HiSilicon Kirin 9000 5G vs Unisoc Tiger T606
When comparing the HiSilicon Kirin 9000 5G and Unisoc Tiger T606 processors by their specifications, several key differences emerge.
In terms of CPU cores and architecture, the Kirin 9000 5G boasts a more advanced design. It features 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the Tiger T606 has 2x 1.6 GHz Cortex-A75 cores and 6x 1.6 GHz Cortex-A55 cores. The Kirin processor presents a more diverse and higher clock speed range, potentially offering superior performance.
Regarding the lithography process, the Kirin 9000 5G has a smaller 5 nm fabrication, while the Tiger T606 employs a 12 nm lithography. Smaller fabrication nodes generally result in more power-efficient and faster processors. With its 5 nm manufacturing process, the Kirin processor is expected to consume less power and deliver better overall efficiency.
The Kirin 9000 5G also stands out with a higher number of transistors, boasting 15,300 million compared to the Tiger T606's unspecified transistor count. A higher number of transistors generally indicates a more powerful and capable processor, allowing for better performance and multitasking capabilities.
Additionally, the instruction set and core architecture of both processors are the same, being ARMv8.2-A. This ensures compatibility and familiarity for developers and users alike.
However, one area where the Tiger T606 surpasses the Kirin 9000 5G is in its thermal design power (TDP). The TDP of the Tiger T606 is 10 Watts, whereas the Kirin 9000 5G has a lower TDP of 6 Watts. A lower TDP generally indicates greater power efficiency and potentially better heat management.
In conclusion, the HiSilicon Kirin 9000 5G and Unisoc Tiger T606 processors have their strengths and weaknesses. The Kirin processor offers more advanced architecture, smaller lithography, a higher number of transistors, and a lower TDP. On the other hand, the Tiger T606 may offer a more power-efficient solution. Ultimately, the choice between the two processors depends on the specific requirements and priorities of the intended use-case.
In terms of CPU cores and architecture, the Kirin 9000 5G boasts a more advanced design. It features 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the Tiger T606 has 2x 1.6 GHz Cortex-A75 cores and 6x 1.6 GHz Cortex-A55 cores. The Kirin processor presents a more diverse and higher clock speed range, potentially offering superior performance.
Regarding the lithography process, the Kirin 9000 5G has a smaller 5 nm fabrication, while the Tiger T606 employs a 12 nm lithography. Smaller fabrication nodes generally result in more power-efficient and faster processors. With its 5 nm manufacturing process, the Kirin processor is expected to consume less power and deliver better overall efficiency.
The Kirin 9000 5G also stands out with a higher number of transistors, boasting 15,300 million compared to the Tiger T606's unspecified transistor count. A higher number of transistors generally indicates a more powerful and capable processor, allowing for better performance and multitasking capabilities.
Additionally, the instruction set and core architecture of both processors are the same, being ARMv8.2-A. This ensures compatibility and familiarity for developers and users alike.
However, one area where the Tiger T606 surpasses the Kirin 9000 5G is in its thermal design power (TDP). The TDP of the Tiger T606 is 10 Watts, whereas the Kirin 9000 5G has a lower TDP of 6 Watts. A lower TDP generally indicates greater power efficiency and potentially better heat management.
In conclusion, the HiSilicon Kirin 9000 5G and Unisoc Tiger T606 processors have their strengths and weaknesses. The Kirin processor offers more advanced architecture, smaller lithography, a higher number of transistors, and a lower TDP. On the other hand, the Tiger T606 may offer a more power-efficient solution. Ultimately, the choice between the two processors depends on the specific requirements and priorities of the intended use-case.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 1.6 GHz – Cortex-A75 6x 1.6 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 12 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 16 GB | up to 8 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 1600 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.1 |
Graphics
GPU name | Mali-G78 MP24 | Mali-G57 MP1 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 760 MHz | 650 MHz |
Execution units | 24 | 1 |
Shaders | 384 | 16 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 1600x900@90Hz |
Max camera resolution | 1x 24MP, 16MP + 8MP | |
Max Video Capture | 4K@60fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 2.5 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 October | 2021 October |
Partnumber | T606 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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