HiSilicon Kirin 9000E 5G vs Unisoc Tanggula T770 5G
The HiSilicon Kirin 9000E 5G and Unisoc Tanggula T770 5G are both processors designed for smartphones. While they share some similarities, such as being octa-core processors with ARMv8.2-A instruction sets, there are also notable differences in their specifications.
Starting with the HiSilicon Kirin 9000E 5G, it features a more advanced architecture with three different types of cores. It has one Cortex-A77 core clocked at 3.13 GHz, three Cortex-A77 cores clocked at 2.54 GHz, and four Cortex-A55 cores clocked at 2.05 GHz. With a lithography of 5 nm and 15300 million transistors, this processor is built for power and efficiency. It has a TDP of 6 Watts and incorporates the Ascend Lite + Ascend Tiny neural processing units, utilizing the HUAWEI Da Vinci Architecture 2.0.
On the other hand, the Unisoc Tanggula T770 5G follows a different approach. Its architecture includes one Cortex-A76 core clocked at 2.5 GHz, three Cortex-A76 cores clocked at 2.2 GHz, and four Cortex-A55 cores clocked at 2.0 GHz. With a slightly larger lithography of 6 nm, this processor may not offer the same level of power efficiency as the Kirin 9000E. It has a TDP of 5 Watts and incorporates an NPU for neural processing tasks.
In summary, the HiSilicon Kirin 9000E 5G and Unisoc Tanggula T770 5G are two processors with different specifications. The Kirin 9000E boasts a more advanced architecture, smaller lithography, and additional neural processing units, making it more suitable for demanding tasks. Meanwhile, the Tanggula T770 offers a balance between performance and power efficiency, with a slightly lower TDP and an NPU for neural processing tasks. Ultimately, the choice between the two processors would depend on the specific requirements and priorities of the user or device manufacturer.
Starting with the HiSilicon Kirin 9000E 5G, it features a more advanced architecture with three different types of cores. It has one Cortex-A77 core clocked at 3.13 GHz, three Cortex-A77 cores clocked at 2.54 GHz, and four Cortex-A55 cores clocked at 2.05 GHz. With a lithography of 5 nm and 15300 million transistors, this processor is built for power and efficiency. It has a TDP of 6 Watts and incorporates the Ascend Lite + Ascend Tiny neural processing units, utilizing the HUAWEI Da Vinci Architecture 2.0.
On the other hand, the Unisoc Tanggula T770 5G follows a different approach. Its architecture includes one Cortex-A76 core clocked at 2.5 GHz, three Cortex-A76 cores clocked at 2.2 GHz, and four Cortex-A55 cores clocked at 2.0 GHz. With a slightly larger lithography of 6 nm, this processor may not offer the same level of power efficiency as the Kirin 9000E. It has a TDP of 5 Watts and incorporates an NPU for neural processing tasks.
In summary, the HiSilicon Kirin 9000E 5G and Unisoc Tanggula T770 5G are two processors with different specifications. The Kirin 9000E boasts a more advanced architecture, smaller lithography, and additional neural processing units, making it more suitable for demanding tasks. Meanwhile, the Tanggula T770 offers a balance between performance and power efficiency, with a slightly lower TDP and an NPU for neural processing tasks. Ultimately, the choice between the two processors would depend on the specific requirements and priorities of the user or device manufacturer.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 6 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 5 Watt |
Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 32 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 3.1 |
Graphics
GPU name | Mali-G78 MP22 | Mali-G57 MP6 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 760 MHz | 850 MHz |
Execution units | 22 | 6 |
Shaders | 352 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2160x1080@120Hz |
Max camera resolution | 1x 108MP, 2x 24MP | |
Max Video Capture | 4K@60fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 2.7 Gbps |
Peak Upload Speed | 2.5 Gbps | 1.5 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 October | 2021 February |
Partnumber | T770, Tiger T7520 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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