HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 820

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The HiSilicon Kirin 9000E 5G and MediaTek Dimensity 820 are two powerful processors that are designed to enhance the performance of mobile devices.

Starting with the HiSilicon Kirin 9000E 5G, it boasts an advanced architecture consisting of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. With a total of eight cores, this processor ensures efficient multitasking and smooth operation. It operates on the ARMv8.2-A instruction set and incorporates Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0 for enhanced neural processing capabilities. Additionally, the impressive 5 nm lithography and 15300 million transistors contribute to improved power efficiency and overall performance. With a TDP of just 6 Watts, it offers excellent energy efficiency.

On the other hand, the MediaTek Dimensity 820 exhibits its own set of impressive specifications. Its architecture consists of 4x 2.6 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. Like the HiSilicon Kirin 9000E 5G, it operates on the ARMv8.2-A instruction set, ensuring compatibility with various software. The Dimensity 820 employs a 7 nm lithography, providing a balance between power efficiency and performance. Additionally, it features an NPU for efficient neural processing. However, the TDP of the Dimensity 820 is higher, at 10 Watts.

In summary, both the HiSilicon Kirin 9000E 5G and MediaTek Dimensity 820 processors offer impressive specifications and advanced features. The Kirin 9000E 5G stands out with its diverse core architecture, advanced neural processing capabilities, and lower TDP. On the other hand, the Dimensity 820 offers a balanced performance with its powerful CPU cores, efficient neural processing unit, and slightly higher power consumption. The choice between these processors depends on the specific requirements and priorities of the device manufacturer and its intended users.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
4x 2.6 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 7 nm
Number of transistors 15300 million
TDP 6 Watt 10 Watt
Neural Processing Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 NPU

Memory (RAM)

Max amount up to 16 GB up to 16 GB
Memory type LPDDR5 LPDDR4X
Memory frequency 2750 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 3.1 UFS 2.2

Graphics

GPU name Mali-G78 MP22 Mali-G57 MP5
GPU Architecture Valhall Valhall
GPU frequency 760 MHz 650 MHz
Execution units 22 5
Shaders 352 80
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 2520x1080@120Hz
Max camera resolution 1x 80MP, 1x 32MP + 1x 16MP
Max Video Capture 4K@60fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 2.77 Gbps
Peak Upload Speed 2.5 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
NavIC
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2020 October 2020 May
Partnumber MT6875
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 9000E 5G
737022
Dimensity 820
403227

GeekBench 6 Single-Core

Score
Kirin 9000E 5G
1059
Dimensity 820
615

GeekBench 6 Multi-Core

Score
Kirin 9000E 5G
3702
Dimensity 820
1924