HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 800U
The HiSilicon Kirin 9000E 5G and the MediaTek Dimensity 800U are two processors that cater to different market segments but offer impressive specifications and performance.
Starting with the HiSilicon Kirin 9000E 5G, it boasts an impressive architecture consisting of 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. This combination provides a balance of high performance and power efficiency. With a lithography of 5 nm, it showcases advanced manufacturing technology that contributes to a lower power consumption. Additionally, the Kirin 9000E incorporates HUAWEI Da Vinci Architecture 2.0 and Ascend Lite + Ascend Tiny neural processing for enhanced artificial intelligence capabilities. Its 6 Watt thermal design power (TDP) makes it an energy-efficient choice.
On the other hand, the MediaTek Dimensity 800U offers a slightly different configuration. Its architecture consists of 2x 2.4 GHz Cortex-A76 and 6x 2.0 GHz Cortex-A55 cores, providing a balance between performance and power usage. With a lithography of 7 nm, it may not offer the same level of power efficiency as the Kirin 9000E but still provides satisfactory performance. It also includes a neural processing unit (NPU) for AI-related tasks.
In terms of performance, both processors have eight cores and follow the ARMv8.2-A instruction set. However, the Kirin 9000E's higher clock speeds and advanced AI capabilities give it an edge in certain applications. On the other hand, the Dimensity 800U's quality performance and NPU contribute to a smooth user experience.
Ultimately, the choice between these two processors depends on individual requirements and preferences. The HiSilicon Kirin 9000E 5G offers higher clock speeds, advanced AI capabilities, and a more efficient lithography. Meanwhile, the MediaTek Dimensity 800U provides a balance between performance and power efficiency, making it suitable for mid-range devices.
Starting with the HiSilicon Kirin 9000E 5G, it boasts an impressive architecture consisting of 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. This combination provides a balance of high performance and power efficiency. With a lithography of 5 nm, it showcases advanced manufacturing technology that contributes to a lower power consumption. Additionally, the Kirin 9000E incorporates HUAWEI Da Vinci Architecture 2.0 and Ascend Lite + Ascend Tiny neural processing for enhanced artificial intelligence capabilities. Its 6 Watt thermal design power (TDP) makes it an energy-efficient choice.
On the other hand, the MediaTek Dimensity 800U offers a slightly different configuration. Its architecture consists of 2x 2.4 GHz Cortex-A76 and 6x 2.0 GHz Cortex-A55 cores, providing a balance between performance and power usage. With a lithography of 7 nm, it may not offer the same level of power efficiency as the Kirin 9000E but still provides satisfactory performance. It also includes a neural processing unit (NPU) for AI-related tasks.
In terms of performance, both processors have eight cores and follow the ARMv8.2-A instruction set. However, the Kirin 9000E's higher clock speeds and advanced AI capabilities give it an edge in certain applications. On the other hand, the Dimensity 800U's quality performance and NPU contribute to a smooth user experience.
Ultimately, the choice between these two processors depends on individual requirements and preferences. The HiSilicon Kirin 9000E 5G offers higher clock speeds, advanced AI capabilities, and a more efficient lithography. Meanwhile, the MediaTek Dimensity 800U provides a balance between performance and power efficiency, making it suitable for mid-range devices.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 7 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | |
Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 12 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.2 |
Graphics
GPU name | Mali-G78 MP22 | Mali-G57 MP3 |
GPU Architecture | Mali Valhall | Mali Valhall |
GPU frequency | 760 MHz | 850 MHz |
Execution units | 22 | 3 |
Shaders | 352 | 48 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2520x1080@120Hz |
Max camera resolution | 1x 64MP, 1x 20MP + 1x 16MP | |
Max Video Capture | 4K@60fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 2.5 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2020 October | 2020 Quarter 3 |
Partnumber | MT6853V, MT6853V/TNZA, MT6853/TNZA, MT6853T | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
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