HiSilicon Kirin 9000E 5G vs Unisoc Tiger T610
The HiSilicon Kirin 9000E 5G and the Unisoc Tiger T610 are two processors with different specifications.
In terms of CPU cores and architecture, the HiSilicon Kirin 9000E 5G has a more powerful configuration. It features an architecture of 1x 3.13 GHz – Cortex-A77, 3x 2.54 GHz – Cortex-A77, and 4x 2.05 GHz – Cortex-A55. On the other hand, the Unisoc Tiger T610 has an architecture of 2x 1.8 GHz – Cortex-A75 and 6x 1.8 GHz – Cortex-A55.
Both processors have 8 cores and use the ARMv8.2-A instruction set. However, the Kirin 9000E 5G has a more advanced lithography of 5 nm, compared to the Tiger T610's 12 nm lithography. The Kirin 9000E 5G also has a higher number of transistors with 15300 million, indicating a potentially higher level of performance.
When it comes to power consumption, the Kirin 9000E 5G has a lower TDP (Thermal Design Power) of 6 watts, indicating better energy efficiency. The Tiger T610, on the other hand, has a TDP of 10 watts.
In terms of neural processing capabilities, only the Kirin 9000E 5G provides information. It utilizes Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0 for neural processing. There is no information available about neural processing capabilities for the Tiger T610.
Overall, the HiSilicon Kirin 9000E 5G boasts a more powerful and efficient configuration compared to the Unisoc Tiger T610. With its higher clock speeds, advanced lithography, lower power consumption, and dedicated neural processing capabilities, the Kirin 9000E 5G is likely to offer superior performance in various tasks. However, it is important to consider other factors such as software optimization and overall system integration when evaluating the performance of these processors in real-world scenarios.
In terms of CPU cores and architecture, the HiSilicon Kirin 9000E 5G has a more powerful configuration. It features an architecture of 1x 3.13 GHz – Cortex-A77, 3x 2.54 GHz – Cortex-A77, and 4x 2.05 GHz – Cortex-A55. On the other hand, the Unisoc Tiger T610 has an architecture of 2x 1.8 GHz – Cortex-A75 and 6x 1.8 GHz – Cortex-A55.
Both processors have 8 cores and use the ARMv8.2-A instruction set. However, the Kirin 9000E 5G has a more advanced lithography of 5 nm, compared to the Tiger T610's 12 nm lithography. The Kirin 9000E 5G also has a higher number of transistors with 15300 million, indicating a potentially higher level of performance.
When it comes to power consumption, the Kirin 9000E 5G has a lower TDP (Thermal Design Power) of 6 watts, indicating better energy efficiency. The Tiger T610, on the other hand, has a TDP of 10 watts.
In terms of neural processing capabilities, only the Kirin 9000E 5G provides information. It utilizes Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0 for neural processing. There is no information available about neural processing capabilities for the Tiger T610.
Overall, the HiSilicon Kirin 9000E 5G boasts a more powerful and efficient configuration compared to the Unisoc Tiger T610. With its higher clock speeds, advanced lithography, lower power consumption, and dedicated neural processing capabilities, the Kirin 9000E 5G is likely to offer superior performance in various tasks. However, it is important to consider other factors such as software optimization and overall system integration when evaluating the performance of these processors in real-world scenarios.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 12 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 16 GB | up to 6 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 1600 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G78 MP22 | Mali-G52 MP2 |
GPU Architecture | Valhall | Bifrost |
GPU frequency | 760 MHz | 614.4 MHz |
Execution units | 22 | 2 |
Shaders | 352 | 32 |
DirectX | 12 | 11 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2400x1080 |
Max camera resolution | 1x 32MP | |
Max Video Capture | 4K@60fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 2.5 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 October | 2019 June |
Partnumber | T610 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Qualcomm Snapdragon 765G vs HiSilicon Kirin 710F
2
MediaTek Dimensity 820 vs Qualcomm Snapdragon 6 Gen 1
3
MediaTek Dimensity 7200 vs Samsung Exynos 9810
4
MediaTek Dimensity 1000 vs MediaTek Dimensity 8020
5
Samsung Exynos 9611 vs MediaTek Helio G95
6
Qualcomm Snapdragon 675 vs Unisoc Tiger T310
7
Unisoc Tiger T606 vs Samsung Exynos 990
8
Qualcomm Snapdragon 855 vs MediaTek Dimensity 720
9
MediaTek Dimensity 1200 vs MediaTek Dimensity 8000
10
Google Tensor G1 vs Unisoc SC9832E