HiSilicon Kirin 9000E 5G vs Unisoc Tiger T612
When comparing the HiSilicon Kirin 9000E 5G and the Unisoc Tiger T612 processors, there are several notable differences in their specifications.
Starting with the CPU cores and architecture, the HiSilicon Kirin 9000E 5G features a more advanced architecture. It consists of 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. In contrast, the Unisoc Tiger T612 has 2x 1.8 GHz Cortex-A75 and 6x 1.8 GHz Cortex-A55 cores. With a higher clock speed and more Cortex-A77 cores, the HiSilicon Kirin 9000E 5G holds the advantage in terms of raw processing power.
Both processors have 8 cores and support the ARMv8.2-A instruction set, ensuring compatibility with modern software and applications. However, the HiSilicon Kirin 9000E 5G is manufactured using a more advanced 5 nm lithography process, which results in improved power efficiency and potentially better performance.
Another key specification to consider is the thermal design power (TDP). The HiSilicon Kirin 9000E 5G has a TDP of 6 Watts, indicating lower power consumption and potentially less heat generated during operation. On the other hand, the Unisoc Tiger T612 has a higher TDP of 10 Watts.
Additionally, the HiSilicon Kirin 9000E 5G boasts Ascend Lite + Ascend Tiny neural processing units, as well as the HUAWEI Da Vinci Architecture 2.0. These features are designed to enhance artificial intelligence capabilities and enable more efficient AI-based tasks.
In summary, while both processors have 8 cores and support the same instruction set, the HiSilicon Kirin 9000E 5G outshines the Unisoc Tiger T612 in several areas. It offers a more advanced architecture, higher clock speeds, a smaller lithography process, lower power consumption, and additional AI processing capabilities. These specifications suggest that the HiSilicon Kirin 9000E 5G is likely to deliver superior performance and efficiency compared to the Unisoc Tiger T612.
Starting with the CPU cores and architecture, the HiSilicon Kirin 9000E 5G features a more advanced architecture. It consists of 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. In contrast, the Unisoc Tiger T612 has 2x 1.8 GHz Cortex-A75 and 6x 1.8 GHz Cortex-A55 cores. With a higher clock speed and more Cortex-A77 cores, the HiSilicon Kirin 9000E 5G holds the advantage in terms of raw processing power.
Both processors have 8 cores and support the ARMv8.2-A instruction set, ensuring compatibility with modern software and applications. However, the HiSilicon Kirin 9000E 5G is manufactured using a more advanced 5 nm lithography process, which results in improved power efficiency and potentially better performance.
Another key specification to consider is the thermal design power (TDP). The HiSilicon Kirin 9000E 5G has a TDP of 6 Watts, indicating lower power consumption and potentially less heat generated during operation. On the other hand, the Unisoc Tiger T612 has a higher TDP of 10 Watts.
Additionally, the HiSilicon Kirin 9000E 5G boasts Ascend Lite + Ascend Tiny neural processing units, as well as the HUAWEI Da Vinci Architecture 2.0. These features are designed to enhance artificial intelligence capabilities and enable more efficient AI-based tasks.
In summary, while both processors have 8 cores and support the same instruction set, the HiSilicon Kirin 9000E 5G outshines the Unisoc Tiger T612 in several areas. It offers a more advanced architecture, higher clock speeds, a smaller lithography process, lower power consumption, and additional AI processing capabilities. These specifications suggest that the HiSilicon Kirin 9000E 5G is likely to deliver superior performance and efficiency compared to the Unisoc Tiger T612.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 12 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 16 GB | up to 8 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 1600 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.2 |
Graphics
GPU name | Mali-G78 MP22 | Mali-G57 MP1 |
GPU Architecture | Mali Valhall | Mali Valhall |
GPU frequency | 760 MHz | 650 MHz |
Execution units | 22 | 1 |
Shaders | 352 | 16 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2400x1080 |
Max camera resolution | 1x 50MP | |
Max Video Capture | 4K@60fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 2.5 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 October | 2022 January |
Partnumber | T612 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
Popular comparisons:
1
HiSilicon Kirin 9000S vs Qualcomm Snapdragon 430
2
MediaTek Helio P60 vs HiSilicon Kirin 955
3
Apple A18 Pro vs HiSilicon Kirin 659
4
MediaTek Helio G35 vs Qualcomm Snapdragon 865 Plus
5
Qualcomm Snapdragon 821 vs Unisoc T8300
6
Samsung Exynos 850 vs MediaTek Dimensity 8400
7
Qualcomm Snapdragon 685 vs Unisoc Tiger T610
8
Qualcomm Snapdragon 778G Plus vs HiSilicon Kirin 930
9
HiSilicon Kirin 8020 vs HiSilicon Kirin 9000E 5G
10
Qualcomm Snapdragon 460 vs MediaTek Helio G200