HiSilicon Kirin 930 vs MediaTek Dimensity 810
The HiSilicon Kirin 930 and MediaTek Dimensity 810 are two processors commonly found in smartphones and other devices. Let's compare their specifications to understand how they differ.
Starting with the HiSilicon Kirin 930, it features a total of 8 cores, with an architecture that comprises 4 Cortex-A53 cores clocked at 2 GHz and another 4 Cortex-A53 cores clocked at 1.5 GHz. The processor operates on the ARMv8-A instruction set and is built on a 28 nm lithography process. It contains approximately 1000 million transistors and has a thermal design power (TDP) of 5 watts.
On the other hand, the MediaTek Dimensity 810 also boasts 8 cores. Its architecture is divided into 2 high-performance Cortex-A76 cores clocked at 2.4 GHz and 6 power-efficient Cortex-A55 cores clocked at 2.0 GHz. It uses the ARMv8.2-A instruction set and is manufactured using a more advanced 6 nm lithography process. With around 12000 million transistors, the Dimensity 810 outshines the Kirin 930 in terms of transistor count. Additionally, it has a TDP of 8 watts and includes a Neural Processing Unit (NPU), which enhances AI and machine learning capabilities.
In summary, the HiSilicon Kirin 930 and MediaTek Dimensity 810 differ in terms of their architecture, lithography process, transistor count, TDP, and AI processing capabilities. While the Kirin 930 utilizes a 28 nm process and ARMv8-A architecture, the Dimensity 810 incorporates a more efficient 6 nm process and ARMv8.2-A architecture. The Dimensity 810's superior transistor count and inclusion of an NPU offer potential performance advantages in AI-related tasks. Ultimately, the choice between these processors will depend on the intended usage and specific requirements of the device in question.
Starting with the HiSilicon Kirin 930, it features a total of 8 cores, with an architecture that comprises 4 Cortex-A53 cores clocked at 2 GHz and another 4 Cortex-A53 cores clocked at 1.5 GHz. The processor operates on the ARMv8-A instruction set and is built on a 28 nm lithography process. It contains approximately 1000 million transistors and has a thermal design power (TDP) of 5 watts.
On the other hand, the MediaTek Dimensity 810 also boasts 8 cores. Its architecture is divided into 2 high-performance Cortex-A76 cores clocked at 2.4 GHz and 6 power-efficient Cortex-A55 cores clocked at 2.0 GHz. It uses the ARMv8.2-A instruction set and is manufactured using a more advanced 6 nm lithography process. With around 12000 million transistors, the Dimensity 810 outshines the Kirin 930 in terms of transistor count. Additionally, it has a TDP of 8 watts and includes a Neural Processing Unit (NPU), which enhances AI and machine learning capabilities.
In summary, the HiSilicon Kirin 930 and MediaTek Dimensity 810 differ in terms of their architecture, lithography process, transistor count, TDP, and AI processing capabilities. While the Kirin 930 utilizes a 28 nm process and ARMv8-A architecture, the Dimensity 810 incorporates a more efficient 6 nm process and ARMv8.2-A architecture. The Dimensity 810's superior transistor count and inclusion of an NPU offer potential performance advantages in AI-related tasks. Ultimately, the choice between these processors will depend on the intended usage and specific requirements of the device in question.
CPU cores and architecture
Architecture | 4x 2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 6 nm |
Number of transistors | 1000 million | 12000 million |
TDP | 5 Watt | 8 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 800 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.2 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G57 MP2 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 600 MHz | 950 MHz |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 11 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 2520x1080@120Hz |
Max camera resolution | 1x 20MP | 1x 64MP, 2x 16MP |
Max Video Capture | 4K@30fps | 2K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2021 Quarter 3 |
Partnumber | Hi3630 | MT6833V/PNZA, MT6833P |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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