HiSilicon Kirin 930 vs Unisoc Tanggula T740 5G
The HiSilicon Kirin 930 and the Unisoc Tanggula T740 5G are two processors with varying specifications. Let's compare them based on their key features.
In terms of CPU cores and architecture, the Kirin 930 features 8 cores, divided into 4 Cortex-A53 cores running at 2 GHz and another 4 Cortex-A53 cores clocked at 1.5 GHz. On the other hand, the Tanggula T740 5G also has 8 cores, but they are split between 4 Cortex-A75 cores operating at 1.8 GHz and 4 Cortex-A55 cores at the same clock speed.
The instruction set of the Kirin 930 is designated as ARMv8-A, while the Tanggula T740 5G utilizes the ARMv8.2-A instruction set. This indicates a more recent version for the latter, which may offer improved performance and efficiency.
Another point of differentiation is the lithography. The Kirin 930 is manufactured using a 28 nm process, while the Tanggula T740 5G is built on a smaller 12 nm lithography. Generally, a smaller lithography allows for higher power efficiency and better overall performance.
In terms of transistors, the Kirin 930 has approximately 1000 million transistors. Unfortunately, no information is provided about the number of transistors present in the Tanggula T740 5G.
Lastly, the Kirin 930 has a thermal design power (TDP) of 5 Watts, which indicates the amount of power the processor can dissipate while operating under normal conditions. However, this information is not available for the Tanggula T740 5G.
A notable feature of the Tanggula T740 5G is its dual neural processing unit (NPU), indicating that it has specialized hardware for artificial intelligence tasks. The Kirin 930, on the other hand, does not provide any information regarding an NPU.
In summary, the Kirin 930 and the Tanggula T740 5G differ in various aspects. The Tanggula T740 5G offers a more advanced instruction set, a smaller lithography, and incorporates a dual NPU. However, certain specifications, such as the number of transistors and TDP, are not available for the Tanggula T740 5G, limiting a comprehensive comparison.
In terms of CPU cores and architecture, the Kirin 930 features 8 cores, divided into 4 Cortex-A53 cores running at 2 GHz and another 4 Cortex-A53 cores clocked at 1.5 GHz. On the other hand, the Tanggula T740 5G also has 8 cores, but they are split between 4 Cortex-A75 cores operating at 1.8 GHz and 4 Cortex-A55 cores at the same clock speed.
The instruction set of the Kirin 930 is designated as ARMv8-A, while the Tanggula T740 5G utilizes the ARMv8.2-A instruction set. This indicates a more recent version for the latter, which may offer improved performance and efficiency.
Another point of differentiation is the lithography. The Kirin 930 is manufactured using a 28 nm process, while the Tanggula T740 5G is built on a smaller 12 nm lithography. Generally, a smaller lithography allows for higher power efficiency and better overall performance.
In terms of transistors, the Kirin 930 has approximately 1000 million transistors. Unfortunately, no information is provided about the number of transistors present in the Tanggula T740 5G.
Lastly, the Kirin 930 has a thermal design power (TDP) of 5 Watts, which indicates the amount of power the processor can dissipate while operating under normal conditions. However, this information is not available for the Tanggula T740 5G.
A notable feature of the Tanggula T740 5G is its dual neural processing unit (NPU), indicating that it has specialized hardware for artificial intelligence tasks. The Kirin 930, on the other hand, does not provide any information regarding an NPU.
In summary, the Kirin 930 and the Tanggula T740 5G differ in various aspects. The Tanggula T740 5G offers a more advanced instruction set, a smaller lithography, and incorporates a dual NPU. However, certain specifications, such as the number of transistors and TDP, are not available for the Tanggula T740 5G, limiting a comprehensive comparison.
CPU cores and architecture
Architecture | 4x 2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
4x 1.8 GHz – Cortex-A75 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 12 nm |
Number of transistors | 1000 million | |
TDP | 5 Watt | |
Neural Processing | Dual NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 8 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 800 MHz | 1866 MHz |
Memory-bus | 2x32 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.1 |
Graphics
GPU name | Mali-T628 MP4 | Imagination PowerVR GM9446 |
GPU Architecture | Midgard | Rogue |
GPU frequency | 600 MHz | 800 MHz |
Execution units | 4 | |
Shaders | 64 | |
DirectX | 11 | |
OpenCL API | 1.2 | 4.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.1 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 2960x1440@60Hz |
Max camera resolution | 1x 20MP | 1x 64MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 1.5 Gbps |
Peak Upload Speed | 0.05 Gbps | 0.75 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2020 Quarter 1 |
Partnumber | Hi3630 | T740, Tiger T7510 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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