HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 930

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The HiSilicon Kirin 9000E 5G and the MediaTek Dimensity 930 are both powerful processors, but they have some key differences in their specifications.

In terms of CPU cores and architecture, the Kirin 9000E 5G boasts a 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the Dimensity 930 features 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. While both processors have 8 cores, the Kirin 9000E 5G offers a higher clock speed on its Cortex-A77 cores, potentially resulting in faster performance.

In terms of lithography, the Kirin 9000E 5G uses a cutting-edge 5 nm process, which generally leads to improved power efficiency and performance compared to larger lithography nodes. The Dimensity 930, on the other hand, uses a 6 nm process, which is still impressive but slightly less advanced.

The number of transistors is also worth noting. The Kirin 9000E 5G has 15300 million transistors, which implies a denser and potentially more efficient chip design. The Dimensity 930's transistor count is not specified.

In terms of neural processing capabilities, the Kirin 9000E 5G features Ascend Lite + Ascend Tiny with HUAWEI Da Vinci Architecture 2.0. This suggests robust AI performance, which can enhance various tasks such as photography and gaming. In contrast, the Dimensity 930 simply includes an NPU (Neural Processing Unit), which may not have the same level of advanced AI capabilities.

Lastly, the TDP (thermal design power) differs between the two processors. The Kirin 9000E 5G has a TDP of 6 Watts, while the Dimensity 930 has a TDP of 10 Watts. A lower TDP generally indicates better power efficiency, which can result in longer battery life and cooler operation.

In summary, the HiSilicon Kirin 9000E 5G offers faster CPU clock speeds, a more advanced lithography process, and potentially more robust AI capabilities. On the other hand, the MediaTek Dimensity 930 has a higher TDP, suggesting it may consume more power. Ultimately, the choice between the two processors depends on the specific requirements and priorities of the user.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
2x 2.2 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 6 nm
Number of transistors 15300 million
TDP 6 Watt 10 Watt
Neural Processing Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 NPU

Memory (RAM)

Max amount up to 16 GB up to 16 GB
Memory type LPDDR5 LPDDR5
Memory frequency 2750 MHz 3200 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 3.1 UFS 3.1

Graphics

GPU name Mali-G78 MP22 Imagination PowerVR BXM-8-256
GPU Architecture Valhall Rogue
GPU frequency 760 MHz 800 MHz
Execution units 22
Shaders 352
DirectX 12 12
OpenCL API 2.1 3.0
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 2520x1080@120Hz
Max camera resolution 1x 108MP, 1x 64MP
Max Video Capture 4K@60fps 2K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 2.77 Gbps
Peak Upload Speed 2.5 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.2 5.2
Satellite navigation BeiDou
GPS
Galileo
GLONASS
NavIC
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2020 October 2022 Quarter 3
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 9000E 5G
737022
Dimensity 930

GeekBench 6 Single-Core

Score
Kirin 9000E 5G
1059
Dimensity 930

GeekBench 6 Multi-Core

Score
Kirin 9000E 5G
3702
Dimensity 930