HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 820
The HiSilicon Kirin 9000E 5G and MediaTek Dimensity 820 are two powerful processors that are designed to enhance the performance of mobile devices.
Starting with the HiSilicon Kirin 9000E 5G, it boasts an advanced architecture consisting of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. With a total of eight cores, this processor ensures efficient multitasking and smooth operation. It operates on the ARMv8.2-A instruction set and incorporates Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0 for enhanced neural processing capabilities. Additionally, the impressive 5 nm lithography and 15300 million transistors contribute to improved power efficiency and overall performance. With a TDP of just 6 Watts, it offers excellent energy efficiency.
On the other hand, the MediaTek Dimensity 820 exhibits its own set of impressive specifications. Its architecture consists of 4x 2.6 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. Like the HiSilicon Kirin 9000E 5G, it operates on the ARMv8.2-A instruction set, ensuring compatibility with various software. The Dimensity 820 employs a 7 nm lithography, providing a balance between power efficiency and performance. Additionally, it features an NPU for efficient neural processing. However, the TDP of the Dimensity 820 is higher, at 10 Watts.
In summary, both the HiSilicon Kirin 9000E 5G and MediaTek Dimensity 820 processors offer impressive specifications and advanced features. The Kirin 9000E 5G stands out with its diverse core architecture, advanced neural processing capabilities, and lower TDP. On the other hand, the Dimensity 820 offers a balanced performance with its powerful CPU cores, efficient neural processing unit, and slightly higher power consumption. The choice between these processors depends on the specific requirements and priorities of the device manufacturer and its intended users.
Starting with the HiSilicon Kirin 9000E 5G, it boasts an advanced architecture consisting of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. With a total of eight cores, this processor ensures efficient multitasking and smooth operation. It operates on the ARMv8.2-A instruction set and incorporates Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0 for enhanced neural processing capabilities. Additionally, the impressive 5 nm lithography and 15300 million transistors contribute to improved power efficiency and overall performance. With a TDP of just 6 Watts, it offers excellent energy efficiency.
On the other hand, the MediaTek Dimensity 820 exhibits its own set of impressive specifications. Its architecture consists of 4x 2.6 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. Like the HiSilicon Kirin 9000E 5G, it operates on the ARMv8.2-A instruction set, ensuring compatibility with various software. The Dimensity 820 employs a 7 nm lithography, providing a balance between power efficiency and performance. Additionally, it features an NPU for efficient neural processing. However, the TDP of the Dimensity 820 is higher, at 10 Watts.
In summary, both the HiSilicon Kirin 9000E 5G and MediaTek Dimensity 820 processors offer impressive specifications and advanced features. The Kirin 9000E 5G stands out with its diverse core architecture, advanced neural processing capabilities, and lower TDP. On the other hand, the Dimensity 820 offers a balanced performance with its powerful CPU cores, efficient neural processing unit, and slightly higher power consumption. The choice between these processors depends on the specific requirements and priorities of the device manufacturer and its intended users.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
4x 2.6 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 7 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 16 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.2 |
Graphics
GPU name | Mali-G78 MP22 | Mali-G57 MP5 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 760 MHz | 650 MHz |
Execution units | 22 | 5 |
Shaders | 352 | 80 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2520x1080@120Hz |
Max camera resolution | 1x 80MP, 1x 32MP + 1x 16MP | |
Max Video Capture | 4K@60fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 2.5 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2020 October | 2020 May |
Partnumber | MT6875 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Dimensity 800U vs MediaTek Helio P65
2
Qualcomm Snapdragon 678 vs MediaTek Helio P60
3
Qualcomm Snapdragon 690 vs Qualcomm Snapdragon 870
4
MediaTek Dimensity 1000L vs Unisoc Tiger T612
5
MediaTek Helio G80 vs Qualcomm Snapdragon 712
6
Qualcomm Snapdragon 835 vs Qualcomm Snapdragon 732G
7
Qualcomm Snapdragon 782G vs Qualcomm Snapdragon 888
8
Unisoc Tiger T710 vs Qualcomm Snapdragon 4 Gen 1
9
HiSilicon Kirin 710F vs Google Tensor G2
10
MediaTek Helio G25 vs MediaTek Dimensity 1100