HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 920
The HiSilicon Kirin 9000E 5G and MediaTek Dimensity 920 are both powerful processors, but they have some key differences in their specifications.
Starting with the CPU cores and architecture, the Kirin 9000E 5G features a 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This combination ensures a good balance between high performance and energy efficiency. On the other hand, the Dimensity 920 has 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores, providing a slightly higher clock speed for faster processing.
Both processors have 8 cores and support the ARMv8.2-A instruction set, which enables better application compatibility and performance optimization.
In terms of lithography, the Kirin 9000E 5G is built on a 5 nm process, which is more advanced and efficient compared to the Dimensity 920's 6 nm process. The smaller lithography allows for more transistors to be packed onto the chip, resulting in better overall performance. The Kirin 9000E 5G boasts 15.3 billion transistors, significantly more than the Dimensity 920.
Another important factor to consider is the Thermal Design Power (TDP), which indicates the maximum amount of heat that a processor can dissipate. The Kirin 9000E 5G has a TDP of 6 Watts, suggesting better power efficiency compared to the Dimensity 920's TDP of 10 Watts.
In terms of neural processing capabilities, the Kirin 9000E 5G incorporates the Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0, enabling efficient and powerful AI processing. Meanwhile, the Dimensity 920 features an NPU for neural processing.
In summary, the HiSilicon Kirin 9000E 5G and MediaTek Dimensity 920 are both formidable processors, but they differ in key areas. The Kirin 9000E 5G excels in terms of architecture, lithography, transistor count, power efficiency, and neural processing capabilities. Meanwhile, the Dimensity 920 offers a slightly higher clock speed. Ultimately, the choice between the two processors will depend on the specific requirements of the device and the intended use case.
Starting with the CPU cores and architecture, the Kirin 9000E 5G features a 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This combination ensures a good balance between high performance and energy efficiency. On the other hand, the Dimensity 920 has 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores, providing a slightly higher clock speed for faster processing.
Both processors have 8 cores and support the ARMv8.2-A instruction set, which enables better application compatibility and performance optimization.
In terms of lithography, the Kirin 9000E 5G is built on a 5 nm process, which is more advanced and efficient compared to the Dimensity 920's 6 nm process. The smaller lithography allows for more transistors to be packed onto the chip, resulting in better overall performance. The Kirin 9000E 5G boasts 15.3 billion transistors, significantly more than the Dimensity 920.
Another important factor to consider is the Thermal Design Power (TDP), which indicates the maximum amount of heat that a processor can dissipate. The Kirin 9000E 5G has a TDP of 6 Watts, suggesting better power efficiency compared to the Dimensity 920's TDP of 10 Watts.
In terms of neural processing capabilities, the Kirin 9000E 5G incorporates the Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0, enabling efficient and powerful AI processing. Meanwhile, the Dimensity 920 features an NPU for neural processing.
In summary, the HiSilicon Kirin 9000E 5G and MediaTek Dimensity 920 are both formidable processors, but they differ in key areas. The Kirin 9000E 5G excels in terms of architecture, lithography, transistor count, power efficiency, and neural processing capabilities. Meanwhile, the Dimensity 920 offers a slightly higher clock speed. Ultimately, the choice between the two processors will depend on the specific requirements of the device and the intended use case.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 2.5 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 6 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 16 GB |
Memory type | LPDDR5 | LPDDR5 |
Memory frequency | 2750 MHz | 3200 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 3.1 |
Graphics
GPU name | Mali-G78 MP22 | Mali-G68 MP4 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 760 MHz | 950 MHz |
Execution units | 22 | 4 |
Shaders | 352 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2520x1080@120Hz |
Max camera resolution | 1x 108MP, 2x 20MP | |
Max Video Capture | 4K@60fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 2.5 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 6 (802.11ax) |
Bluetooth | 5.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 October | 2021 Quarter 3 |
Partnumber | MT6877T | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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