HiSilicon Kirin 9000E 5G vs Unisoc Tiger T700

When comparing the HiSilicon Kirin 9000E 5G and the Unisoc Tiger T700 processors, several key differences emerge.

First, in terms of CPU cores and architecture, the HiSilicon Kirin 9000E 5G boasts impressive specifications. It features a tri-cluster design comprising 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. In contrast, the Unisoc Tiger T700 processor has a simpler architecture with 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A5 cores. The Kirin 9000E's architecture provides a clear advantage in terms of performance and multitasking capabilities.

Another important aspect to consider is the lithography used in each processor. The HiSilicon Kirin 9000E 5G relies on a cutting-edge 5 nm lithography, which allows for smaller and more power-efficient transistors. In comparison, the Unisoc Tiger T700 adopts a 12 nm lithography, which may result in higher power consumption and potentially less efficient performance.

Additionally, the number of transistors is significantly higher in the HiSilicon Kirin 9000E 5G, with a count of 15,300 million compared to the unspecified transistor count in the Unisoc Tiger T700. More transistors generally indicate a more powerful and capable processor.

The thermal design power (TDP) is another parameter to evaluate. The HiSilicon Kirin 9000E 5G has a lower TDP of 6 Watts, suggesting it will consume less power and generate less heat during operation. On the other hand, the Unisoc Tiger T700 has a higher TDP of 10 Watts, potentially leading to increased power consumption and heat dissipation.

Lastly, the HiSilicon Kirin 9000E 5G offers additional features such as the Ascend Lite + Ascend Tiny neural processing units and Huawei Da Vinci Architecture 2.0. These features contribute to enhanced artificial intelligence and machine learning capabilities, setting it apart from the Unisoc Tiger T700, which does not specify any additional neural processing units or architecture.

In summary, the HiSilicon Kirin 9000E 5G exhibits superior specifications in terms of CPU architecture, lithography, transistor count, TDP, and additional neural processing units. It promises better performance, power efficiency, and AI capabilities compared to the Unisoc Tiger T700.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
2x 1.8 GHz – Cortex-A75
6x 1.8 GHz – Cortex-A5
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 12 nm
Number of transistors 15300 million
TDP 6 Watt 10 Watt
Neural Processing Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0

Memory (RAM)

Max amount up to 16 GB up to 4 GB
Memory type LPDDR5 LPDDR4X
Memory frequency 2750 MHz 1866 MHz
Memory-bus 4x16 bit 2x16 bit


Storage specification UFS 3.1 UFS 2.1


GPU name Mali-G78 MP22 Mali-G52 MP2
GPU Architecture Valhall Bifrost
GPU frequency 760 MHz 850 MHz
Execution units 22 2
Shaders 352 32
DirectX 12 11
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 2400x1080
Max camera resolution 1x 48MP
Max Video Capture 4K@60fps FullHD@60fps
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 0.3 Gbps
Peak Upload Speed 2.5 Gbps 0.1 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.2 5.0
Satellite navigation BeiDou

Supplemental Information

Launch Date 2020 October 2021 March
Partnumber T700
Vertical Segment Mobiles Mobiles
Positioning Flagship Low-end

AnTuTu 10

Total Score
Kirin 9000E 5G
Tiger T700

GeekBench 6 Single-Core

Kirin 9000E 5G
Tiger T700

GeekBench 6 Multi-Core

Kirin 9000E 5G
Tiger T700