HiSilicon Kirin 9000E 5G vs Unisoc SC9832E
The HiSilicon Kirin 9000E 5G and the Unisoc SC9832E are two processors with different specifications and capabilities.
Starting with the HiSilicon Kirin 9000E 5G, it is built on a more advanced 5 nm lithography. It features a total of 8 cores, including 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. This processor supports ARMv8.2-A instruction set. It has a high transistor count of 15300 million, indicating a powerful setup. The TDP (Thermal Design Power) of this processor is 6 Watts, which implies it is energy-efficient. Additionally, it boasts advanced neural processing capabilities with Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0.
On the other hand, the Unisoc SC9832E has a more modest 28 nm lithography. It consists of 4 cores, all being 1.4 GHz Cortex-A53 cores. It supports the ARMv8-A instruction set. With a TDP of 7 Watts, it is slightly less power efficient compared to the Kirin 9000E 5G.
Comparing the two, the Kirin 9000E 5G clearly has a more advanced and powerful architecture with a larger number of cores and higher clock speeds. Additionally, its 5 nm lithography suggests improved power efficiency compared to the Unisoc SC9832E's larger 28 nm lithography. The Kirin processor also boasts advanced neural processing capabilities with multiple technologies incorporated in its architecture.
In summary, the HiSilicon Kirin 9000E 5G outperforms the Unisoc SC9832E in terms of core count, clock speed, lithography, and neural processing capabilities. The Kirin 9000E 5G is more suitable for high-demand tasks and enhanced performance, while the Unisoc SC9832E provides a more basic and budget-friendly option.
Starting with the HiSilicon Kirin 9000E 5G, it is built on a more advanced 5 nm lithography. It features a total of 8 cores, including 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. This processor supports ARMv8.2-A instruction set. It has a high transistor count of 15300 million, indicating a powerful setup. The TDP (Thermal Design Power) of this processor is 6 Watts, which implies it is energy-efficient. Additionally, it boasts advanced neural processing capabilities with Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0.
On the other hand, the Unisoc SC9832E has a more modest 28 nm lithography. It consists of 4 cores, all being 1.4 GHz Cortex-A53 cores. It supports the ARMv8-A instruction set. With a TDP of 7 Watts, it is slightly less power efficient compared to the Kirin 9000E 5G.
Comparing the two, the Kirin 9000E 5G clearly has a more advanced and powerful architecture with a larger number of cores and higher clock speeds. Additionally, its 5 nm lithography suggests improved power efficiency compared to the Unisoc SC9832E's larger 28 nm lithography. The Kirin processor also boasts advanced neural processing capabilities with multiple technologies incorporated in its architecture.
In summary, the HiSilicon Kirin 9000E 5G outperforms the Unisoc SC9832E in terms of core count, clock speed, lithography, and neural processing capabilities. The Kirin 9000E 5G is more suitable for high-demand tasks and enhanced performance, while the Unisoc SC9832E provides a more basic and budget-friendly option.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
4x 1.4 GHz – Cortex-A53 |
| Number of cores | 8 | 4 |
| Instruction Set | ARMv8.2-A | ARMv8-A |
| Lithography | 5 nm | 28 nm |
| Number of transistors | 15300 million | |
| TDP | 6 Watt | 7 Watt |
| Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
| Max amount | up to 16 GB | up to 2 GB |
| Memory type | LPDDR5 | LPDDR3 |
| Memory frequency | 2750 MHz | 667 MHz |
| Memory-bus | 4x16 bit |
Storage
| Storage specification | UFS 3.1 | eMMC 5.1 |
Graphics
| GPU name | Mali-G78 MP22 | Mali-T820 MP1 |
| GPU Architecture | Mali Valhall | Mali Midgard |
| GPU frequency | 760 MHz | 680 MHz |
| Execution units | 22 | 1 |
| Shaders | 352 | 4 |
| DirectX | 12 | 11 |
| OpenCL API | 2.1 | 1.2 |
| OpenGL API | ES 3.2 | ES 3.2 |
| Vulkan API | 1.2 | 1.0 |
Camera, Video, Display
| Max screen resolution | 3840x2160 | 1440x720 |
| Max camera resolution | 1x 13MP | |
| Max Video Capture | 4K@60fps | FullHD@30fps |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 4.6 Gbps | 0.15 Gbps |
| Peak Upload Speed | 2.5 Gbps | 0.05 Gbps |
| Wi-Fi | 6 (802.11ax) | 4 (802.11n) |
| Bluetooth | 5.2 | 4.2 |
| Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS GLONASS |
Supplemental Information
| Launch Date | 2020 October | 2018 |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Flagship | Low-end |
Popular comparisons:
1
MediaTek Dimensity 1000 vs Unisoc Tiger T310
2
MediaTek Dimensity 7020 vs Samsung Exynos 7885
3
MediaTek Dimensity 6300 vs MediaTek Dimensity 8050
4
Qualcomm Snapdragon 678 vs Apple M4 (iPad)
5
Unisoc T820 vs Qualcomm Snapdragon 780G
6
MediaTek Helio G37 vs Unisoc Tiger T610
7
Samsung Exynos 7870 vs MediaTek Helio P22
8
Qualcomm Snapdragon 7s Gen 4 vs MediaTek Dimensity 900
9
MediaTek Dimensity 8020 vs Qualcomm Snapdragon 425
10
Unisoc T8300 vs HiSilicon Kirin 970