HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 810

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The HiSilicon Kirin 9000E 5G and MediaTek Dimensity 810 are two processors that offer impressive specifications in terms of their performance and power efficiency.

Starting with the HiSilicon Kirin 9000E 5G, it features a powerful combination of CPU cores and architecture. It consists of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores, offering a total of 8 cores. With an ARMv8.2-A instruction set, this processor is designed to deliver high-performance computing. The Kirin 9000E 5G also boasts a 5 nm lithography, making it highly efficient in terms of power consumption. With 15300 million transistors, it provides robust processing capabilities. Additionally, it comes with Ascend Lite and Ascend Tiny for neural processing, utilizing the advanced HUAWEI Da Vinci Architecture 2.0.

On the other hand, the MediaTek Dimensity 810 is no slouch either. It features an architecture consisting of 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores, totaling 8 cores. The inclusion of the Cortex-A76 cores ensures faster performance for demanding tasks. Like the Kirin 9000E 5G, it also operates on the ARMv8.2-A instruction set. However, it has a slightly larger 6 nm lithography, but still retains good power efficiency. With 12000 million transistors, it delivers reliable processing power. It also includes an NPU for neural processing, ensuring improved AI capabilities.

In terms of power consumption, the Kirin 9000E 5G has a lower TDP (thermal design power) of 6 Watts, making it more energy-efficient compared to the Dimensity 810, which has a TDP of 8 Watts. This could be an important factor to consider for users who prioritize battery life.

Both processors offer excellent specifications, with the Kirin 9000E 5G showcasing its strength in the CPU architecture and the Dimensity 810 providing a strong combination of CPU cores. Ultimately, the choice between these processors would depend on the specific requirements and preferences of the users, such as their desired level of power efficiency and AI capabilities.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
2x 2.4 GHz – Cortex-A76
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 6 nm
Number of transistors 15300 million 12000 million
TDP 6 Watt 8 Watt
Neural Processing Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 NPU

Memory (RAM)

Max amount up to 16 GB up to 12 GB
Memory type LPDDR5 LPDDR4X
Memory frequency 2750 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 3.1 UFS 2.2

Graphics

GPU name Mali-G78 MP22 Mali-G57 MP2
GPU Architecture Valhall Valhall
GPU frequency 760 MHz 950 MHz
Execution units 22 2
Shaders 352 32
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 2520x1080@120Hz
Max camera resolution 1x 64MP, 2x 16MP
Max Video Capture 4K@60fps 2K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 2.77 Gbps
Peak Upload Speed 2.5 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
NavIC
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2020 October 2021 Quarter 3
Partnumber MT6833V/PNZA, MT6833P
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 9000E 5G
737022
Dimensity 810
356915

GeekBench 6 Single-Core

Score
Kirin 9000E 5G
1059
Dimensity 810
584

GeekBench 6 Multi-Core

Score
Kirin 9000E 5G
3702
Dimensity 810
1662