HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 800U

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The HiSilicon Kirin 9000E 5G and the MediaTek Dimensity 800U are two processors that cater to different market segments but offer impressive specifications and performance.

Starting with the HiSilicon Kirin 9000E 5G, it boasts an impressive architecture consisting of 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. This combination provides a balance of high performance and power efficiency. With a lithography of 5 nm, it showcases advanced manufacturing technology that contributes to a lower power consumption. Additionally, the Kirin 9000E incorporates HUAWEI Da Vinci Architecture 2.0 and Ascend Lite + Ascend Tiny neural processing for enhanced artificial intelligence capabilities. Its 6 Watt thermal design power (TDP) makes it an energy-efficient choice.

On the other hand, the MediaTek Dimensity 800U offers a slightly different configuration. Its architecture consists of 2x 2.4 GHz Cortex-A76 and 6x 2.0 GHz Cortex-A55 cores, providing a balance between performance and power usage. With a lithography of 7 nm, it may not offer the same level of power efficiency as the Kirin 9000E but still provides satisfactory performance. It also includes a neural processing unit (NPU) for AI-related tasks.

In terms of performance, both processors have eight cores and follow the ARMv8.2-A instruction set. However, the Kirin 9000E's higher clock speeds and advanced AI capabilities give it an edge in certain applications. On the other hand, the Dimensity 800U's quality performance and NPU contribute to a smooth user experience.

Ultimately, the choice between these two processors depends on individual requirements and preferences. The HiSilicon Kirin 9000E 5G offers higher clock speeds, advanced AI capabilities, and a more efficient lithography. Meanwhile, the MediaTek Dimensity 800U provides a balance between performance and power efficiency, making it suitable for mid-range devices.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
2x 2.4 GHz – Cortex-A76
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 7 nm
Number of transistors 15300 million
TDP 6 Watt
Neural Processing Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 NPU

Memory (RAM)

Max amount up to 16 GB up to 12 GB
Memory type LPDDR5 LPDDR4X
Memory frequency 2750 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 3.1 UFS 2.2

Graphics

GPU name Mali-G78 MP22 Mali-G57 MP3
GPU Architecture Valhall Valhall
GPU frequency 760 MHz 850 MHz
Execution units 22 3
Shaders 352 48
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 2520x1080@120Hz
Max camera resolution 1x 64MP, 1x 20MP + 1x 16MP
Max Video Capture 4K@60fps 4K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 2.77 Gbps
Peak Upload Speed 2.5 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
NavIC
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2020 October 2020 Quarter 3
Partnumber MT6853V, MT6853V/TNZA, MT6853/TNZA, MT6853T
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 9000E 5G
737022
Dimensity 800U
401197

GeekBench 6 Single-Core

Score
Kirin 9000E 5G
1059
Dimensity 800U
614

GeekBench 6 Multi-Core

Score
Kirin 9000E 5G
3702
Dimensity 800U
1821