HiSilicon Kirin 930 vs Unisoc Tanggula T770 5G
The HiSilicon Kirin 930 and the Unisoc Tanggula T770 5G are two processors with different specifications. Let's compare them based on their specifications.
Starting with the HiSilicon Kirin 930, it has a CPU architecture consisting of 4x 2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. This processor features 8 cores in total. It operates on the ARMv8-A instruction set and has a lithography of 28 nm. With a TDP of 5 watts and 1000 million transistors, the Kirin 930 offers decent performance for its specifications.
Now, let's move on to the Unisoc Tanggula T770 5G. This processor has a more advanced architecture consisting of 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. Like the Kirin 930, it also features 8 cores. The Tanggula T770 5G operates on the ARMv8.2-A instruction set and boasts a lithography of 6 nm. With a TDP of 5 watts, it offers similar power efficiency as the Kirin 930. However, what sets it apart is the inclusion of a Neural Processing Unit (NPU), which enhances its capabilities in handling AI-related tasks.
When comparing these two processors, it is clear that the Unisoc Tanggula T770 5G has a more powerful architecture with a higher clock speed across its cores. Additionally, its lithography is more advanced, indicating better power efficiency. The inclusion of an NPU further enhances its performance, especially in AI tasks.
On the other hand, the HiSilicon Kirin 930, while not as powerful as the Tanggula T770, still offers decent performance with its 8 cores and lower clock speeds. Its older 28 nm lithography might make it slightly less power-efficient compared to the 6 nm Tanggula T770.
In conclusion, the Unisoc Tanggula T770 5G outperforms the HiSilicon Kirin 930 in terms of architecture, clock speeds, power efficiency, and the inclusion of an NPU. However, the Kirin 930 still holds its ground with its respectable specifications, making it a reliable option for those looking for a processor with decent performance.
Starting with the HiSilicon Kirin 930, it has a CPU architecture consisting of 4x 2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. This processor features 8 cores in total. It operates on the ARMv8-A instruction set and has a lithography of 28 nm. With a TDP of 5 watts and 1000 million transistors, the Kirin 930 offers decent performance for its specifications.
Now, let's move on to the Unisoc Tanggula T770 5G. This processor has a more advanced architecture consisting of 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. Like the Kirin 930, it also features 8 cores. The Tanggula T770 5G operates on the ARMv8.2-A instruction set and boasts a lithography of 6 nm. With a TDP of 5 watts, it offers similar power efficiency as the Kirin 930. However, what sets it apart is the inclusion of a Neural Processing Unit (NPU), which enhances its capabilities in handling AI-related tasks.
When comparing these two processors, it is clear that the Unisoc Tanggula T770 5G has a more powerful architecture with a higher clock speed across its cores. Additionally, its lithography is more advanced, indicating better power efficiency. The inclusion of an NPU further enhances its performance, especially in AI tasks.
On the other hand, the HiSilicon Kirin 930, while not as powerful as the Tanggula T770, still offers decent performance with its 8 cores and lower clock speeds. Its older 28 nm lithography might make it slightly less power-efficient compared to the 6 nm Tanggula T770.
In conclusion, the Unisoc Tanggula T770 5G outperforms the HiSilicon Kirin 930 in terms of architecture, clock speeds, power efficiency, and the inclusion of an NPU. However, the Kirin 930 still holds its ground with its respectable specifications, making it a reliable option for those looking for a processor with decent performance.
CPU cores and architecture
Architecture | 4x 2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 6 nm |
Number of transistors | 1000 million | |
TDP | 5 Watt | 5 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 32 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 800 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 3.1 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G57 MP6 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 600 MHz | 850 MHz |
Execution units | 4 | 6 |
Shaders | 64 | 96 |
DirectX | 11 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 2160x1080@120Hz |
Max camera resolution | 1x 20MP | 1x 108MP, 2x 24MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.7 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.5 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2021 February |
Partnumber | Hi3630 | T770, Tiger T7520 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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