HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 800

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The HiSilicon Kirin 9000E 5G and the MediaTek Dimensity 800 are both powerful processors designed for mobile devices. However, they differ in several key specifications.

In terms of CPU cores and architecture, the HiSilicon Kirin 9000E 5G utilizes a more advanced configuration. It consists of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 800 features a simpler configuration with 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. While the HiSilicon Kirin 9000E 5G has more diverse cores at higher clock speeds, the MediaTek Dimensity 800 focuses on delivering balanced performance.

In terms of lithography, the HiSilicon Kirin 9000E 5G boasts a more advanced 5 nm manufacturing process compared to the MediaTek Dimensity 800's 7 nm process. A smaller lithography generally leads to better power efficiency and improved overall performance.

The HiSilicon Kirin 9000E 5G also has a significantly higher number of transistors at 15300 million, indicating a more intricate and powerful design. In comparison, the MediaTek Dimensity 800 has a lower transistor count, suggesting a less complex architecture.

In terms of thermal design power (TDP), the HiSilicon Kirin 9000E 5G consumes only 6 Watts, while the MediaTek Dimensity 800 has a TDP of 10 Watts. A lower TDP generally indicates better power efficiency and reduced heat generation.

Lastly, the HiSilicon Kirin 9000E 5G incorporates Ascend Lite and Ascend Tiny neural processing units, as well as the HUAWEI Da Vinci Architecture 2.0. This allows for efficient and advanced neural processing capabilities. On the other hand, the MediaTek Dimensity 800 features its own neural processing unit (NPU), enabling AI processing tasks.

In summary, the HiSilicon Kirin 9000E 5G offers a more advanced and diverse CPU core configuration, a smaller lithography, higher transistor count, lower TDP, and enhanced neural processing capabilities compared to the MediaTek Dimensity 800. However, the MediaTek Dimensity 800 still provides a balanced performance and an integrated NPU for efficient AI processing. The choice between the two processors ultimately depends on the specific requirements and priorities of the mobile device.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
4x 2.0 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 4
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 7 nm
Number of transistors 15300 million
TDP 6 Watt 10 Watt
Neural Processing Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 NPU

Memory (RAM)

Max amount up to 16 GB up to 16 GB
Memory type LPDDR5 LPDDR4X
Memory frequency 2750 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 3.1 UFS 2.2

Graphics

GPU name Mali-G78 MP22 Mali-G57 MP4
GPU Architecture Valhall Valhall
GPU frequency 760 MHz 650 MHz
Execution units 22 4
Shaders 352 64
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 2520x1080@120Hz
Max camera resolution 1x 80MP, 1x 32MP + 1x 16MP
Max Video Capture 4K@60fps 4K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 2.77 Gbps
Peak Upload Speed 2.5 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
NavIC
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2020 October 2020 Quarter 2
Partnumber MT6873, MT6873V
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 9000E 5G
737022
Dimensity 800
325654

GeekBench 6 Single-Core

Score
Kirin 9000E 5G
1059
Dimensity 800
514

GeekBench 6 Multi-Core

Score
Kirin 9000E 5G
3702
Dimensity 800
1882