HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 810
The HiSilicon Kirin 9000E 5G and MediaTek Dimensity 810 are two processors that offer impressive specifications in terms of their performance and power efficiency.
Starting with the HiSilicon Kirin 9000E 5G, it features a powerful combination of CPU cores and architecture. It consists of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores, offering a total of 8 cores. With an ARMv8.2-A instruction set, this processor is designed to deliver high-performance computing. The Kirin 9000E 5G also boasts a 5 nm lithography, making it highly efficient in terms of power consumption. With 15300 million transistors, it provides robust processing capabilities. Additionally, it comes with Ascend Lite and Ascend Tiny for neural processing, utilizing the advanced HUAWEI Da Vinci Architecture 2.0.
On the other hand, the MediaTek Dimensity 810 is no slouch either. It features an architecture consisting of 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores, totaling 8 cores. The inclusion of the Cortex-A76 cores ensures faster performance for demanding tasks. Like the Kirin 9000E 5G, it also operates on the ARMv8.2-A instruction set. However, it has a slightly larger 6 nm lithography, but still retains good power efficiency. With 12000 million transistors, it delivers reliable processing power. It also includes an NPU for neural processing, ensuring improved AI capabilities.
In terms of power consumption, the Kirin 9000E 5G has a lower TDP (thermal design power) of 6 Watts, making it more energy-efficient compared to the Dimensity 810, which has a TDP of 8 Watts. This could be an important factor to consider for users who prioritize battery life.
Both processors offer excellent specifications, with the Kirin 9000E 5G showcasing its strength in the CPU architecture and the Dimensity 810 providing a strong combination of CPU cores. Ultimately, the choice between these processors would depend on the specific requirements and preferences of the users, such as their desired level of power efficiency and AI capabilities.
Starting with the HiSilicon Kirin 9000E 5G, it features a powerful combination of CPU cores and architecture. It consists of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores, offering a total of 8 cores. With an ARMv8.2-A instruction set, this processor is designed to deliver high-performance computing. The Kirin 9000E 5G also boasts a 5 nm lithography, making it highly efficient in terms of power consumption. With 15300 million transistors, it provides robust processing capabilities. Additionally, it comes with Ascend Lite and Ascend Tiny for neural processing, utilizing the advanced HUAWEI Da Vinci Architecture 2.0.
On the other hand, the MediaTek Dimensity 810 is no slouch either. It features an architecture consisting of 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores, totaling 8 cores. The inclusion of the Cortex-A76 cores ensures faster performance for demanding tasks. Like the Kirin 9000E 5G, it also operates on the ARMv8.2-A instruction set. However, it has a slightly larger 6 nm lithography, but still retains good power efficiency. With 12000 million transistors, it delivers reliable processing power. It also includes an NPU for neural processing, ensuring improved AI capabilities.
In terms of power consumption, the Kirin 9000E 5G has a lower TDP (thermal design power) of 6 Watts, making it more energy-efficient compared to the Dimensity 810, which has a TDP of 8 Watts. This could be an important factor to consider for users who prioritize battery life.
Both processors offer excellent specifications, with the Kirin 9000E 5G showcasing its strength in the CPU architecture and the Dimensity 810 providing a strong combination of CPU cores. Ultimately, the choice between these processors would depend on the specific requirements and preferences of the users, such as their desired level of power efficiency and AI capabilities.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 6 nm |
Number of transistors | 15300 million | 12000 million |
TDP | 6 Watt | 8 Watt |
Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 12 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.2 |
Graphics
GPU name | Mali-G78 MP22 | Mali-G57 MP2 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 760 MHz | 950 MHz |
Execution units | 22 | 2 |
Shaders | 352 | 32 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2520x1080@120Hz |
Max camera resolution | 1x 64MP, 2x 16MP | |
Max Video Capture | 4K@60fps | 2K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 2.5 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2020 October | 2021 Quarter 3 |
Partnumber | MT6833V/PNZA, MT6833P | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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