HiSilicon Kirin 9000 5G vs Unisoc Tiger T612
When comparing the specifications of the HiSilicon Kirin 9000 5G and Unisoc Tiger T612 processors, several differences stand out.
In terms of CPU cores and architecture, the HiSilicon Kirin 9000 5G boasts a more advanced configuration. It includes 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the Unisoc Tiger T612 features 2x 1.8 GHz Cortex-A75 and 6x 1.8 GHz Cortex-A55 cores. While the Kirin 9000 5G utilizes a combination of high-performance and power-efficient cores, the Tiger T612 relies more heavily on power-efficient cores.
Moreover, the Kirin 9000 5G is built on a more advanced lithography process at 5 nm, compared to the Tiger T612's 12 nm lithography. The smaller lithography is generally considered more advantageous as it allows for improved power efficiency and better performance.
In terms of instruction set, both processors share the ARMv8.2-A architecture, indicating a similar level of compatibility and support for various applications.
In terms of power consumption, the HiSilicon Kirin 9000 5G has a lower thermal design power (TDP) rating of 6 Watts, while the Unisoc Tiger T612 has a TDP of 10 Watts. A lower TDP generally indicates better power efficiency.
Furthermore, the Kirin 9000 5G incorporates Huawei's Da Vinci Architecture 2.0 and neural processing technology with Ascend Lite and Ascend Tiny cores. While the specific capabilities and benefits of this technology are not outlined here, it showcases the Kirin 9000 5G's focus on advanced artificial intelligence and machine learning processing.
In summary, the HiSilicon Kirin 9000 5G surpasses the Unisoc Tiger T612 in terms of CPU architecture, lithography, and power efficiency. However, it's important to note that overall processor performance cannot be determined solely by these specifications, as real-world performance is influenced by many other factors, including software optimization and user experience.
In terms of CPU cores and architecture, the HiSilicon Kirin 9000 5G boasts a more advanced configuration. It includes 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the Unisoc Tiger T612 features 2x 1.8 GHz Cortex-A75 and 6x 1.8 GHz Cortex-A55 cores. While the Kirin 9000 5G utilizes a combination of high-performance and power-efficient cores, the Tiger T612 relies more heavily on power-efficient cores.
Moreover, the Kirin 9000 5G is built on a more advanced lithography process at 5 nm, compared to the Tiger T612's 12 nm lithography. The smaller lithography is generally considered more advantageous as it allows for improved power efficiency and better performance.
In terms of instruction set, both processors share the ARMv8.2-A architecture, indicating a similar level of compatibility and support for various applications.
In terms of power consumption, the HiSilicon Kirin 9000 5G has a lower thermal design power (TDP) rating of 6 Watts, while the Unisoc Tiger T612 has a TDP of 10 Watts. A lower TDP generally indicates better power efficiency.
Furthermore, the Kirin 9000 5G incorporates Huawei's Da Vinci Architecture 2.0 and neural processing technology with Ascend Lite and Ascend Tiny cores. While the specific capabilities and benefits of this technology are not outlined here, it showcases the Kirin 9000 5G's focus on advanced artificial intelligence and machine learning processing.
In summary, the HiSilicon Kirin 9000 5G surpasses the Unisoc Tiger T612 in terms of CPU architecture, lithography, and power efficiency. However, it's important to note that overall processor performance cannot be determined solely by these specifications, as real-world performance is influenced by many other factors, including software optimization and user experience.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 12 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 16 GB | up to 8 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 1600 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.2 |
Graphics
GPU name | Mali-G78 MP24 | Mali-G57 MP1 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 760 MHz | 650 MHz |
Execution units | 24 | 1 |
Shaders | 384 | 16 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2400x1080 |
Max camera resolution | 1x 50MP | |
Max Video Capture | 4K@60fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 2.5 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 October | 2022 January |
Partnumber | T612 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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