HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 800
The HiSilicon Kirin 9000E 5G and the MediaTek Dimensity 800 are both powerful processors designed for mobile devices. However, they differ in several key specifications.
In terms of CPU cores and architecture, the HiSilicon Kirin 9000E 5G utilizes a more advanced configuration. It consists of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 800 features a simpler configuration with 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. While the HiSilicon Kirin 9000E 5G has more diverse cores at higher clock speeds, the MediaTek Dimensity 800 focuses on delivering balanced performance.
In terms of lithography, the HiSilicon Kirin 9000E 5G boasts a more advanced 5 nm manufacturing process compared to the MediaTek Dimensity 800's 7 nm process. A smaller lithography generally leads to better power efficiency and improved overall performance.
The HiSilicon Kirin 9000E 5G also has a significantly higher number of transistors at 15300 million, indicating a more intricate and powerful design. In comparison, the MediaTek Dimensity 800 has a lower transistor count, suggesting a less complex architecture.
In terms of thermal design power (TDP), the HiSilicon Kirin 9000E 5G consumes only 6 Watts, while the MediaTek Dimensity 800 has a TDP of 10 Watts. A lower TDP generally indicates better power efficiency and reduced heat generation.
Lastly, the HiSilicon Kirin 9000E 5G incorporates Ascend Lite and Ascend Tiny neural processing units, as well as the HUAWEI Da Vinci Architecture 2.0. This allows for efficient and advanced neural processing capabilities. On the other hand, the MediaTek Dimensity 800 features its own neural processing unit (NPU), enabling AI processing tasks.
In summary, the HiSilicon Kirin 9000E 5G offers a more advanced and diverse CPU core configuration, a smaller lithography, higher transistor count, lower TDP, and enhanced neural processing capabilities compared to the MediaTek Dimensity 800. However, the MediaTek Dimensity 800 still provides a balanced performance and an integrated NPU for efficient AI processing. The choice between the two processors ultimately depends on the specific requirements and priorities of the mobile device.
In terms of CPU cores and architecture, the HiSilicon Kirin 9000E 5G utilizes a more advanced configuration. It consists of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 800 features a simpler configuration with 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. While the HiSilicon Kirin 9000E 5G has more diverse cores at higher clock speeds, the MediaTek Dimensity 800 focuses on delivering balanced performance.
In terms of lithography, the HiSilicon Kirin 9000E 5G boasts a more advanced 5 nm manufacturing process compared to the MediaTek Dimensity 800's 7 nm process. A smaller lithography generally leads to better power efficiency and improved overall performance.
The HiSilicon Kirin 9000E 5G also has a significantly higher number of transistors at 15300 million, indicating a more intricate and powerful design. In comparison, the MediaTek Dimensity 800 has a lower transistor count, suggesting a less complex architecture.
In terms of thermal design power (TDP), the HiSilicon Kirin 9000E 5G consumes only 6 Watts, while the MediaTek Dimensity 800 has a TDP of 10 Watts. A lower TDP generally indicates better power efficiency and reduced heat generation.
Lastly, the HiSilicon Kirin 9000E 5G incorporates Ascend Lite and Ascend Tiny neural processing units, as well as the HUAWEI Da Vinci Architecture 2.0. This allows for efficient and advanced neural processing capabilities. On the other hand, the MediaTek Dimensity 800 features its own neural processing unit (NPU), enabling AI processing tasks.
In summary, the HiSilicon Kirin 9000E 5G offers a more advanced and diverse CPU core configuration, a smaller lithography, higher transistor count, lower TDP, and enhanced neural processing capabilities compared to the MediaTek Dimensity 800. However, the MediaTek Dimensity 800 still provides a balanced performance and an integrated NPU for efficient AI processing. The choice between the two processors ultimately depends on the specific requirements and priorities of the mobile device.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
4x 2.0 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 7 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 16 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.2 |
Graphics
GPU name | Mali-G78 MP22 | Mali-G57 MP4 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 760 MHz | 650 MHz |
Execution units | 22 | 4 |
Shaders | 352 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2520x1080@120Hz |
Max camera resolution | 1x 80MP, 1x 32MP + 1x 16MP | |
Max Video Capture | 4K@60fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 2.5 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2020 October | 2020 Quarter 2 |
Partnumber | MT6873, MT6873V | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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