HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 930
The HiSilicon Kirin 9000E 5G and the MediaTek Dimensity 930 are both powerful processors, but they have some key differences in their specifications.
In terms of CPU cores and architecture, the Kirin 9000E 5G boasts a 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the Dimensity 930 features 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. While both processors have 8 cores, the Kirin 9000E 5G offers a higher clock speed on its Cortex-A77 cores, potentially resulting in faster performance.
In terms of lithography, the Kirin 9000E 5G uses a cutting-edge 5 nm process, which generally leads to improved power efficiency and performance compared to larger lithography nodes. The Dimensity 930, on the other hand, uses a 6 nm process, which is still impressive but slightly less advanced.
The number of transistors is also worth noting. The Kirin 9000E 5G has 15300 million transistors, which implies a denser and potentially more efficient chip design. The Dimensity 930's transistor count is not specified.
In terms of neural processing capabilities, the Kirin 9000E 5G features Ascend Lite + Ascend Tiny with HUAWEI Da Vinci Architecture 2.0. This suggests robust AI performance, which can enhance various tasks such as photography and gaming. In contrast, the Dimensity 930 simply includes an NPU (Neural Processing Unit), which may not have the same level of advanced AI capabilities.
Lastly, the TDP (thermal design power) differs between the two processors. The Kirin 9000E 5G has a TDP of 6 Watts, while the Dimensity 930 has a TDP of 10 Watts. A lower TDP generally indicates better power efficiency, which can result in longer battery life and cooler operation.
In summary, the HiSilicon Kirin 9000E 5G offers faster CPU clock speeds, a more advanced lithography process, and potentially more robust AI capabilities. On the other hand, the MediaTek Dimensity 930 has a higher TDP, suggesting it may consume more power. Ultimately, the choice between the two processors depends on the specific requirements and priorities of the user.
In terms of CPU cores and architecture, the Kirin 9000E 5G boasts a 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the Dimensity 930 features 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. While both processors have 8 cores, the Kirin 9000E 5G offers a higher clock speed on its Cortex-A77 cores, potentially resulting in faster performance.
In terms of lithography, the Kirin 9000E 5G uses a cutting-edge 5 nm process, which generally leads to improved power efficiency and performance compared to larger lithography nodes. The Dimensity 930, on the other hand, uses a 6 nm process, which is still impressive but slightly less advanced.
The number of transistors is also worth noting. The Kirin 9000E 5G has 15300 million transistors, which implies a denser and potentially more efficient chip design. The Dimensity 930's transistor count is not specified.
In terms of neural processing capabilities, the Kirin 9000E 5G features Ascend Lite + Ascend Tiny with HUAWEI Da Vinci Architecture 2.0. This suggests robust AI performance, which can enhance various tasks such as photography and gaming. In contrast, the Dimensity 930 simply includes an NPU (Neural Processing Unit), which may not have the same level of advanced AI capabilities.
Lastly, the TDP (thermal design power) differs between the two processors. The Kirin 9000E 5G has a TDP of 6 Watts, while the Dimensity 930 has a TDP of 10 Watts. A lower TDP generally indicates better power efficiency, which can result in longer battery life and cooler operation.
In summary, the HiSilicon Kirin 9000E 5G offers faster CPU clock speeds, a more advanced lithography process, and potentially more robust AI capabilities. On the other hand, the MediaTek Dimensity 930 has a higher TDP, suggesting it may consume more power. Ultimately, the choice between the two processors depends on the specific requirements and priorities of the user.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 2.2 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 6 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 16 GB |
Memory type | LPDDR5 | LPDDR5 |
Memory frequency | 2750 MHz | 3200 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 3.1 |
Graphics
GPU name | Mali-G78 MP22 | Imagination PowerVR BXM-8-256 |
GPU Architecture | Valhall | Rogue |
GPU frequency | 760 MHz | 800 MHz |
Execution units | 22 | |
Shaders | 352 | |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 3.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2520x1080@120Hz |
Max camera resolution | 1x 108MP, 1x 64MP | |
Max Video Capture | 4K@60fps | 2K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 2.5 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 October | 2022 Quarter 3 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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