HiSilicon Kirin 9000E 5G vs Unisoc Tiger T606

The HiSilicon Kirin 9000E 5G and Unisoc Tiger T606 are two processors with different specifications.

Starting with the Kirin 9000E, it is built on a 5 nm lithography, which allows for enhanced power efficiency and thermal management. It features a total of 8 CPU cores, with an architecture comprising of 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. This combination ensures a balanced performance by utilizing different types of cores optimized for different tasks. It also supports the ARMv8.2-A instruction set. The processor contains a total of 15,300 million transistors, which signifies its complexity and ability to handle large amounts of data. The TDP (Thermal Design Power) of Kirin 9000E is rated at 6 Watts. Additionally, it incorporates the Ascend Lite + Ascend Tiny neural processing units based on the HUAWEI Da Vinci Architecture 2.0, which enables advanced AI performance.

On the other hand, the Tiger T606 is manufactured on a 12 nm lithography, which is slightly higher than the Kirin 9000E. It also features 8 CPU cores, with an architecture consisting of 2x 1.6 GHz Cortex-A75 and 6x 1.6 GHz Cortex-A55 cores. While the Tiger T606 also supports the ARMv8.2-A instruction set, it has a higher TDP of 10 Watts.

In summary, the Kirin 9000E excels in its lithography, with a more advanced 5 nm process compared to the Tiger T606's 12 nm. The Kirin 9000E also offers a more diverse CPU core setup, with a combination of high-performance Cortex-A77 cores and power-efficient Cortex-A55 cores. Furthermore, it features the Ascend Lite + Ascend Tiny neural processing units, contributing to its AI capabilities. On the other hand, the Tiger T606 provides a lower TDP but falls behind in terms of lithography and CPU core architecture. Ultimately, the choice between these processors depends on the specific requirements and priorities of the user.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
2x 1.6 GHz – Cortex-A75
6x 1.6 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 12 nm
Number of transistors 15300 million
TDP 6 Watt 10 Watt
Neural Processing Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0

Memory (RAM)

Max amount up to 16 GB up to 8 GB
Memory type LPDDR5 LPDDR4X
Memory frequency 2750 MHz 1600 MHz
Memory-bus 4x16 bit 2x16 bit


Storage specification UFS 3.1 UFS 2.1


GPU name Mali-G78 MP22 Mali-G57 MP1
GPU Architecture Valhall Valhall
GPU frequency 760 MHz 650 MHz
Execution units 22 1
Shaders 352 16
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 1600x900@90Hz
Max camera resolution 1x 24MP, 16MP + 8MP
Max Video Capture 4K@60fps FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 0.3 Gbps
Peak Upload Speed 2.5 Gbps 0.1 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.2 5.0
Satellite navigation BeiDou

Supplemental Information

Launch Date 2020 October 2021 October
Partnumber T606
Vertical Segment Mobiles Mobiles
Positioning Flagship Low-end

AnTuTu 10

Total Score
Kirin 9000E 5G
Tiger T606

GeekBench 6 Single-Core

Kirin 9000E 5G
Tiger T606

GeekBench 6 Multi-Core

Kirin 9000E 5G
Tiger T606