HiSilicon Kirin 9000E 5G vs Unisoc Tanggula T740 5G

The HiSilicon Kirin 9000E 5G and Unisoc Tanggula T740 5G are two processors with different specifications.

Starting with the HiSilicon Kirin 9000E 5G, it has a powerful CPU architecture consisting of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This processor utilizes the ARMv8.2-A instruction set and is manufactured using a 5 nm lithography process. With an impressive number of 15300 million transistors, it delivers high performance while maintaining a low TDP of just 6 watts. In terms of neural processing, it features Ascend Lite and Ascend Tiny technologies, making use of the HUAWEI Da Vinci Architecture 2.0.

On the other hand, the Unisoc Tanggula T740 5G processor has a different CPU architecture. It consists of 4x 1.8 GHz Cortex-A75 cores and 4x 1.8 GHz Cortex-A55 cores. Similar to the Kirin 9000E, it also operates using the ARMv8.2-A instruction set. However, it differs in terms of lithography, with a 12 nm manufacturing process. The Tanggula T740 utilizes a Dual NPU for its neural processing capabilities.

In terms of specifications, it is evident that the HiSilicon Kirin 9000E 5G outperforms the Unisoc Tanggula T740 5G. The Kirin 9000E offers a more advanced CPU architecture with higher clock speeds, which can enhance overall processing speed and multitasking capabilities. Additionally, the use of a 5 nm lithography process allows for better power efficiency.

However, it is important to note that specifications alone do not provide the complete picture of a processor's performance. Factors such as software optimization and real-world usage scenarios also play a significant role. Therefore, it is essential to consider benchmarks and real-world performance tests when making a decision based on specifications alone.

In conclusion, though both processors have their own strengths, the HiSilicon Kirin 9000E 5G stands out with its superior specifications, including a more advanced CPU architecture and a 5 nm lithography process. However, the choice between the two processors ultimately depends on the specific needs and requirements of the user.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
4x 1.8 GHz – Cortex-A75
4x 1.8 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 12 nm
Number of transistors 15300 million
TDP 6 Watt
Neural Processing Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 Dual NPU

Memory (RAM)

Max amount up to 16 GB up to 8 GB
Memory type LPDDR5 LPDDR4X
Memory frequency 2750 MHz 1866 MHz
Memory-bus 4x16 bit


Storage specification UFS 3.1 UFS 2.1


GPU name Mali-G78 MP22 Imagination PowerVR GM9446
GPU Architecture Valhall Rogue
GPU frequency 760 MHz 800 MHz
Execution units 22
Shaders 352
DirectX 12
OpenCL API 2.1 4.0
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.1

Camera, Video, Display

Max screen resolution 3840x2160 2960x1440@60Hz
Max camera resolution 1x 64MP
Max Video Capture 4K@60fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 1.5 Gbps
Peak Upload Speed 2.5 Gbps 0.75 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.2 5.0
Satellite navigation BeiDou

Supplemental Information

Launch Date 2020 October 2020 Quarter 1
Partnumber T740, Tiger T7510
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 9000E 5G
Tanggula T740 5G

GeekBench 6 Single-Core

Kirin 9000E 5G
Tanggula T740 5G

GeekBench 6 Multi-Core

Kirin 9000E 5G
Tanggula T740 5G