HiSilicon Kirin 9000E 5G vs Unisoc Tanggula T740 5G
The HiSilicon Kirin 9000E 5G and Unisoc Tanggula T740 5G are two processors with different specifications.
Starting with the HiSilicon Kirin 9000E 5G, it has a powerful CPU architecture consisting of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This processor utilizes the ARMv8.2-A instruction set and is manufactured using a 5 nm lithography process. With an impressive number of 15300 million transistors, it delivers high performance while maintaining a low TDP of just 6 watts. In terms of neural processing, it features Ascend Lite and Ascend Tiny technologies, making use of the HUAWEI Da Vinci Architecture 2.0.
On the other hand, the Unisoc Tanggula T740 5G processor has a different CPU architecture. It consists of 4x 1.8 GHz Cortex-A75 cores and 4x 1.8 GHz Cortex-A55 cores. Similar to the Kirin 9000E, it also operates using the ARMv8.2-A instruction set. However, it differs in terms of lithography, with a 12 nm manufacturing process. The Tanggula T740 utilizes a Dual NPU for its neural processing capabilities.
In terms of specifications, it is evident that the HiSilicon Kirin 9000E 5G outperforms the Unisoc Tanggula T740 5G. The Kirin 9000E offers a more advanced CPU architecture with higher clock speeds, which can enhance overall processing speed and multitasking capabilities. Additionally, the use of a 5 nm lithography process allows for better power efficiency.
However, it is important to note that specifications alone do not provide the complete picture of a processor's performance. Factors such as software optimization and real-world usage scenarios also play a significant role. Therefore, it is essential to consider benchmarks and real-world performance tests when making a decision based on specifications alone.
In conclusion, though both processors have their own strengths, the HiSilicon Kirin 9000E 5G stands out with its superior specifications, including a more advanced CPU architecture and a 5 nm lithography process. However, the choice between the two processors ultimately depends on the specific needs and requirements of the user.
Starting with the HiSilicon Kirin 9000E 5G, it has a powerful CPU architecture consisting of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This processor utilizes the ARMv8.2-A instruction set and is manufactured using a 5 nm lithography process. With an impressive number of 15300 million transistors, it delivers high performance while maintaining a low TDP of just 6 watts. In terms of neural processing, it features Ascend Lite and Ascend Tiny technologies, making use of the HUAWEI Da Vinci Architecture 2.0.
On the other hand, the Unisoc Tanggula T740 5G processor has a different CPU architecture. It consists of 4x 1.8 GHz Cortex-A75 cores and 4x 1.8 GHz Cortex-A55 cores. Similar to the Kirin 9000E, it also operates using the ARMv8.2-A instruction set. However, it differs in terms of lithography, with a 12 nm manufacturing process. The Tanggula T740 utilizes a Dual NPU for its neural processing capabilities.
In terms of specifications, it is evident that the HiSilicon Kirin 9000E 5G outperforms the Unisoc Tanggula T740 5G. The Kirin 9000E offers a more advanced CPU architecture with higher clock speeds, which can enhance overall processing speed and multitasking capabilities. Additionally, the use of a 5 nm lithography process allows for better power efficiency.
However, it is important to note that specifications alone do not provide the complete picture of a processor's performance. Factors such as software optimization and real-world usage scenarios also play a significant role. Therefore, it is essential to consider benchmarks and real-world performance tests when making a decision based on specifications alone.
In conclusion, though both processors have their own strengths, the HiSilicon Kirin 9000E 5G stands out with its superior specifications, including a more advanced CPU architecture and a 5 nm lithography process. However, the choice between the two processors ultimately depends on the specific needs and requirements of the user.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
4x 1.8 GHz – Cortex-A75 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 12 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | |
Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 | Dual NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 8 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 1866 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.1 |
Graphics
GPU name | Mali-G78 MP22 | Imagination PowerVR GM9446 |
GPU Architecture | Valhall | Rogue |
GPU frequency | 760 MHz | 800 MHz |
Execution units | 22 | |
Shaders | 352 | |
DirectX | 12 | |
OpenCL API | 2.1 | 4.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.1 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2960x1440@60Hz |
Max camera resolution | 1x 64MP | |
Max Video Capture | 4K@60fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 1.5 Gbps |
Peak Upload Speed | 2.5 Gbps | 0.75 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 October | 2020 Quarter 1 |
Partnumber | T740, Tiger T7510 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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