HiSilicon Kirin 9000E 5G vs Unisoc Tiger T700
When comparing the HiSilicon Kirin 9000E 5G and the Unisoc Tiger T700 processors, several key differences emerge.
First, in terms of CPU cores and architecture, the HiSilicon Kirin 9000E 5G boasts impressive specifications. It features a tri-cluster design comprising 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. In contrast, the Unisoc Tiger T700 processor has a simpler architecture with 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A5 cores. The Kirin 9000E's architecture provides a clear advantage in terms of performance and multitasking capabilities.
Another important aspect to consider is the lithography used in each processor. The HiSilicon Kirin 9000E 5G relies on a cutting-edge 5 nm lithography, which allows for smaller and more power-efficient transistors. In comparison, the Unisoc Tiger T700 adopts a 12 nm lithography, which may result in higher power consumption and potentially less efficient performance.
Additionally, the number of transistors is significantly higher in the HiSilicon Kirin 9000E 5G, with a count of 15,300 million compared to the unspecified transistor count in the Unisoc Tiger T700. More transistors generally indicate a more powerful and capable processor.
The thermal design power (TDP) is another parameter to evaluate. The HiSilicon Kirin 9000E 5G has a lower TDP of 6 Watts, suggesting it will consume less power and generate less heat during operation. On the other hand, the Unisoc Tiger T700 has a higher TDP of 10 Watts, potentially leading to increased power consumption and heat dissipation.
Lastly, the HiSilicon Kirin 9000E 5G offers additional features such as the Ascend Lite + Ascend Tiny neural processing units and Huawei Da Vinci Architecture 2.0. These features contribute to enhanced artificial intelligence and machine learning capabilities, setting it apart from the Unisoc Tiger T700, which does not specify any additional neural processing units or architecture.
In summary, the HiSilicon Kirin 9000E 5G exhibits superior specifications in terms of CPU architecture, lithography, transistor count, TDP, and additional neural processing units. It promises better performance, power efficiency, and AI capabilities compared to the Unisoc Tiger T700.
First, in terms of CPU cores and architecture, the HiSilicon Kirin 9000E 5G boasts impressive specifications. It features a tri-cluster design comprising 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. In contrast, the Unisoc Tiger T700 processor has a simpler architecture with 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A5 cores. The Kirin 9000E's architecture provides a clear advantage in terms of performance and multitasking capabilities.
Another important aspect to consider is the lithography used in each processor. The HiSilicon Kirin 9000E 5G relies on a cutting-edge 5 nm lithography, which allows for smaller and more power-efficient transistors. In comparison, the Unisoc Tiger T700 adopts a 12 nm lithography, which may result in higher power consumption and potentially less efficient performance.
Additionally, the number of transistors is significantly higher in the HiSilicon Kirin 9000E 5G, with a count of 15,300 million compared to the unspecified transistor count in the Unisoc Tiger T700. More transistors generally indicate a more powerful and capable processor.
The thermal design power (TDP) is another parameter to evaluate. The HiSilicon Kirin 9000E 5G has a lower TDP of 6 Watts, suggesting it will consume less power and generate less heat during operation. On the other hand, the Unisoc Tiger T700 has a higher TDP of 10 Watts, potentially leading to increased power consumption and heat dissipation.
Lastly, the HiSilicon Kirin 9000E 5G offers additional features such as the Ascend Lite + Ascend Tiny neural processing units and Huawei Da Vinci Architecture 2.0. These features contribute to enhanced artificial intelligence and machine learning capabilities, setting it apart from the Unisoc Tiger T700, which does not specify any additional neural processing units or architecture.
In summary, the HiSilicon Kirin 9000E 5G exhibits superior specifications in terms of CPU architecture, lithography, transistor count, TDP, and additional neural processing units. It promises better performance, power efficiency, and AI capabilities compared to the Unisoc Tiger T700.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A5 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 12 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 16 GB | up to 4 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 1866 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.1 |
Graphics
GPU name | Mali-G78 MP22 | Mali-G52 MP2 |
GPU Architecture | Valhall | Bifrost |
GPU frequency | 760 MHz | 850 MHz |
Execution units | 22 | 2 |
Shaders | 352 | 32 |
DirectX | 12 | 11 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2400x1080 |
Max camera resolution | 1x 48MP | |
Max Video Capture | 4K@60fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 2.5 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 October | 2021 March |
Partnumber | T700 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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