HiSilicon Kirin 9000E 5G vs Unisoc Tiger T606
The HiSilicon Kirin 9000E 5G and Unisoc Tiger T606 are two processors with different specifications.
Starting with the Kirin 9000E, it is built on a 5 nm lithography, which allows for enhanced power efficiency and thermal management. It features a total of 8 CPU cores, with an architecture comprising of 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. This combination ensures a balanced performance by utilizing different types of cores optimized for different tasks. It also supports the ARMv8.2-A instruction set. The processor contains a total of 15,300 million transistors, which signifies its complexity and ability to handle large amounts of data. The TDP (Thermal Design Power) of Kirin 9000E is rated at 6 Watts. Additionally, it incorporates the Ascend Lite + Ascend Tiny neural processing units based on the HUAWEI Da Vinci Architecture 2.0, which enables advanced AI performance.
On the other hand, the Tiger T606 is manufactured on a 12 nm lithography, which is slightly higher than the Kirin 9000E. It also features 8 CPU cores, with an architecture consisting of 2x 1.6 GHz Cortex-A75 and 6x 1.6 GHz Cortex-A55 cores. While the Tiger T606 also supports the ARMv8.2-A instruction set, it has a higher TDP of 10 Watts.
In summary, the Kirin 9000E excels in its lithography, with a more advanced 5 nm process compared to the Tiger T606's 12 nm. The Kirin 9000E also offers a more diverse CPU core setup, with a combination of high-performance Cortex-A77 cores and power-efficient Cortex-A55 cores. Furthermore, it features the Ascend Lite + Ascend Tiny neural processing units, contributing to its AI capabilities. On the other hand, the Tiger T606 provides a lower TDP but falls behind in terms of lithography and CPU core architecture. Ultimately, the choice between these processors depends on the specific requirements and priorities of the user.
Starting with the Kirin 9000E, it is built on a 5 nm lithography, which allows for enhanced power efficiency and thermal management. It features a total of 8 CPU cores, with an architecture comprising of 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. This combination ensures a balanced performance by utilizing different types of cores optimized for different tasks. It also supports the ARMv8.2-A instruction set. The processor contains a total of 15,300 million transistors, which signifies its complexity and ability to handle large amounts of data. The TDP (Thermal Design Power) of Kirin 9000E is rated at 6 Watts. Additionally, it incorporates the Ascend Lite + Ascend Tiny neural processing units based on the HUAWEI Da Vinci Architecture 2.0, which enables advanced AI performance.
On the other hand, the Tiger T606 is manufactured on a 12 nm lithography, which is slightly higher than the Kirin 9000E. It also features 8 CPU cores, with an architecture consisting of 2x 1.6 GHz Cortex-A75 and 6x 1.6 GHz Cortex-A55 cores. While the Tiger T606 also supports the ARMv8.2-A instruction set, it has a higher TDP of 10 Watts.
In summary, the Kirin 9000E excels in its lithography, with a more advanced 5 nm process compared to the Tiger T606's 12 nm. The Kirin 9000E also offers a more diverse CPU core setup, with a combination of high-performance Cortex-A77 cores and power-efficient Cortex-A55 cores. Furthermore, it features the Ascend Lite + Ascend Tiny neural processing units, contributing to its AI capabilities. On the other hand, the Tiger T606 provides a lower TDP but falls behind in terms of lithography and CPU core architecture. Ultimately, the choice between these processors depends on the specific requirements and priorities of the user.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 1.6 GHz – Cortex-A75 6x 1.6 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 12 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 16 GB | up to 8 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 1600 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.1 |
Graphics
GPU name | Mali-G78 MP22 | Mali-G57 MP1 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 760 MHz | 650 MHz |
Execution units | 22 | 1 |
Shaders | 352 | 16 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 1600x900@90Hz |
Max camera resolution | 1x 24MP, 16MP + 8MP | |
Max Video Capture | 4K@60fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 2.5 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 October | 2021 October |
Partnumber | T606 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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