HiSilicon Kirin 930 vs HiSilicon Kirin 9000 5G
The HiSilicon Kirin 930 and the HiSilicon Kirin 9000 5G are both powerful processors, but they differ significantly in terms of their specifications.
Starting with the Kirin 930, it features a quad-core Cortex-A53 processor architecture, with four cores running at 2 GHz and another four cores running at 1.5 GHz. This processor is built on a 28 nm lithography and contains approximately 1000 million transistors. The instruction set for this processor is ARMv8-A, and it has a TDP (Thermal Design Power) of 5 Watts.
On the other hand, the Kirin 9000 5G boasts an even more advanced architecture. It features a combination of Cortex-A77 and Cortex-A55 cores, with one Cortex-A77 core clocked at an impressive 3.13 GHz, three Cortex-A77 cores running at 2.54 GHz, and four Cortex-A55 cores running at 2.05 GHz. This processor utilizes a more advanced ARMv8.2-A instruction set and is built using a more advanced 5 nm lithography. With approximately 15300 million transistors, it packs significantly more power. Additionally, the Kirin 9000 5G comes with a neural processing unit that includes Ascend Lite and Ascend Tiny, as well as the HUAWEI Da Vinci Architecture 2.0.
In terms of power consumption, the Kirin 9000 5G has a slightly higher TDP of 6 Watts compared to the Kirin 930's 5 Watt TDP. However, this increase in power consumption is expected considering the Kirin 9000 5G's more advanced architecture and added features.
Overall, the HiSilicon Kirin 9000 5G outperforms the Kirin 930 in terms of its CPU cores, architecture, lithography, number of transistors, and additional neural processing capabilities. It is designed to provide a faster and more efficient user experience, particularly in the realm of 5G technology.
Starting with the Kirin 930, it features a quad-core Cortex-A53 processor architecture, with four cores running at 2 GHz and another four cores running at 1.5 GHz. This processor is built on a 28 nm lithography and contains approximately 1000 million transistors. The instruction set for this processor is ARMv8-A, and it has a TDP (Thermal Design Power) of 5 Watts.
On the other hand, the Kirin 9000 5G boasts an even more advanced architecture. It features a combination of Cortex-A77 and Cortex-A55 cores, with one Cortex-A77 core clocked at an impressive 3.13 GHz, three Cortex-A77 cores running at 2.54 GHz, and four Cortex-A55 cores running at 2.05 GHz. This processor utilizes a more advanced ARMv8.2-A instruction set and is built using a more advanced 5 nm lithography. With approximately 15300 million transistors, it packs significantly more power. Additionally, the Kirin 9000 5G comes with a neural processing unit that includes Ascend Lite and Ascend Tiny, as well as the HUAWEI Da Vinci Architecture 2.0.
In terms of power consumption, the Kirin 9000 5G has a slightly higher TDP of 6 Watts compared to the Kirin 930's 5 Watt TDP. However, this increase in power consumption is expected considering the Kirin 9000 5G's more advanced architecture and added features.
Overall, the HiSilicon Kirin 9000 5G outperforms the Kirin 930 in terms of its CPU cores, architecture, lithography, number of transistors, and additional neural processing capabilities. It is designed to provide a faster and more efficient user experience, particularly in the realm of 5G technology.
CPU cores and architecture
Architecture | 4x 2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 5 nm |
Number of transistors | 1000 million | 15300 million |
TDP | 5 Watt | 6 Watt |
Neural Processing | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR3 | LPDDR5 |
Memory frequency | 800 MHz | 2750 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 3.1 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G78 MP24 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 600 MHz | 760 MHz |
Execution units | 4 | 24 |
Shaders | 64 | 384 |
DirectX | 11 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 3840x2160 |
Max camera resolution | 1x 20MP | |
Max Video Capture | 4K@30fps | 4K@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 4.6 Gbps |
Peak Upload Speed | 0.05 Gbps | 2.5 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2020 October |
Partnumber | Hi3630 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Samsung Exynos 990 vs MediaTek Dimensity 9000
2
Qualcomm Snapdragon 8 Gen 1 vs MediaTek Helio G95
3
Qualcomm Snapdragon 888 vs MediaTek Dimensity 700
4
Samsung Exynos 9609 vs MediaTek Dimensity 1300
5
MediaTek Helio P35 vs HiSilicon Kirin 710A
6
Qualcomm Snapdragon 782G vs HiSilicon Kirin 9000E 5G
7
MediaTek Dimensity 800U vs HiSilicon Kirin 930
8
Qualcomm Snapdragon 480 Plus vs Samsung Exynos 7880
9
MediaTek Helio P70 vs MediaTek Dimensity 6080
10
Qualcomm Snapdragon 7 Gen 1 vs Qualcomm Snapdragon 695