HiSilicon Kirin 930 vs MediaTek Dimensity 820
The HiSilicon Kirin 930 and MediaTek Dimensity 820 are two processors that offer impressive specifications for various devices.
Starting with the HiSilicon Kirin 930, it features an architecture with 4x 2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. This ensures a balanced performance for tasks that require both high power and energy efficiency. With its ARMv8-A instruction set, the processor can deliver optimal performance for a range of applications. Additionally, the 28 nm lithography allows for efficient power usage while maintaining a competitive performance level. The Kirin 930 also boasts 1000 million transistors, indicating a high level of integration and efficiency. With a TDP of 5 Watts, it proves to be an efficient choice for devices with strict power requirements.
On the other hand, the MediaTek Dimensity 820 offers an architecture with 4x 2.6 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. This configuration provides a powerful setup that is capable of handling demanding tasks with ease. With its ARMv8.2-A instruction set, the processor can offer improved performance and efficiency compared to its predecessors. The Dimensity 820 is built using an advanced 7 nm lithography, which allows for better power efficiency and overall performance. Additionally, this processor boasts a TDP of 10 watts, making it suitable for devices that require high levels of performance.
One notable feature of the Dimensity 820 is its Neural Processing Unit (NPU), which provides enhanced capabilities for machine learning and artificial intelligence tasks. This makes it an appealing choice for devices that heavily rely on AI technologies.
Overall, both processors offer impressive specifications that cater to different needs. The HiSilicon Kirin 930 excels in efficient power usage and integration, making it suitable for power-constrained devices. On the other hand, the MediaTek Dimensity 820 provides powerful performance and an advanced NPU, making it an excellent choice for AI-driven applications. Ultimately, the selection between the two processors will depend on the specific requirements of the device and the intended usage scenario.
Starting with the HiSilicon Kirin 930, it features an architecture with 4x 2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. This ensures a balanced performance for tasks that require both high power and energy efficiency. With its ARMv8-A instruction set, the processor can deliver optimal performance for a range of applications. Additionally, the 28 nm lithography allows for efficient power usage while maintaining a competitive performance level. The Kirin 930 also boasts 1000 million transistors, indicating a high level of integration and efficiency. With a TDP of 5 Watts, it proves to be an efficient choice for devices with strict power requirements.
On the other hand, the MediaTek Dimensity 820 offers an architecture with 4x 2.6 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. This configuration provides a powerful setup that is capable of handling demanding tasks with ease. With its ARMv8.2-A instruction set, the processor can offer improved performance and efficiency compared to its predecessors. The Dimensity 820 is built using an advanced 7 nm lithography, which allows for better power efficiency and overall performance. Additionally, this processor boasts a TDP of 10 watts, making it suitable for devices that require high levels of performance.
One notable feature of the Dimensity 820 is its Neural Processing Unit (NPU), which provides enhanced capabilities for machine learning and artificial intelligence tasks. This makes it an appealing choice for devices that heavily rely on AI technologies.
Overall, both processors offer impressive specifications that cater to different needs. The HiSilicon Kirin 930 excels in efficient power usage and integration, making it suitable for power-constrained devices. On the other hand, the MediaTek Dimensity 820 provides powerful performance and an advanced NPU, making it an excellent choice for AI-driven applications. Ultimately, the selection between the two processors will depend on the specific requirements of the device and the intended usage scenario.
CPU cores and architecture
Architecture | 4x 2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
4x 2.6 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 7 nm |
Number of transistors | 1000 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 800 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.2 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G57 MP5 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 600 MHz | 650 MHz |
Execution units | 4 | 5 |
Shaders | 64 | 80 |
DirectX | 11 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 2520x1080@120Hz |
Max camera resolution | 1x 20MP | 1x 80MP, 1x 32MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2020 May |
Partnumber | Hi3630 | MT6875 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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