Plus Gen 2
10
MediaTek Dimensity 8000 vs HiSilicon Kirin 985 5G