HiSilicon Kirin 930 vs Unisoc Tanggula T770 5G

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The HiSilicon Kirin 930 and the Unisoc Tanggula T770 5G are two processors with different specifications. Let's compare them based on their specifications.

Starting with the HiSilicon Kirin 930, it has a CPU architecture consisting of 4x 2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. This processor features 8 cores in total. It operates on the ARMv8-A instruction set and has a lithography of 28 nm. With a TDP of 5 watts and 1000 million transistors, the Kirin 930 offers decent performance for its specifications.

Now, let's move on to the Unisoc Tanggula T770 5G. This processor has a more advanced architecture consisting of 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. Like the Kirin 930, it also features 8 cores. The Tanggula T770 5G operates on the ARMv8.2-A instruction set and boasts a lithography of 6 nm. With a TDP of 5 watts, it offers similar power efficiency as the Kirin 930. However, what sets it apart is the inclusion of a Neural Processing Unit (NPU), which enhances its capabilities in handling AI-related tasks.

When comparing these two processors, it is clear that the Unisoc Tanggula T770 5G has a more powerful architecture with a higher clock speed across its cores. Additionally, its lithography is more advanced, indicating better power efficiency. The inclusion of an NPU further enhances its performance, especially in AI tasks.

On the other hand, the HiSilicon Kirin 930, while not as powerful as the Tanggula T770, still offers decent performance with its 8 cores and lower clock speeds. Its older 28 nm lithography might make it slightly less power-efficient compared to the 6 nm Tanggula T770.

In conclusion, the Unisoc Tanggula T770 5G outperforms the HiSilicon Kirin 930 in terms of architecture, clock speeds, power efficiency, and the inclusion of an NPU. However, the Kirin 930 still holds its ground with its respectable specifications, making it a reliable option for those looking for a processor with decent performance.

CPU cores and architecture

Architecture 4x 2 GHz – Cortex-A53
4x 1.5 GHz – Cortex-A53
1x 2.5 GHz – Cortex-A76
3x 2.2 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 28 nm 6 nm
Number of transistors 1000 million
TDP 5 Watt 5 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 32 GB
Memory type LPDDR3 LPDDR4X
Memory frequency 800 MHz 2133 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.0 UFS 3.1

Graphics

GPU name Mali-T628 MP4 Mali-G57 MP6
GPU Architecture Midgard Valhall
GPU frequency 600 MHz 850 MHz
Execution units 4 6
Shaders 64 96
DirectX 11 12
OpenCL API 1.2 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2560x1600 2160x1080@120Hz
Max camera resolution 1x 20MP 1x 108MP, 2x 24MP
Max Video Capture 4K@30fps FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
H.264 (AVC)
H.265 (HEVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.3 Gbps 2.7 Gbps
Peak Upload Speed 0.05 Gbps 1.5 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.0
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2015 Quarter 2 2021 February
Partnumber Hi3630 T770, Tiger T7520
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 930
Tanggula T770 5G
342190

GeekBench 6 Single-Core

Score
Kirin 930
Tanggula T770 5G
659

GeekBench 6 Multi-Core

Score
Kirin 930
Tanggula T770 5G
2635