HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 900
The HiSilicon Kirin 9000E 5G and MediaTek Dimensity 900 are two processors that offer high-performance capabilities. Let's compare their specifications to understand their differences and similarities.
Starting with the HiSilicon Kirin 9000E 5G, it has a powerful CPU architecture that includes 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This configuration allows for efficient multitasking and smooth performance across various applications. It utilizes the ARMv8.2-A instruction set and is fabricated on a 5 nm lithography. With 15300 million transistors, it ensures enhanced processing power and energy efficiency. The Kirin 9000E 5G has a Thermal Design Power (TDP) of 6 Watts, indicating a low power consumption. Additionally, it features Neural Processing capabilities with Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0, making it ideal for AI and machine learning tasks.
On the other hand, the MediaTek Dimensity 900 also offers a strong CPU architecture, consisting of 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This combination provides a balance between power and efficiency. Like the Kirin 9000E 5G, it employs the ARMv8.2-A instruction set but is manufactured on a slightly larger 6 nm lithography. With 10000 million transistors, it ensures a high level of performance and responsiveness. The Dimensity 900 has a TDP of 10 Watts, indicating a slightly higher power consumption compared to the Kirin 9000E 5G. As for Neural Processing, it features an NPU for AI-related tasks.
In summary, both processors offer impressive specifications and can handle demanding tasks effectively. The Kirin 9000E 5G stands out with its lower TDP and unique Neural Processing capabilities utilizing Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0. On the other hand, the Dimensity 900 excels in CPU clock speeds and boasts a sizeable number of transistors. Depending on specific requirements, users can choose between these two processors for their desired performance and power efficiency.
Starting with the HiSilicon Kirin 9000E 5G, it has a powerful CPU architecture that includes 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This configuration allows for efficient multitasking and smooth performance across various applications. It utilizes the ARMv8.2-A instruction set and is fabricated on a 5 nm lithography. With 15300 million transistors, it ensures enhanced processing power and energy efficiency. The Kirin 9000E 5G has a Thermal Design Power (TDP) of 6 Watts, indicating a low power consumption. Additionally, it features Neural Processing capabilities with Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0, making it ideal for AI and machine learning tasks.
On the other hand, the MediaTek Dimensity 900 also offers a strong CPU architecture, consisting of 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This combination provides a balance between power and efficiency. Like the Kirin 9000E 5G, it employs the ARMv8.2-A instruction set but is manufactured on a slightly larger 6 nm lithography. With 10000 million transistors, it ensures a high level of performance and responsiveness. The Dimensity 900 has a TDP of 10 Watts, indicating a slightly higher power consumption compared to the Kirin 9000E 5G. As for Neural Processing, it features an NPU for AI-related tasks.
In summary, both processors offer impressive specifications and can handle demanding tasks effectively. The Kirin 9000E 5G stands out with its lower TDP and unique Neural Processing capabilities utilizing Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0. On the other hand, the Dimensity 900 excels in CPU clock speeds and boasts a sizeable number of transistors. Depending on specific requirements, users can choose between these two processors for their desired performance and power efficiency.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 6 nm |
Number of transistors | 15300 million | 10000 million |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 16 GB |
Memory type | LPDDR5 | LPDDR5 |
Memory frequency | 2750 MHz | 3200 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 3.1 |
Graphics
GPU name | Mali-G78 MP22 | Mali-G68 MP4 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 760 MHz | 900 MHz |
Execution units | 22 | 4 |
Shaders | 352 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2520x1080@120Hz |
Max camera resolution | 1x 108MP, 2x 20MP | |
Max Video Capture | 4K@60fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 2.5 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 6 (802.11ax) |
Bluetooth | 5.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 October | 2021 Quarter 1 |
Partnumber | MT6877 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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